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Nokia公司生產Flexi MultiRadio 10基地台TDD LTE FSIH基頻單位

Nokia Flexi MultiRadio 10 Base Station TDD LTE Baseband Unit, Model FSIH, P/N 472567A.101

出版商 EJL Wireless Research 商品編碼 897591
出版日期 內容資訊 英文 48 Pages, 47 Exhibits, 8 Tables
商品交期: 最快1-2個工作天內
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Nokia公司生產Flexi MultiRadio 10基地台TDD LTE FSIH基頻單位 Nokia Flexi MultiRadio 10 Base Station TDD LTE Baseband Unit, Model FSIH, P/N 472567A.101
出版日期: 2019年07月30日內容資訊: 英文 48 Pages, 47 Exhibits, 8 Tables
簡介

本報告提供Nokia公司生產Flexi System Module release 3 (FSMr3) 平台的一部分的Flexi MultiRadio 10 TDD LTE FSIH基頻單位調查,系統的功能,方塊圖,機器分析,PCB分析,零組件圖,BOM等彙整資料。

作為

摘要整理

第1章 NOKIA公司生產FLEXI MULTIRADIO 10系統

  • 概要

第2章 FSIH:機器分析

  • 機器分析
    • Flexi 2.5U 底盤/胎體
    • FSIH核心模組
    • FSIH核心散熱板集合

第3章 FLEXI系統:室內控制 + 傳輸面板

  • 區域A零組件分析:電源
  • 區域B零組件分析:控制、時機、運輸
  • 區域C零組件分析

第4章 FLEXI系統:室內基頻信號處理面板

  • 區域A零組件分析:電源
  • 區域B零組件分析:基頻無線信號處理
  • 區域C零組件分析
目錄
Product Code: DNA-I-2019-002

This report provides a comprehensive analysis for the Nokia Networks Flexi MultiRadio 10 TDD LTE FSIH Baseband Unit. This product is part of the Flexi System Module release 3 (FSMr3) platform and supports only TDD LTE technology and is primarily an indoor unit. Please see our report on the FSMF FDD LTE unit which is also part of the FSMr3 platform.

Features:

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB
  • High Level Bill of Materials
    • Semiconductor Ics (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type
  • Excludes analysis of passive chip resistors, capacitors, and inductors
  • Total Pages: 48
  • Total Exhibits: 47
  • Total Tables: 8

TABLE OF CONTENTS

EXECUTIVE SUMMARY

  • Important Note:

CHAPTER 1: NOKIA FLEXI MULTIRADIO 10 SYSTEM

  • Overview of Flexi Multiradio 10

CHAPTER 2: FSIH MECHANICAL ANALYSIS

  • Mechanical Analysis
    • 2.1. Flexi 2.5U Chassis/Casing
    • 2.2. FSIH Core Module
    • 2.3. FSIH Core Heat Sink Assembly
    • 2.4. FBIH Core Heat Sink Assembly

CHAPTER 3: FLEXI SYSTEM INDOOR CONTROL + TRANSPORT BOARD

  • Area A Component Analysis - Power Supply
  • Area B Component Analysis - Control, Timing, & Transport
  • Area C Component Analysis

CHAPTER 4: FLEXI SYSTEM INDOOR BASEBAND SIGNAL PROCESSING BOARD

  • Area A Component Analysis - Power Supply
  • Area B Component Analysis - Baseband Radio Signal Processing
  • Area C Component Analysis

TABLES

  • Table 1: FSIH PCB Top Area A Bill of Materials
  • Table 2: FSIH PCB Top Area B Bill of Materials
  • Table 3: FSIH PCB Top Area B Passive Bill of Materials
  • Table 4: FSIH PCB Bottom Area C Bill of Materials
  • Table 5: FBIH PCB Top Area A Bill of Materials
  • Table 6: FBIH PCB Top Area B Bill of Materials
  • Table 7: FBIH PCB Top Area B Passives Bill of Materials
  • Table 8: FBIH PCB Bottom Area C Bill of Materials
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