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表紙
市場調查報告書

全球電子封裝市場:2021-2028

Global Electronic Packaging Market - 2021-2028

出版商 DataM Intelligence 商品編碼 1024581
出版日期 內容資訊 英文 180 Pages
商品交期: 約2個工作天內
價格
全球電子封裝市場:2021-2028 Global Electronic Packaging Market - 2021-2028
出版日期: 2021年08月20日內容資訊: 英文 180 Pages
簡介

電子封裝被定義為電子設備外殼的設計和製造,從單個半導體到大型計算機等完整系統。

對於智能手機、電視、平板電腦、機頂盒和數位媒體適配器等消費電子設備,靜電放電、水、惡劣天氣條件、腐蝕、防塵、冷卻、高頻噪聲發射、機械高效電子封裝用於防止損壞和靜電放電。

此外,由於可以減少PCB級的板面積、重量和佈線複雜度,航空航天和軍隊配備的信息屏系統、信息處理設備、飛機控制設備等半導體設備也很受歡迎。用於設施。此外,電子設備的加入將為人機界面創造巨大潛力,隨著電池變得更密集和更高效,預計電子封裝市場在預測期內將顯著增長。

近年來,消費者對高品質軍用包裝的興趣刺激了對電子包裝的需求。對環保封裝日益增長的需求為電子封裝市場的增長提供了巨大的機會。

該報告調查了全球電子封裝市場,並按類型、材料、技術、應用、最終用戶、地區和進入市場的公司概況介紹了市場概況以及趨勢。

目錄

第 1 章全球電子封裝市場的研究方法和範圍

  • 調查方法
  • 調查的目的和範圍

第 2 章全球電子封裝市場-市場定義和概述

第 3 章全球電子封裝市場-執行摘要

  • 按類型劃分的市場細分
  • 按材料劃分的市場細分
  • 按技術劃分的市場細分
  • 按應用細分的市場
  • 按最終用戶劃分的市場細分
  • 按地區劃分的市場細分

第 4 章世界電子封裝市場動態

  • 影響市場的因素
    • 促進因素
    • 抑制因素
    • 市場機會
    • 影響分析

第 5 章全球電子封裝市場-行業分析

  • 波特五力分析
  • 監管分析
  • 供應鏈分析
  • 價格分析
  • 貿易分析

第 6 章全球電子封裝市場-COVID-19 分析

  • 市場上的 COVID-19 分析
    • 之前的 COVID-19 市場情景
    • COVID-19 當前市場情況
    • COVID-19 發佈或未來情景
  • Covid-19 中的價格動態
  • 供需範圍
  • 大流行期間與市場相關的政府舉措
  • 製造商的戰略計劃
  • 結論

第 7 章全球電子封裝市場-按類型

  • 簡介
    • 按類型分列的市場規模分析和同比增長分析 (%)
    • 市場吸引力指數
  • 紙板箱
    • 簡介
    • 市場規模分析,100萬美元,2018-2027,以及同比增長分析(%),2018-2027
  • 紙板箱
  • 熱成型托盤
  • 包、小袋
  • 吸塑包裝,翻蓋
  • 保護性包裝
  • 其他

第 8 章全球電子封裝市場-按材料

  • 簡介
    • 市場規模分析,同比增長分析(%),按材料
    • 市場吸引力指數
  • 塑料
    • 簡介
    • 市場規模分析,100萬美元,2018-2027,以及同比增長分析(%),2018-2027
  • 金屬
  • 玻璃
  • 其他

第 9 章全球電子封裝市場-按技術

  • 簡介
    • 市場規模分析,同比增長分析(%),按技術劃分
    • 市場吸引力指數
  • 電子產品監控 (EAS)
    • 簡介
    • 市場規模分析,100萬美元,2018-2027,以及同比增長分析(%),2018-2027
  • 射頻識別 (RFID)
  • 通孔安裝
  • 表面貼裝技術 (SMD)
  • 芯片級封裝 (CSP)
  • 其他

第 10 章全球電子封裝市場-按應用

  • 簡介
    • 按應用分列的市場規模分析、同比增長分析 (%)
    • 市場吸引力指數
  • 半導體和 IC
    • 簡介
    • 市場規模分析,100萬美元,2018-2027,以及同比增長分析(%),2018-2027
  • 印刷電路板
  • 矽壓阻式應力傳感器
  • 其他

第 11 章全球電子封裝市場-按最終用戶

  • 簡介
    • 市場規模分析,同比增長分析 (%),按最終用戶
    • 市場吸引力指數
  • 家電
    • 簡介
    • 市場規模分析,100萬美元,2018-2027,以及同比增長分析(%),2018-2027
  • 航空航天與國防
  • 汽車
  • 行業
  • 信息技術/通信
  • 醫療保健
  • 其他

第 12 章全球電子封裝市場-按地區

  • 簡介
    • 按地區分列的市場規模分析和同比增長分析 (%)
    • 市場吸引力指數
  • 北美
    • 簡介
    • 主要區域動態
    • 按類型分列的市場規模分析和同比增長分析 (%)
    • 市場規模分析,同比增長分析(%),按材料
    • 市場規模分析,同比增長分析(%),按技術劃分
    • 按應用分列的市場規模分析、同比增長分析 (%)
    • 市場規模分析,同比增長分析 (%),按最終用戶
    • 按國家/地區劃分的市場規模分析和同比增長分析 (%)
  • 歐洲
    • 簡介
    • 主要區域動態
    • 按類型分列的市場規模分析和同比增長分析 (%)
    • 市場規模分析,同比增長分析(%),按材料
    • 市場規模分析,同比增長分析(%),按技術劃分
    • 按應用分列的市場規模分析、同比增長分析 (%)
    • 市場規模分析,同比增長分析 (%),按最終用戶
    • 按國家/地區劃分的市場規模分析和同比增長分析 (%)
  • 南美洲
    • 簡介
    • 主要區域動態
    • 按類型分列的市場規模分析和同比增長分析 (%)
    • 市場規模分析,同比增長分析(%),按材料
    • 市場規模分析,同比增長分析(%),按技術劃分
    • 按應用分列的市場規模分析、同比增長分析 (%)
    • 市場規模分析,同比增長分析 (%),按最終用戶
    • 按國家/地區劃分的市場規模分析和同比增長分析 (%)
  • 亞太地區
    • 簡介
    • 主要區域動態
    • 按類型分列的市場規模分析和同比增長分析 (%)
    • 市場規模分析,同比增長分析(%),按材料
    • 市場規模分析,同比增長分析(%),按技術劃分
    • 按應用分列的市場規模分析、同比增長分析 (%)
    • 市場規模分析,同比增長分析 (%),按最終用戶
    • 按國家/地區劃分的市場規模分析和同比增長分析 (%)
  • 中東和非洲
    • 簡介
    • 主要區域動態
    • 按類型分列的市場規模分析和同比增長分析 (%)
    • 市場規模分析,同比增長分析(%),按材料
    • 市場規模分析,同比增長分析(%),按技術劃分
    • 按應用分列的市場規模分析、同比增長分析 (%)
    • 市場規模分析,同比增長分析 (%),按最終用戶

第 13 章全球電子封裝市場的競爭態勢

  • 競爭場景
  • 市場定位/股票分析
  • 併購分析

第 14 章全球電子封裝市場的企業概況

  • AMETEK Inc.
    • 公司簡介
    • 產品組合和概述
    • 主要亮點
    • 財務概覽
  • UFP Technologies, Inc.
  • du Pont de Nemours and Company
  • Sealed Air Corporation
  • Dordan Manufacturing Company
  • DS Smith
  • GY Packaging
  • Primex Design & Fabrication
  • Smurfit Kappa
  • Sonoco Products Company

非詳盡列表

第 15 章全球電子封裝市場-重要考慮

第 16 章全球電子封裝市場-DataM

  • 附錄
  • 關於我們的公司和服務
  • 聯繫我們

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: DMOT3947

Electronic Packaging Market Overview

Electronic packaging is defined as the design and production of enclosures for electronic devices ranging from individual semiconductors to complete systems such as mainframe computers. Efficient electronic packaging is used during consumer electronic products such as smartphones, TVs, tablets, set-top boxes, digital media adapters to protect from electrostatic discharge, water, harsh weather condition, corrosion, and dust that protects from cooling, radio frequency noise emission, mechanical damage and electrostatic discharge.

Additionally, it is used in several aerospace and army facilities packed with semiconductor devices such as information screen systems, information handling units and control units for aircraft as it facilitates reduced board area decreased weight and routing complexity at PCB level. In addition, integrating electronics opens vast possibilities for the human interface, and higher density efficient battery technologies imply that the electronic packaging market share would undergo significantly high growth during the forecast period.

Furthermore, THIMM carried out a packaging optimization project for the Hager Group, one of the world's leading providers of systems, solutions and services for electrical installations in buildings. The European optimization project resulted in an annual seven-figure savings potential. For instance, electronics packaging design was optimized and resulted in annual savings of 300,000 square meters of corrugated cardboard. In addition, the packaging print was also decreased from 60 to 10%, which means a clear brand impression with the electronics packaging.

The global electronic packaging market is estimated to reach US$ YY million by 2028 from the recorded market size of worth US$ YY million in 2020, growing at a CAGR of YY% during the forecast period (2021-2028).

Electronic Packaging Market Dynamics

The increasing inclination of consumers towards high-quality military grade packaging is triggering the demand for electronic packaging in recent times. Growing demand for eco-friendly packaging creates a strong opportunity for the electronic packaging market growth.

Increasing demand of electronic packaging from consumer electronic product is expected to increase the market size

The commoditization of consumer electronics products, changing consumer buying patterns and decreasing product life cycles are significant factors driving the growth of the electronics packaging market. Moreover, the rise in adoption of consumer electronic devices such as smartphones, wearable devices, television, digital cameras and tablets contain innovative packaging products such as air bubble wraps and air pillows to protect from harsh weather conditions primarily drive the market growth. In addition, demand for all-weather protective packaging for fragile electronic products such as routers, network servers, and sensors. Also, the growing penetration of smart computing devices and mobile phones in different developing economies is anticipated to boost the market's growth.

Rising demand of high-quality military-grade packaging in various sector is expected to boost the market growth

The demand for high-quality military-grade packaging in the aerospace & defense sector for naval warships, weapon control systems, data display systems, satellite communication on-board channels and aircraft guidance-control assemblies further drive the electronic packaging market revenue. In addition, the growth of the IoT network market and continued investments in R&D to enable productive electronic and semiconductor packaging is expected to present new pathways to the electronic packaging industry.

Moreover, the leading electronic packaging market players adopt necessary methods to develop prime solutions for integrating flexible electronics, including high-performance batteries and compact electronic packaging. Moreover, in May 2020, Curtiss-Wright, a global diversified product manufacturer and service provider, launched a new miniature Data Acquisition System (DAC) family to provide a balanced square form factor to system designers.

Slow production, complexity and difficult in detection of defect is expected to hinder the market growth

Time-consuming design that is expected to slow down the production of the product is the key factor that hinders the market's growth. In addition, potential reliability issues, as it is prone to stress and complex, difficult maintenance of defects after components are soldered onto the circuit board, tend to restrain the market growth. Moreover, rising intolerance towards plastic, changing consumer preferences, shifting regulatory environment, and lowering average disposable income levels are some of the major factors hampering the growth of the electronic packaging market.

Electronic Packaging Market Segment Analysis

By end-user, the market is segmented into consumer electronics, industrial, It & communication, aerospace & defense, automotive, healthcare and others.

Electronic packaging of many memory devices, processors, discrete power devices, sensors, analog and digital circuits is integrated with electric and hybrid vehicles hence transforming the automotive landscape through the transition from the mechanical system to electronic assemblies.

A semiconductor packaging is a metal, glass, plastic or ceramic shelter containing isolated semiconductor devices or integrated circuits. In semiconductor packaging, discrete or individual components are fabricated on semiconductor wafers such as silicon to be diced into tested, die and packaged. This electronic packaging defends the electronics devices from threats such as light exposure, mechanical impact and chemical contamination. The high demand for semiconductor manufacturing technology in electronic devices, which are being used in the aerospace & defense, healthcare and electronics sectors, propels the market's growth. Moreover, the automotive electronics industry held the highest semiconductor packaging growth segment, with a significant CAGR. In the automotive vehicle industry, electronics packaging is frequently essential for the performance and reliability of the chips. In addition, electronic packaging in the automotive industry offers high performance and low power by avoiding an accident in driver-assisted and autonomous vehicles. It considerably reduces the amount of time taken to bring automotive chips and features to market, and it guards chips against the harsh environment like electromagnetic interference and thermal extremes, ultimately driving the market's growth.

Alternatively, the consumer electronics industry is expected to witness fast growth at a significant CAGR during the forecast period. This is because electronics packaging for consumer electronics products offers better protection from static discharge, more protection from physical damage during storage and transportation, eradicate contamination through clean packaging, decrease time-to-market and total packaging costs, fit proper part specifications for a custom fit and simple inspection without the risk of damage or costly re-pack methods are eventually driving the growth of the market.

Electronic Packaging Market Geographical Analysis

Based on the geography, the electronic packaging market is segmented into North America, Europe, South America, Asia-Pacific, and Middle East & Africa. The demand for electronic packaging in the North American market is expected to remain at the dominant position in sales and value generation due to the growing volume of trade and e-commerce in countries such as the U.S.

APAC is expected to witness fastest growth of electronic packaging market during the forecast period

APAC is expected to witness the fastest growth rate for the electronics packaging market during the forecast period. China is considered the global electronic hub because of the mass production and manufacturing of electronics & electrical components products to meet the highest performance, quality and delivery standards. Therefore, the companies in the region are also investing in installing machinery that enables productive electronic and semiconductor packaging. This gives a significant growth potential to the electronic packaging market.

For instance, in 2019, KraussMaffei announced that it would debut a locally produced all-electric injection molding machine named PX Agile at Chinaplas. The new PX Agile is typical for standard applications like electric and electronic devices, technical components, electronic packaging and medical industries.

Moreover, an increment in discretionary spending by the middle class across the region on consumer electronics products such as smartphones, wearable electronics, tablets, televisions etc., is boosting the APAC consumer electronics packaging market growth. In addition, In 2018, China seized a significant share in the regional market in terms of revenues, and the trend is expected to last over the next few years. As a result, the APAC electronics packaging market was estimated at more than USD 7,999.89 million in 2018; the market is expected to grow at a significant CAGR throughout the forecast period.

Changing customer purchasing trends in supermarkets, for instance, purchasing consumer electronic goods, is pushing the growth of electronic packaging products in North America. This changing purchasing pattern has decreased the cost of expensive operations on the customer's hand and has raised the demand for storage goods from consumer electronics. In addition, it also experiences a requirement for single, environmentally sound, and easy-to-use packaging of consumer electronics. Also, the North American electronics packaging market reached a valuation of USD 3,888 million in 2017 and is expected to register a significant CAGR during the forecast period.

Electronic Packaging Market Competitive Landscape

The electronic packaging market is fragmented with the presence of regional and global players. The competitive contour lies with the increase in the regional company and growing investment in upstream application. AMETEK Inc., UFP Technologies, Inc., du Pont de Nemours and Company, Sealed Air Corporation, Dordan Manufacturing Company, DS Smith, GY Packaging, Primex Design & Fabrication, Smurfit Kappa, Sonoco Products Company are the major player in the packaging market. The major players adopt several growth strategies such as product launches, acquisitions, and collaborations, contributing to growing the electronic packaging market globally.

UFP Technologies, Inc.

Overview: The company is established in 1963 and headquartered in Newburyport, Massachusetts. UFP Technologies is a medical manufacturer and designer of sub-assemblies, components, packaging and custom devices utilizing extremely specialized films, plastics and foams. The company's single-patient and single-use components and devices are utilized in a broad range of infection prevention, disposable wound care, minimally invasive surgery, medical devices, orthopedic soft goods, orthopedic implant and wearables packaging.

UFP Technologies is diversified in also offering highly engineered components and products to consumers in the defense, automotive, aerospace, industrial and consumer electronics markets. Ideal applications include gear components and military uniform, athletic padding, automotive interior trim, air filtration, environmentally friendly protective packaging, abrasive nail files, and protective cases.

Product Portfolio:

  • Protective Cases & Inserts

UFP Technologies specializes in fabricating & designing protective foam & case insert solutions. The company's precision fabricating capabilities, protective packaging design expertise and access to a broad range of protective cases & packaging foams offer the user a complete protective case and insert provider. Moreover, the company offers a depth of fabrication capabilities ranging from water-jet cutting, die-cutting and CNC routing to create the most special case insert. UFP Technologies also provides complete turn-key solutions.

  • Molded Fiber Packaging

UFP Technologies is a growing designer and manufacturer of molded fiber packaging solutions made from 100% recycled paper. The company offers cost-effective and environmentally friendly solutions to decrease labor and save space while offering superior protection at every stage of a product's sales cycle. In addition, as a process and a material, molded fiber is an excellent protective packaging medium. The inherent flexibility of molded pulp provides substantial cushioning qualities, and the geometry that the company incorporates into each design lends strength to each part.

  • Material Handling

As an innovative manufacturer and designer of custom packaging systems, UFP Technologies has the expertise to develop reusable and returnable packaging systems used for material handling. Moreover, material handling packaging systems are most commonly used for intra and inter-plant transfer and shipments where vibration and shock protection and characteristics such as class A or ESD control surface protection are essential.

Why Purchase the Report?

  • Visualize the composition of the electronic packaging market segmentation by type, material, technology, application, end-user and region highlighting the key commercial assets and players.
  • Identify commercial opportunities in electronic packaging market by analyzing trends and co-development deals.
  • Excel data sheet with thousands of data points of electronic packaging market - level 4/5 segmentation.
  • PDF report with the most relevant analysis cogently put together after exhaustive qualitative interviews and in-depth market study.
  • Product mapping in excel for the key product of all major market players

The global electronic packaging market report would provide an access to an approx. 77 market data table, 86 figures and 180 pages.

Target Audience

  • Service Providers/ Buyers
  • Industry Investors/Investment Bankers
  • Education & Research Institutes
  • Research Professionals
  • Emerging Companies
  • Manufacturers

Table of Contents

1. Global Electronic Packaging Market Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Global Electronic Packaging Market- Market Definition and Overview

3. Global Electronics Packaging Market- Executive Summary

  • 3.1. Market Snippet by Type
  • 3.2. Market Snippet by Material
  • 3.3. Market Snippet by Technology
  • 3.4. Market Snippet by Application
  • 3.5. Market Snippet by End-User
  • 3.6. Market Snippet by Region

4. Global Electronic Packaging Market-Market Dynamics

  • 4.1. Market Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Increasing demand of electronic packaging from consumer electronic product
      • 4.1.1.2. Rising demand of high-quality military-grade packaging in various sector
    • 4.1.2. Restraints
      • 4.1.2.1. Slow production, complexity and difficult in detection of defect
      • 4.1.2.2. YY
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Global Electronic Packaging Market- Industry Analysis

  • 5.1. Porter's Five Forces Analysis
  • 5.2. Regulatory Analysis
  • 5.3. Supply Chain Analysis
  • 5.4. Pricing Analysis
  • 5.5. Trade Analysis

6. Global Electronic Packaging Market - COVID-19 Analysis

  • 6.1. Analysis of COVID-19 on the Market
    • 6.1.1. Before COVID-19 Market Scenario
    • 6.1.2. Present COVID-19 Market Scenario
    • 6.1.3. After COVID-19 or Future Scenario
  • 6.2. Pricing Dynamics Amid Covid-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. Global Electronics Packaging Market- By Type

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2. Market Attractiveness Index, By Type
  • 7.2. Corrugated Boxes*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis, USD Mn, 2018-2027 and Y-o-Y Growth Analysis (%), 2018-2027
  • 7.3. Paperboard Boxes
  • 7.4. Thermoformed Trays
  • 7.5. Bags & Pouches
  • 7.6. Blister Packs & Clamshell
  • 7.7. Protective Packaging
  • 7.8. Others

8. Global Electronics Packaging Market- By Material

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Material
    • 8.1.2. Market Attractiveness Index, By Material
  • 8.2. Plastic*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis, USD Mn, 2018-2027 and Y-o-Y Growth Analysis (%), 2018-2027
  • 8.3. Metal
  • 8.4. Glass
  • 8.5. Paper
  • 8.6. Others

9. Global Electronics Packaging Market- By Technology

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Technology
    • 9.1.2. Market Attractiveness Index, By Technology
  • 9.2. Electronic Article Surveillance (EAS)*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis, USD Mn, 2018-2027 and Y-o-Y Growth Analysis (%), 2018-2027
  • 9.3. Radio-Frequency Identification (RFID)
  • 9.4. Through-Hole Mounting
  • 9.5. Surface-Mount Technology (SMD)
  • 9.6. Chip-Scale Packages (CSP)
  • 9.7. Others

10. Global Electronics Packaging Market- By Application

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Application
    • 10.1.2. Market Attractiveness Index, By Application
  • 10.2. Semiconductor & IC*
    • 10.2.1. Introduction
    • 10.2.2. Market Size Analysis, USD Mn, 2018-2027 and Y-o-Y Growth Analysis (%), 2018-2027
  • 10.3. PCB
  • 10.4. Silicon Piezoresistive Stress Sensors
  • 10.5. Others

11. Global Electronics Packaging Market- By End-User

  • 11.1. Introduction
    • 11.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-User
    • 11.1.2. Market Attractiveness Index, By End-User
  • 11.2. Consumer Electronics*
    • 11.2.1. Introduction
    • 11.2.2. Market Size Analysis, USD Mn, 2018-2027 and Y-o-Y Growth Analysis (%), 2018-2027
  • 11.3. Aerospace & Defense
  • 11.4. Automotive
  • 11.5. Industrial
  • 11.6. IT & Communication
  • 11.7. Healthcare
  • 11.8. Others

12. Global Electronics Packaging Market- By Region

  • 12.1. Introduction
    • 12.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Region
    • 12.1.2. Market Attractiveness Index, By Region
  • 12.2. North America
    • 12.2.1. Introduction
    • 12.2.2. Key Region-Specific Dynamics
    • 12.2.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Type
    • 12.2.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Material
    • 12.2.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Technology
    • 12.2.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Application
    • 12.2.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-User
    • 12.2.8. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 12.2.8.1. United States
      • 12.2.8.2. Canada
      • 12.2.8.3. Mexico
  • 12.3. Europe
    • 12.3.1. Introduction
    • 12.3.2. Key Region-Specific Dynamics
    • 12.3.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Type
    • 12.3.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Material
    • 12.3.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Technology
    • 12.3.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Application
    • 12.3.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-User
    • 12.3.8. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 12.3.8.1. Germany
      • 12.3.8.2. United Kingdom
      • 12.3.8.3. France
      • 12.3.8.4. Italy
      • 12.3.8.5. Spain
      • 12.3.8.6. Rest of Europe
  • 12.4. South America
    • 12.4.1. Introduction
    • 12.4.2. Key Region-Specific Dynamics
    • 12.4.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Type
    • 12.4.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Material
    • 12.4.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Technology
    • 12.4.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Application
    • 12.4.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-User
    • 12.4.8. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 12.4.8.1. Brazil
      • 12.4.8.2. Argentina
      • 12.4.8.3. Rest of South America
  • 12.5. Asia Pacific
    • 12.5.1. Introduction
    • 12.5.2. Key Region-Specific Dynamics
    • 12.5.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Type
    • 12.5.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Material
    • 12.5.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Technology
    • 12.5.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Application
    • 12.5.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-User
    • 12.5.8. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 12.5.8.1. China
      • 12.5.8.2. India
      • 12.5.8.3. Japan
      • 12.5.8.4. Australia
      • 12.5.8.5. Rest of Asia Pacific
  • 12.6. Middle East and Africa
    • 12.6.1. Introduction
    • 12.6.2. Key Region-Specific Dynamics
    • 12.6.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Type
    • 12.6.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Material
    • 12.6.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Technology
    • 12.6.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Application
    • 12.6.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-User

13. Global Electronics Packaging Market Competitive Landscape

  • 13.1. Competitive Scenario
  • 13.2. Market Positioning/Share Analysis
  • 13.3. Mergers and Acquisitions Analysis

14. Global Electronics Packaging Market Company Profiles

  • 14.1. AMETEK Inc.*
    • 14.1.1. Company Overview
    • 14.1.2. Product Portfolio and Description
    • 14.1.3. Key Highlights
    • 14.1.4. Financial Overview
  • 14.2. UFP Technologies, Inc.
  • 14.3. du Pont de Nemours and Company
  • 14.4. Sealed Air Corporation
  • 14.5. Dordan Manufacturing Company
  • 14.6. DS Smith
  • 14.7. GY Packaging
  • 14.8. Primex Design & Fabrication
  • 14.9. Smurfit Kappa
  • 14.10. Sonoco Products Company

LIST NOT EXHAUSTIVE

15. Global Electronic Packaging Market - Premium Insights

16. Global Electronic Packaging Market- DataM

  • 16.1. Appendix
  • 16.2. About Us and Services
  • 16.3. Contact Us