嵌入式溫度傳感器市場:按類型(非接觸式、接觸式)、最終用途行業、地區 - 規模、份額、展望、機會分析,2022-2030 年
市場調查報告書
商品編碼
1213903

嵌入式溫度傳感器市場:按類型(非接觸式、接觸式)、最終用途行業、地區 - 規模、份額、展望、機會分析,2022-2030 年

Embedded Temperature Sensor Market, By Type (Non-contact and Contact ), End-use Industry, and By Region - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030

出版日期: | 出版商: Coherent Market Insights | 英文 150 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

溫度傳感器用於檢測熱量或溫度。 這些傳感器檢測物理溫度並以模擬和數字格式提供結果。 這些傳感器用於汽車、醫療保健、金屬製造、航空航天和國防等各個行業。 工業化和先進技術正在推動嵌入式溫度傳感器市場的增長。 自動駕駛汽車和機器人技術等新興技術將為嵌入式溫度傳感器市場提供有利可圖的機會。

此外,需要確認發燒以檢測冠狀病毒大流行的症狀。 公司正專注於推出便攜式溫度傳感器設備。 HUAWEI於2020年6月發佈的新智能手機 "Honor Play 4 Pro" 內置了溫度傳感器。 紅外傳感器支持 -20°C 至 100°C。

按價值計算,到 2030 年底,嵌入式溫度傳感器市場估計將達到 134.011 億美元。

市場動態

由於醫療保健行業越來越多地採用溫度傳感器,預計嵌入式溫度傳感器的全球市場在預測期內將顯著增長。 溫度傳感器以更低的功率運行,並提供更準確的結果。 政府強制要求使用溫度傳感器來檢測醫療行業中與熱相關的問題。 世界各地的各種物聯網項目都在使用溫度傳感器來收集高效準確的數據,並提供更好的患者護理。 例如,根據 Coherent Market Insights 的分析,由於疾病的增加,2017 年醫療器械市場預計將達到 3980 億美元。

例如,根據美國心臟協會 (AHA) 的數據,心臟病每年導致約 1730 萬人死亡,預計到 2030 年將增加到 2360 萬人。 創新的溫度傳感器用於降低熱死亡率。 此外,預計在化學工業中越來越多地採用溫度傳感器也將在預測期內推動市場增長。 溫度傳感器用於控制和監測各種過程中的溫度,例如精煉、裂解和焚燒。

此外,不同地區的許多全球公司都致力於開發具有先進功能和技術的新產品,以提高其在市場上的競爭力。 業界正在開發具有新功能的高科技嵌入式溫度傳感器,以滿足最終用戶的需求。 例如,2017 年,TE Con​​nectivity 推出了一款重量輕、體積小、效率高、成本低的 NTC 熱敏電阻。 新推出的產品可應用於汽車行業,以監測電池溫度並防止電動汽車過熱。

這項研究的主要特點

  • 本報告以 2021 年為基準年,深入分析了預測期內(2022 年至 2030 年)的全球嵌入式溫度傳感器市場規模和復合年增長率 (CAGR%)。
  • 它揭示了不同細分市場的潛在收入機會,並為該市場概述了一個有吸引力的投資建議矩陣。
  • 它還提供了有關市場驅動因素、制約因素、機會、新產品發佈和批准、區域前景以及主要市場參與者採用的競爭策略的重要見解。
  • 根據公司概況、業績、產品組合、地域分佈、市場資本、關鍵發展、戰略和未來計劃等參數,全球嵌入式溫度傳感器市場主要參與者的概況。
  • 本研究涵蓋的公司包括Honeywell International Inc., NXP Semiconductors, Panasonic Corporation, Delphi Technologies, Siemens, ABB, STMicroelectronics, Emerson Electric Co., Microchip Technology Inc., Fluke Process Instruments, Mouser Electronics, Inc., Robert Bosch GmbH, TE Connectivity, DENSO CORPORATION, OMRON Corporation, FLIR Systems, Inc., Amphenol Advanced Sensors, Maxim Integrated, KONGSBERG, Yokogawa India Ltd., Infineon Technologies AG, TDK-Micronas GmbH, Amphenol Corporation, OMEGA Engineering inc., ON Semiconductor, CODICO GmbH, Sensata Technologies, Inc., VINCI, and Digi-Key Electronics
  • 這份報告中的見解應該能讓企業營銷人員和管理人員就未來的產品發佈、產品升級、市場擴張和營銷策略做出明智的決策。看起來。
  • 本研究報告面向該行業的各種利益相關者,包括投資者、供應商、託管服務提供商、第三方服務提供商、分銷商、新進入者和增值經銷商。
  • 利益相關者可以通過用於分析全球嵌入式溫度傳感器市場的各種戰略矩陣來促進他們的決策。

內容

第 1 章目的和先決條件

  • 調查目的
  • 先決條件
  • 縮寫說明

第二章市場展望

  • 報告內容
    • 市場定義和範圍
  • 執行摘要
    • 市場細分:按類型
    • 按最終用途行業細分的市場
    • 按地區劃分的市場細分
  • 連貫機會圖 (COM)

第3章市場動態、規律及趨勢分析

  • 市場動態
    • 司機
    • 約束因素
    • 市場機會
  • 監管場景
  • 行業趨勢
  • 併購
  • 新系統啟動/批准
  • 大流行對 COVID-19 的影響

第 4 章嵌入式溫度傳感器的全球市場,按類型,2017-2030

  • 非接觸式
  • 紅外線
  • 光纖類型
  • 聯繫人類型
  • 雙金屬
  • 溫度傳感器 IC
  • 熱敏電阻
  • 電阻式溫度傳感器
  • 熱電偶

第 5 章按最終用途行業劃分的嵌入式溫度傳感器全球市場,2017-2030

  • 化學品
  • 石油和天然氣
  • 能源/電力
  • 醫療保健
  • 食物和飲料
  • 消費類電子產品
  • 航空航天與國防
  • 金屬與礦業

第 6 章按地區分列的嵌入式溫度傳感器全球市場,2017-2030

  • 北美
  • 美國
  • 加拿大
  • 歐洲
  • 英國
  • 德國
  • 法國
  • 意大利
  • 俄羅斯
  • 其他歐洲地區
  • 亞太地區
  • 中國
  • 印度
  • 日本
  • 東盟
  • 澳大利亞
  • 韓國
  • 其他亞太地區
  • 拉丁美洲
  • 巴西
  • 阿根廷
  • 墨西哥
  • 其他拉丁美洲地區
  • 中東和非洲
  • 南非
  • 海灣合作委員會國家
  • 其他中東和非洲地區

第七章競爭格局

  • 公司簡介
    • Honeywell International Inc.
    • NXP Semiconductors
    • Panasonic Corporation
    • Delphi Technologies
    • Siemens
    • ABB
    • STMicroelectronics
    • Emerson Electric Co.
    • Microchip Technology Inc.
    • Fluke Process Instruments
    • Mouser Electronics, Inc.
    • Robert Bosch GmbH
    • TE Connectivity
    • DENSO CORPORATION
    • OMRON Corporation
    • FLIR Systems, Inc.
    • Amphenol Advanced Sensors
    • Maxim Integrated
    • KONGSBERG
    • Yokogawa India Ltd.
    • Infineon Technologies AG
    • TDK-Micronas GmbH
    • Amphenol Corporation
    • OMEGA Engineering Inc.
    • ON Semiconductor
    • CODICO GmbH
    • Sensata Technologies, Inc.
    • VINCI
    • Digi-Key Electronics

第 8 章

  • 參考文獻
  • 調查方法
簡介目錄
Product Code: CMI4015

Temperature sensors are used to detect heat or temperature. These sensors detect physical temperature and provide results in analog and digital form. These sensors are used in various industries such as automotive, healthcare, metal manufacturing, aerospace and defense, and others. Industrialization and advanced technologies are driving growth of the embedded temperature sensor market. Advanced technologies such as autonomous vehicles and robotics will provide lucrative opportunities for embedded temperature sensor market.

Further, to detect symptoms of coronavirus pandemic, checking fever is necessary. Companies are focusing on launching portable temperature sensing devices. Huawei's new smartphone, Honor Play 4 Pro, launched in June 2020, has a temperature sensor built-in. The infrared sensor supports temperatures from -20°C to 100°C.

The Embedded Temperature Sensor Market is estimated to account for US$ 13,401.1 Mn in terms of value by the end of 2030.

Market Dynamics

The global embedded temperature sensor market is expected to grow significantly during the forecast period, owing to increasing adoption of temperature sensors in the healthcare industry. Temperature sensor needs less power for functioning and provide results with high accuracy. Government are mandating people to use temperature sensors to detect heat-related issues in the medical industry. Various IoT projects across the globe are using temperature sensors for collecting efficient and accurate data, and also, to provide better care to the patients. For instance, according to Coherent Market Insights' analysis, the medical device market is expected to reach an estimated US$ 398,000 million in 2017 due to the increasing number of diseases.

For instance, according to the American Heart Association (AHA), heart diseases kill around 17.3 million people annually, which is expected to rise to 23.6 million by 2030. Innovative temperature sensors are used to mitigate heat-related mortality rates. Moreover, increasing adoption of temperature sensors in chemical industries is expected to propel the market growth over the forecast period. Temperature sensors are used in various processes such as refining, cracking, and incineration to control and monitor the temperature.

Furthermore, many global players across different regions are focusing on developing new products with advanced features and technologies to gain competitive edge in the market. Industries are developing high tech embedded temperature sensors with new features to cater to the demand from the end users. For instance, in 2017, TE Connectivity launched lightweight and small in size NTC Thermistor with high efficiency and less cost. The newly launched product finds its application in the automotive industry to monitor the temperature of batteries in electric cars and prevent overheating.

Key features of the study:

  • This report provides in-depth analysis of global embedded temperature sensor market size (US$ Million) and compound annual growth rate (CAGR %) for the forecast period (2022- 2030), considering 2021 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, regional outlook, and competitive strategies adopted by the leading market players
  • It profiles leading players in the global embedded temperature sensor market based on the following parameters - company overview, financial performance, product portfolio, geographical presence, market capital, key developments, strategies, and future plans
  • Companies covered as a part of this study include Honeywell International Inc., NXP Semiconductors, Panasonic Corporation, Delphi Technologies, Siemens, ABB, STMicroelectronics, Emerson Electric Co., Microchip Technology Inc., Fluke Process Instruments, Mouser Electronics, Inc., Robert Bosch GmbH, TE Connectivity, DENSO CORPORATION, OMRON Corporation, FLIR Systems, Inc., Amphenol Advanced Sensors, Maxim Integrated, KONGSBERG, Yokogawa India Ltd., Infineon Technologies AG, TDK-Micronas GmbH, Amphenol Corporation, OMEGA Engineering inc., ON Semiconductor, CODICO GmbH, Sensata Technologies, Inc., VINCI, and Digi-Key Electronics
  • Insights from this report would allow marketers and management authorities of companies to make informed decisions regarding future product launches, product upgrades, market expansion, and marketing tactics
  • The global embedded temperature sensor market report caters to various stakeholders in this industry including investors, suppliers, managed service providers, third-party service providers, distributors, new entrants, and value-added resellers
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global embedded temperature sensor market

Detailed Segmentation

  • Global Embedded Temperature Sensor Market, By Type:
    • Non-contact
      • Infrared
      • Fiber Optic
    • Contact
      • Bimetallic
      • Temperature Sensor IC
      • Thermistor
      • Resistive Temperature Detector
      • Thermocouple
  • Global Embedded Temperature Sensor Market, End-use Industry:
    • Chemicals
    • Oil & Gas
    • Energy & Power
    • Healthcare
    • Food & Beverages
    • Consumer Electronics
    • Aerospace & Defense
    • Metals & Mining
  • Global Embedded Temperature Sensor Market, By Region:
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa
  • Company Profiles
    • Honeywell International Inc.*
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
    • NXP Semiconductors
    • Panasonic Corporation
    • Delphi Technologies
    • Siemens
    • ABB
    • STMicroelectronics
    • Emerson Electric Co.
    • Microchip Technology Inc.
    • Fluke Process Instruments
    • Mouser Electronics, Inc.
    • Robert Bosch GmbH
    • TE Connectivity
    • DENSO CORPORATION
    • OMRON Corporation
    • FLIR Systems, Inc.
    • Amphenol Advanced Sensors
    • Maxim Integrated
    • KONGSBERG
    • Yokogawa India Ltd.
    • Infineon Technologies AG
    • TDK-Micronas GmbH
    • Amphenol Corporation
    • OMEGA Engineering inc
    • ON Semiconductor
    • CODICO GmbH
    • Sensata Technologies, Inc.
    • VINCI
    • Digi-Key Electronics

"*" marked represents similar segmentation in other categories in the respective section.

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snippet, By Type
    • Market Snippet, By End-use Industry
    • Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
    • Restraints
    • Market Opportunities
  • Regulatory Scenario
  • Industry Trend
  • Merger and Acquisitions
  • New system Launch/Approvals
  • Impact of COVID-19 Pandemic

4. Global Embedded Temperature Sensor Market, By Type, 2017-2030 (US$ Million)

  • Introduction
    • Market Share Analysis, 2022 and 2030 (%)
    • Segment Trends
  • Non-contact
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Infrared
  • Fiber Optic
  • Contact
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Bimetallic
  • Temperature Sensor IC
  • Thermistor
  • Resistive Temperature Detector
  • Thermocouple

5. Global Embedded Temperature Sensor Market, By End-use Industry, 2017-2030 (US$ Million)

  • Introduction
    • Market Share Analysis, 2022 and 2030 (%)
    • Segment Trends
  • Chemicals
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Oil & Gas
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Energy & Power
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Healthcare
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Food & Beverages
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Consumer Electronics
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Aerospace & Defense
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Metals & Mining
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)

6. Global Embedded Temperature Sensor Market, By Region, 2017-2030 (US$ Million)

  • Introduction
    • Market Share Analysis, By Region, 2022 and 2030 (%)
  • North America
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • U.S.
  • Canada
  • Europe
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • U.K.
  • Germany
  • France
  • Italy
  • Russia
  • Rest of Europe
  • Asia Pacific
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • China
  • India
  • Japan
  • ASEAN
  • Australia
  • South Korea
  • Rest of Asia Pacific
  • Latin America
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • Brazil
  • Argentina
  • Mexico
  • Rest of Latin America
  • Middle East and Africa
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • South Africa
  • GCC Countries
  • Rest of the Middle East and Africa

7. Competitive Landscape

  • Company Profiles
    • Honeywell International Inc.*
  • Company Overview
  • Product Portfolio
  • Financial Performance
  • Key Strategies
  • Recent Developments/Updates
    • NXP Semiconductors
    • Panasonic Corporation
    • Delphi Technologies
    • Siemens
    • ABB
    • STMicroelectronics
    • Emerson Electric Co.
    • Microchip Technology Inc.
    • Fluke Process Instruments
    • Mouser Electronics, Inc.
    • Robert Bosch GmbH
    • TE Connectivity
    • DENSO CORPORATION
    • OMRON Corporation
    • FLIR Systems, Inc.
    • Amphenol Advanced Sensors
    • Maxim Integrated
    • KONGSBERG
    • Yokogawa India Ltd.
    • Infineon Technologies AG
    • TDK-Micronas GmbH
    • Amphenol Corporation
    • OMEGA Engineering Inc.
    • ON Semiconductor
    • CODICO GmbH
    • Sensata Technologies, Inc.
    • VINCI
    • Digi-Key Electronics
  • Analyst Views

8. Section

  • References
  • Research Methodology
  • About us and Sales Contact