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市場調查報告書

3D IC的全球市場 - 各最終用途部門、基板的各類型、各製造工程、各產品、各地區:市場規模、佔有率、未來展望、機會分析

3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027

出版商 Coherent Market Insights 商品編碼 948381
出版日期 內容資訊 英文 140 Pages
商品交期: 2-3個工作天內
價格
3D IC的全球市場 - 各最終用途部門、基板的各類型、各製造工程、各產品、各地區:市場規模、佔有率、未來展望、機會分析 3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027
出版日期: 2020年06月26日內容資訊: 英文 140 Pages
簡介

全球3D IC市場,由於能源效率相關意識的高漲和IoT (物聯網)的普及,行動裝置的高性能且緊湊的IC的需求增加等要素,今後也將持續擴大趨勢。

本報告提供全球3D IC (三次元積體電路)的市場相關分析,技術概要,及市場基本結構及促進、阻礙因素,整體市場規模預測 (過去3年、今後8年份),各最終用途部門、基板的各類型、各製造工程、各產品、各地區的詳細趨勢,主要企業的簡介、業績、策略計劃等調查。

第1章 分析目的、前提條件

第2章 市場概要

  • 分析概要
  • 摘要整理
  • COM (Coherent Opportunity Map:市場機會藍圖)

第3章 市場動態、規定、趨勢分析

  • 市場動態
    • 推動市場要素
    • 阻礙市場要素
    • 市場機會
  • 法規方案
  • 產業趨勢
  • 企業合併、收購 (M&A)
  • 新產品的認證/上市

第4章 新型冠狀病毒感染疾病 (COVID-19) :對3D IC市場的影響

  • 短期性、長期性影響:各地區

第5章 全球3D IC市場:各最終用途部門

  • 簡介
  • 家電
  • 資訊通訊技術 (ITC)
  • 運輸機器 (汽車,航太)
  • 軍事
  • 其他 (生物醫療,研究開發 (R&D))

第6章 全球3D IC市場:基板的各類型

  • 簡介
  • SOI (矽晶絕緣體)
  • 散裝矽

第7章 全球 3D IC市場:各製造工程

  • 簡介
  • 電子束再結晶
  • 晶圓綁定
  • 矽磊晶成長
  • 固相成長

第8章 全球 3D IC市場:各產品

  • 簡介
  • MEMS/感測器
  • RF SiP
  • 光電/成像
  • 記憶體(3D堆疊)
  • 邏輯(3D SiP/SoC)
  • HB LED

第9章 全球 3D IC市場:各地區

  • 簡介
  • 北美
  • 歐洲
  • 亞太地區
  • 南美
  • 中東、非洲

第10章 競爭情形

  • 企業簡介
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • MonolithIC 3D Inc.
    • XILINX, Inc.
    • Elpida Memory, Inc.
    • Micron Technology, Inc.
    • The 3M Company,
    • Ziptronix, Inc.
    • STATS ChipPAC Ltd.
    • United Microelectronics Corporation
    • Tezzaron Semiconductor Corporation

第11章 附錄

目錄

Title:
3D ICs Market, By End-Use Sectors (Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D)), by Substrate Type (Silicon on insulator(SOI), Bulk silicon), by Fabrication Process ( Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization), by Product (MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED) and by Region (North America, Europe, Asia Pacific, RoW) - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027.

3D IC is a metal-oxide-semiconductor (MOS) integrated circuit which is produced by stacking silicon wafers or dies and connecting them vertically. These 3D ICs are manufactured by using different processes such as beam re-crystallization, wafer bonding, and solid-phase crystallization. Three dimensional integrated circuit (3D IC) are used to offer high performance, low power consumption, efficiency and increased functionality in the electronic devices. 3D ICs are used in Consumer electronics, communication technologies and military. 3D ICs are majorly used in consumer electronic devices owing to increasing trend towards compact sizes and high efficiency.

Market Dynamics

Rising awareness for energy efficient and propagation of internet of things (IoT) is expected to drive the growth of 3D ICs market over the forecast period. This is attributed to increasing demand of (IoT) devices in the market. Manufacturers are innovating their products with the help of these 3D ICs. 3D ICs are advanced technology solutions which aids in designing and development of the latest products. Manufacturers are continuously improving the consumer products by reducing the size of the devices. Moreover, these smart devices provides various features such as durability, efficiency in speed and good memory. This is expected to drive the demand of 3D ICs market over the forecast period.

Furthermore, increase in the demand for high performance and compact ICs in laptop, tablets, mobile devices, Smart TVs are also expected to drive the growth of 3D ICs market over the forecast period. Manufacturers are improving these devices by using these 3D ICs to offer high bandwidth and high performance to the end users. Additionally, the rising demand for automated products and high functionality devices are encouraging OEMs to integrate 3D ICs in their devices, which will further create lucrative opportunities for this market.

Market Taxonomy

This report segments the global 3D ICs market on the basis of end-use sectors, substrate type, fabrication process, product and region. On the basis of end-use sectors 3D ICs market is segmented into Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D). On the basis of substrate type, the global 3D ICs market is segmented into Silicon on insulator (SOI), Bulk silicon. On the basis of fabrication process, the global 3D ICs market is segmented into Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization. On the basis of product, the global 3D ICs market is segmented into MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED. On the basis of region, the global 3D ICs market is segmented into North America, Europe, Asia Pacific, ROW.

Key features of the study:

  • This report provides an in-depth analysis of the global 3D ICs market and provides market size (US$ million) and compound annual growth rate (CAGR %) for the forecast period (2020-2027), considering 2019 as the base year.
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrix for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, regional outlook, and competitive strategy adopted by leading players
  • It profiles leading players in the global 3D ICs market based on the following parameters - regulatory landscape, company overview, financial performance, product portfolio, geographical presence, distribution strategies, key developments and strategies, and future plans
  • Key companies covered in the global automotive cockpit electronics market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.
  • The market players are focusing on strategic collaborations to innovate and launch new products to meet the increasing needs and requirements of consumers.
  • Insights from this report would allow marketers and management authorities of companies to make informed decision regarding future product launches, technology upgradation, market expansion, and marketing tactics
  • The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through the various strategy matrices used in analyzing the global 3D ICs market.

Detailed Segmentation:

  • Global 3D ICs Market, By End-Use Sectors:
    • Consumer electronics
    • Information and communication technology
    • Transport (automotive and aerospace)
    • Military
    • Others(Biomedical applications and R&D)
  • Global 3D ICs Market, By Substrate Type:
    • Silicon on insulator(SOI)
    • Bulk silicon
  • Global 3D ICs Market, By Fabrication Process:
    • Beam re-crystallization
    • Wafer bonding
    • Silicon epitaxial growth
    • Solid phase crystallization
  • Global 3D ICs Market, By Process:
    • MEMS and Sensor
    • RF SiP
    • Optoelectronics and imaging
    • Memories (3D Stacks)
    • Logic (3D Sip/Soc)
    • HB LED
  • Global 3D ICs Market, By Region:
    • North America
    • Europe
    • Asia Pacific
    • Rest of World
  • Company Profiles
    • Taiwan Semiconductor Manufacturing Company, Ltd.*
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
      • Future Plans
    • MonolithIC 3D Inc.
    • XILINX, Inc.
    • Elpida Memory, Inc.
    • (Micron Technology, Inc.)
    • The 3M Company
    • Ziptronix, Inc.
    • STATS ChipPAC Ltd.
    • United Microelectronics Corporation
    • Tezzaron Semiconductor Corporation

Browse all the market data tables and figures on "Global 3D ICs Market- Forecast to 2027"

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snippet, By End-Use Sectors
    • Market Snippet, By Substrate Type
    • Market Snippet, By Fabrication Process
    • Market Snippet, By Process
    • Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
    • Restraints
    • Market Opportunities
  • Regulatory Scenario
  • Industry Trend
  • Merger and Acquisitions
  • New System Launch/Approval

4. Impact of COVID-19 Pandemic on 3D ICs Market

  • Short Term and Long Term Impact, By Region
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa

5. Global 3D ICs Market, By End- Use Sectors, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • Consumer electronics
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Information and communication technology
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Transport (automotive and aerospace)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Military
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Others (Biomedical applications and R&D)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

6. Global 3D ICs Market, By Substrate Type, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • Silicon on insulator (SOI)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Bulk silicon
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

7. Global 3D ICs Market, By Fabrication Process, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • Beam re-crystallization
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Wafer bonding
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Silicon epitaxial growth
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Solid phase crystallization
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

8. Global 3D ICs Market, By Process, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • MEMS and Sensor
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • RF SiP
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Optoelectronics and imaging
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Memories (3D Stacks)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Logic (3D Sip/Soc)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • HB LED
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

9. Global 3D ICs Market, By Region, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, By Region, 2019 and 2027 (%)
  • North America
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.S.
    • Canada
  • Europe
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.K.
    • Germany
    • Italy
    • France
    • Russia
    • Rest of Europe
  • Asia Pacific
    • Regional Trends
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • India
    • Japan
    • ASEAN
    • Australia
    • South Korea
    • Rest of Asia Pacific
  • Latin America
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • Brazil
    • Argentina
    • Mexico
    • Rest of Latin America
  • Middle East and Africa
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • GCC Countries
    • South Africa
    • Rest of the Middle East and Africa

10. Competitive Landscape

  • Company Profiles
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • MonolithIC 3D Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • XILINX, Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Elpida Memory, Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • (Micron Technology, Inc.)
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • The 3M Company,
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Ziptronix, Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • STATS ChipPAC Ltd.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • United Microelectronics Corporation
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Tezzaron Semiconductor Corporation
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates

11. Section

  • References
  • Research Methodology
  • About Us and Sales Contact