市場調查報告書

全球半導體組裝、檢驗服務(SATS)市場:各服務、包裝解決方案、用途、地區 - 市場規模,佔有率,預測,及機會分析

Semiconductor Assembly and Testing Services Market, By Service, By Packaging Solutions, By Application, and by Region - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027

出版商 Coherent Market Insights 商品編碼 927609
出版日期 內容資訊 英文 130 Pages
商品交期: 2-3個工作天內
價格
全球半導體組裝、檢驗服務(SATS)市場:各服務、包裝解決方案、用途、地區 - 市場規模,佔有率,預測,及機會分析 Semiconductor Assembly and Testing Services Market, By Service, By Packaging Solutions, By Application, and by Region - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027
出版日期: 2020年02月07日內容資訊: 英文 130 Pages
簡介

全球半導體組裝、檢驗服務(SATS)市場在2018年估算為4,830億美金,2019年預計將增加到5,170億美元的規模。技術進步伴隨的對家用電器產品的持續性需求,帶動該市場成長。行動電話和平板電腦的先進開發,預期成為SATS的潛在市場,由於行動的增加和數位內容的增加,在預測期間內促進該市場的成長。

本報告提供全球半導體組裝、檢驗服務(SATS)市場的相關調查,市場機會和趨勢,成長及阻礙因素,各服務、包裝解決方案、用途、地區的市場分析,競爭情形,主要企業的簡介等資訊。

目錄

第1章 調查目的、前提條件

  • 調查目的
  • 前提條件
  • 簡稱

第2章 市場預測

  • 報告概要
    • 市場定義和範圍
  • 摘要整理
    • 各類服務
    • 各包裝
    • 各用途
    • 各地區
  • Coherent Opportunity Map (COM)

第3章 市場動態,法規,趨勢分析

  • 市場動態
    • 成長要素
    • 阻礙因素
    • 市場機會
  • 法規方案
  • 產業趨勢
  • 合併和收購
  • 新的系統的銷售/核准

第4章 市場分析:各類服務

  • 概要
  • 組裝、包裝服務
  • 檢驗服務

第5章 市場分析:各包裝解決方案

  • 概要
  • 金線/銅線綁定
  • 銅夾
  • 覆晶
  • 晶圓等級包裝
  • TSV

第6章 市場分析:各用途

  • 概要
  • 通訊
  • 運算、網路
  • 家電
  • 工業
  • 汽車電子產品

第7章 市場分析:各地區

  • 概要
  • 北美
  • 歐洲
  • 亞太地區
  • 南美
  • 中東、非洲

第8章 競爭情形

  • 企業簡介
    • ASE Group
    • Powertech Technology Inc.
    • Global Foundries Inc.
    • Amkor Technology Inc.
    • CORWIL Technology Corp.
    • Integrated Microelectronics Inc. (Psi Technologies Inc.)
    • STATS chipPAC Ltd. (JCET)
    • Chipbond Technology Corporation
    • Silicon Precision Industries Company Ltd.

第9章 Section

  • 參考文獻
  • 調查方法
  • 關於本公司、聯絡處
目錄

The semiconductor industry is rapidly and unpredictably changing. Most of the companies in this industry are fabless companies, these companies leverage their resources and use their experience to improve the performance of the semiconductors chips. However, assembly and testing packaging services are outsourced to third parties. Semiconductor assembly and testing services offered to various industries such as communication, automobile sectors and in consumer electronics. A semiconductor material has conductivity value between conductor and insulator. Increasing adoption for mobile and connected services has increased the demand of smartphones and tablets with each internet can be accessed.

Market Dynamics

The ongoing demand for consumer electronics with the advancement in technology is driving the growth of global semiconductor assembly and testing services market. High development of cell phones and tablets are the potential markets for SATS. Increasing mobility and growing digital content is expected to drive the growth of global semiconductor assembly and testing services market growth during the forecast period. For instance, according to CMI analysis, the global semiconductor sectors total revenue is increased from USD483 billion in 2018 to USD517 billion in 2019.Increasing demand for automotive electronics in the upcoming generation cars built with electronic components, system to enhance car safety, and management system are driving the growth of global semiconductor assembly and testing services market. Rising adoption of latest technologies in navigation, hybrid electric driver, and in LED creates demand for this market.

Market Taxonomy

This report segments the global semiconductor assembly and testing services market on the basis of by service, by application, and region. On the basis of service, global semiconductor assembly testing and services market is segmented into assembly & packaging services and testing services. On the basis packaging solutions, the global semiconductor assembly and testing services market is segmented into Copper Wire and Gold Wire Bonding, Copper Clip, Flip Chip, Wafer Level Packaging and TSV. On the basis application, the global semiconductor assembly and testing services market is segmented into communication, computing & networking, consumer electronics, industrial and automotive electronics. On the basis of region, global semiconductor assembly and testing services market is segmented into North America, Latin America, Europe, Asia pacific, Middle East and Africa.

Key features of the study:

  • This report provides an in-depth analysis of the global semiconductor assembly and testing services market and provides market size (US$ million) and compound annual growth rate (CAGR %) for the forecast period (2019-2027), considering 2018 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrix for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, regional outlook, and competitive strategy adopted by leading players
  • It profiles leading players in the global boat steering system market based on the following parameters - regulatory landscape, company overview, financial performance, product portfolio, geographical presence, distribution strategies, key developments and strategies, and future plans
  • Key companies covered in the Global Semiconductor Assembly and Testing Services Market includes ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
  • These key market players are focusing on collaboration strategy with other market leaders to innovate and launch new products to meet the increasing needs and requirements of consumers.
  • Insights from this report would allow marketers and management authorities of companies to make informed decision regarding future product launches, technology upgradation, market expansion, and marketing tactics
  • The global semiconductor assembly and testing services market report caters to various stakeholders in this industry including investors, suppliers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through the various strategy matrices used in analyzing the global boat steering system market.

Detailed Segmentation:

  • Global Semiconductor Assembly and Testing Services Market, By Service:
    • Assembly & Packaging Services
    • Testing Services
  • Global Semiconductor Assembly and Testing Services Market, By Packaging Solutions:
    • Copper Wire and Gold Wire Bonding,
    • Copper Clip,
    • Flip Chip,
    • Wafer Level Packaging
    • TSV
  • Global, Semiconductor Assembly and Testing Services Market, By Application:
    • Communication
    • Computing & Networking
    • Consumer Electronics
    • Industrial
    • Automotive Electronics
  • Global Semiconductor Assembly and Testing Services Market, By Region:
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa
  • Company Profiles
    • ASE Group*
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
      • Future Plans
    • Powertech Technology Inc.
    • Global Foundries Inc.
    • Amkor Technology Inc.
    • CORWIL Technology Corp.
    • Integrated Microelectronics Inc. (Psi Technologies Inc.)
    • STATS chipPAC Ltd. (JCET)
    • Chipbond Technology Corporation
    • Silicon Precision Industries Company Ltd.

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snippet, By Service
    • Market Snippet, By Packaging
    • Market Snippet, By Application
    • Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
    • Restraints
    • Market Opportunities
  • Regulatory Scenario
  • Industry Trend
  • Merger and Acquisitions
  • New system Launch/Approvals

4. Global Semiconductor Assembly and Testing Services Market, By Service, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Assembly & Packaging Services
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Testing Services
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)

5. Global Semiconductor Assembly and Testing Services Market, By Packaging Solutions , 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Copper Wire and Gold Wire Bonding
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Copper Clip
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Flip Chip
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Wafer Level Packaging
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • TSV
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)

6. Global Semiconductor Assembly and Testing Services Market, By Application, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Communication
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Computing & Networking
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Consumer Electronics
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Industrial
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Automotive Electronics
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends

7. Global Semiconductor Assembly and Testing Services Market, By Region, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, By Region, 2017 and 2027 (%)
  • North America
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.S.
    • Canada
  • Europe
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.K.
    • Germany
    • Italy
    • France
    • Russia
    • Rest of Europe
  • Asia Pacific
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • China
    • India
    • Japan
    • ASEAN
    • Australia
    • South Korea
    • Rest of Asia Pacific
  • Latin America
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • Brazil
    • Argentina
    • Mexico
    • Rest of Latin America
  • Middle East and Africa
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • GCC Countries
    • South Africa
    • Rest of the Middle East and Africa

8. Competitive Landscape

  • Company Profiles
    • ASE Group
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Powertech Technology Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Global Foundries Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Amkor Technology Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • CORWIL Technology Corp.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Integrated Microelectronics Inc. (Psi Technologies Inc.)
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • STATS chipPAC Ltd. (JCET)
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Chipbond Technology Corporation
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Silicon Precision Industries Company Ltd.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates

9. Section

  • References
  • Research Methodology
  • About us and Sales Contact