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市場調查報告書

CPO(Co-Packaged Optics)的全球市場(2021-2030)

Co-Packaged Optics Markets 2021-2030

出版商 CommunicatioCommunins Industry Researchers (CIR) 商品編碼 966844
出版日期 內容資訊 英文 55 Pages
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CPO(Co-Packaged Optics)的全球市場(2021-2030) Co-Packaged Optics Markets 2021-2030
出版日期: 2020年12月14日內容資訊: 英文 55 Pages
簡介

CPO(Co-Packaged Optics)是一種技術概念,它將光子學器件和電子開關組合到一個封裝中,以降低功耗,提高熱效率並減小尺寸。通過與高速光通信網絡,高性能計算(HPC)和存儲功能相鏈接□□,作為有前途的技術領域,人們的興趣日益濃厚,有望在未來得到有效利用和市場增長。

本報告分析了CPO(Co-Packaged Optics)的技術進步和市場增長前景,涉及該技術的概述和主要組成部分,未來的應用領域和主要問題以及CPO的發展和傳播。我們將為您提供信息,例如組織和公司的趨勢,市場規模趨勢(過去和未來5年)以及按技術和應用劃分的詳細趨勢。

目錄

執行摘要

第1章簡介

第2章技術評估

  • "聯合包裝" (co-packaging)的概念:為什麼需要
    • SERDES的簡化
    • 功耗和熱量優化
    • 設備密度
    • CPO技術問題
  • CPO質量和可靠性問題
  • CPO設備組件
    • 連接器
    • 光源:VCSEL,量子激光器等
    • 中介層和波導技術的使用
    • 新包裝技術
    • 在ASIC/小芯片/CPO之間切換
    • CPO向基板
  • CPO設備/系統檢查
  • 結論

第3章CPO合作和其他組織

  • CPO合作
    • 參與公司和代表
    • 未來設計元素的開放規範
    • 向ASIC/交換機製造商發送消息
    • 對光子學/數據通信行業的影響
  • OIF/EPIC/其他相關組織
  • 結論

第4章市場評估和預測(過去/未來5年)

  • 上市時間:CPO路線圖
  • 數據中心CPO的市場預測
    • 400G
    • 800G
    • Terrabit網絡
  • 面向公共網絡的CPO的市場預測
  • 計算機CPO的市場預測
    • 高性能計算(HPC)和超級計算機
    • 存儲系統
    • 人工智能(AI)/機器學習
  • 其他

第5章公司資料

  • ASE Group
  • Broadcom
  • Cisco
  • Corning
  • Facebook
  • IBM
  • Intel
  • Juniper
  • Kaiam
  • Microsoft
  • POET Technologies
  • Rain Tree Photonics
  • Ranovus
  • Rockley Photonics
  • Samtec
  • Senko
  • TE Connectivity
  • vario-optics ag
  • Rain Tree Photonics
目錄

Co-packaged optics markets are is an increasingly attracting technology supporting high-speed optical networks, high-performance computing and storage applications by bringing photonics devices and electronic switching together in a single package to reduce power consumption and thermal effects, while at the same time reducing footprints.

This report provides CIR's assessment and five-year forecast of the new revenue opportunities created by co-packaged optics with special focus on transceivers for data centers for 400G, 800G and Terabit connectivity. The report also provides coverage of critical components in the co-packaged optics including novel light sources, substrate materials, etc. We also discuss the various options for fitting the latest ASICs and transceivers into a single package.

The report also contains a review of the organizations that are shaping the co-packaged optics sector including the Co-Packaged Collaboration, OIF and EPIC

Table of Contents

Executive Summary

Chapter One: Introduction

  • 1.1. Background to this report
  • 1.2. Goal and scope of this report
  • 1.3. Methodology of this report
  • 1.4. Plan of this report

Chapter Two: Technology Assessment

  • 2.1. The co-packaging concept: Why we need it
    • 2.1.1. SERDES simplification
    • 2.1.2. Power consumption and thermal optimization
    • 2.1.3. Device density
    • 2.1.4. Technical challenges for Co-packaged optics
  • 2.2. Quality and reliability issues with co-packaged optics
  • 2.3. Components for co-packaged optics devices
    • 2.3.1. Connectors
    • 2.3.2. Light sources: VCSELs, quantum lasers, etc.
    • 2.3.3. Use of interposer and waveguide technology
    • 2.3.4. Emerging packaging technology
    • 2.3.5. Switching ASIC, chiplets and co-packaged optics
    • 2.3.6. Substrates for co-packaged optics
  • 2.4. Testing co-packaged optics devices and systems
  • 2.5. Key points from this chapter

Chapter Three: The Co-Package Collaboration and Other Organizations

  • 3.1. The Co-Packaged Collaboration
    • 3.1.1. Membership and who the Collaboration represents
    • 3.1.2. The future of open specifications for design elements
    • 3.1.3. Messaging to ASIC and switch makers
    • 3.1.4. Implications for the photonics and datacom industries
  • 3.2. OIF, EPIC and other relevant organizations
  • 2.4. Key points from this chapter

Chapter Four: Five-year Market Assessment and Five-year Forecast

  • 4.1. Time to market: A co-packaged roadmap
  • 4.2. Market forecasts of co-packaged optics in the data center
    • 4.2.1. 400G
    • 4.2.2. 800G
    • 4.2.3. Terabit networks
  • 4.3. Market forecasts for co-packaged optics in public networks
  • 4.4. Market forecasts for co-packaged optics in computinh
    • 4.4.1. High-performance computing and supercomputing
    • 4.4.2. Storage systems
    • 4.4.3. AI and machine learning
  • 4.5. Other

Chapter Five: Profiles

  • 5.1. ASE Group
  • 5.2. Broadcom
  • 5.3. Cisco
  • 5.4. Corning
  • 5.5. Facebook
  • 5.6. IBM
  • 5.7. Intel
  • 5.8. Juniper
  • 5.9. Kaiam
  • 5.10. Microsoft
  • 5.11. POET Technologies
  • 5.12. Rain Tree Photonics
  • 5.13. Ranovus
  • 5.14. Rockley Photonics
  • 6.15. Samtec
  • 5.16. Senko
  • 5.17. TE Connectivity
  • 5.18. vario-optics ag
  • 5.19. Rain Tree Photonics