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耐放射線性電子產品的全球市場 (2020-2025年):各製造技術、零組件、終端用戶、地區

Global Radiation-Hardened Electronics Market: Focus on Manufacturing Technique, Component, and End User - Analysis and Forecast, 2020-2025

出版商 BIS Research Inc. 商品編碼 986506
出版日期 內容資訊 英文 237 Pages
商品交期: 最快1-2個工作天內
價格
耐放射線性電子產品的全球市場 (2020-2025年):各製造技術、零組件、終端用戶、地區 Global Radiation-Hardened Electronics Market: Focus on Manufacturing Technique, Component, and End User - Analysis and Forecast, 2020-2025
出版日期: 2021年01月27日內容資訊: 英文 237 Pages
簡介

全球耐放射線性電子產品的市場在預測期間內預計以3.90%的年複合成長率發展,成長到2025年19億3000萬美元的規模。各地區中,北美地區顯示33.15%的佔有率,在預測期間內預計領導市場。

本報告提供全球耐放射線性電子產品的市場調查,市場定義和概要,新型冠狀病毒感染疾病 (COVID-19) 以及其他的市場影響因素分析,技術、專利趨勢,必要條件、法律規章比較,市場規模的變化、預測,製造技術、零組件、終端用戶、地區/主要國家等各種區分的明細,競爭環境,主要企業簡介等彙整資訊。

摘要整理

第1章 市場動態

  • 市場成長的促進因素
  • 市場成長的阻礙因素
  • 市場機會

第2章 競爭考察

  • 主要市場展開、策略
  • 競爭基準
  • 市場佔有率分析

第3章 產業分析

  • 產業概要
  • 標準的必要條件、規定比較:各終端用戶
  • 新技術的影響
  • 製造商、認證
  • 專利分析
  • 供應鏈分析
  • COVID-19的影響

第4章 全球市場分析、預測

  • 假設、規定
  • 市場概要

第5章 市場分析、預測:各製造技術

  • RHBD (設計的耐放射線性)
  • RHBP (流程的耐放射線性)
  • RHBS (軟體的耐放射線性)

第6章 市場分析、預測:各零件

  • 微處理器、控制器
  • 離散半導體
  • 電源
  • 記憶體
  • FPGA
  • 類比訊號、混合訊號
  • 感測器
  • ASIC
  • 其他

第7章 市場分析、預測:各終端用戶

  • 宇宙
    • 衛星
    • 發射機
  • 軍隊
    • 飛彈
    • 防衛車輛
    • 彈藥
  • 核能發電廠
  • 航太
  • 其他

第8章 市場分析、預測:各地區、主要國家

  • 北美
  • 歐洲
  • 亞太地區
  • 其他地區

第9章 企業簡介

  • 3D Plus (HEICO Corporation)
  • Analog Devices Inc.
  • Anaren Inc. (TTM Technologies)
  • BAE Systems
  • Cobham plc
  • Data Device Corporation
  • Honeywell International Inc.
  • IBM Corporation
  • Infineon Technologies Inc.
  • Microchip Technology Inc.
  • Micropac Industries Inc.
  • Renesas Electronics Corporation
  • Solid State Devices Inc.
  • STMicroelectronics N.V
  • Texas Instruments Inc
  • Teledyne Technologies Incorporated.
  • The Boeing Company
  • Xilinx Inc.
  • Other Key Players

第10章 調查範圍、調查手法

第11章 附錄

目錄
Product Code: DSM0670SB

"Global Radiation-Hardened Electronics Market Value to Reach $1.93 Billion by 2025."

Key Questions Answered in this Report:

  • What are the trends in the global radiation hardened electronics market across different regions?
  • What are the major driving forces expected to increase the demand for radiation hardened electronics during the forecast period 2020-2025?
  • What are the major challenges inhibiting the growth of the radiation hardened electronics market?
  • What was the revenue generated in the global radiation hardened electronics market by various segments in 2019, and what are the estimates by 2025?
  • Which end-user of the radiation hardened electronics market (Space, Military, Nuclear Power Plants, Aerospace, Other (Healthcare and Mining)) is expected to dominate the market in the coming years?
  • What is the estimated revenue to be generated by the global radiation hardened electronics market across different regions (North America, Europe, Asia-Pacific, and Rest-of-the-World) during the forecast period?
  • Who are the key players in the global radiation hardened electronics market, and what are the new strategies that are being adopted by them to make a mark in the industry?
  • What major opportunities do the radiation hardened electronics market companies foresee in the next ten years?
  • What is the impact of COVID-19 on the electronics and manufacturing value chain in upstream, midstream, and downstream parts?
  • What is the competitive strength of the key leading players in the radiation hardened electronics market?

Global Radiation-Hardened Electronics Market Forecast, 2020-2025

The global radiation-hardened electronics industry analysis by BIS Research projects the market to have growth with CAGR of 3.90% based on the values during the forecast period from 2020 to 2025. The North America region is expected to dominate the market by 2025 with a share of 33.15%. The North America region includes the U.S. and Canada, but the U.S. is expected to acquire a major share in 2025 due to the increase in the investment of companies in the country.

The radiation-hardened electronics market has gained huge importance in the past few years. This is due to the rising demand for commercial COTS applications of rad-hard components. Several agencies and research organizations and industry players are engaged in developing software-defined rad-hard components.

Scope of the Global Radiation-Hardened Electronics Market

The global radiation-hardened electronics market research provides the market information for segmentation such as the manufacturing technique, component, and end user. The market is also divided depending upon the end-user as space, military, nuclear power plants, aerospace, and other (healthcare and mining) where space is sub-segmented in satellite and launch vehicle and the military is sub-segmented as missiles, defense vehicle, and munitions. The market analysis examines the radiation hardened electronics market outlook in terms of the trends, driving forces, opportunities, technological advancements, and competitive benchmarking, among others.

The report further takes into consideration the market and business dynamics, along with the detailed product contribution of the key players operating in the market.

Global Radiation-Hardened Electronics Market Segmentation

The report constitutes an extensive study of the radiation-hardened electronics industry. The report largely focuses on providing market information for radiation hardened electronics covering various segments, manufacturing techniques, components, end-user, and regions. The manufacturing technique included rad-hard by design (RHBD), rad-hard by process (RHBP), and rad-hard by software (RHBS). the component type was classified into microprocessors and controllers, sensors, application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), memory, power sources, discrete semiconductors, analog and mixed signals, others (optoelectronics, rectifiers, and fets). The market is further segmented into five end-use, namely space, military, nuclear power plants, aerospace, other (healthcare and mining).

The radiation-hardened electronics is segregated by region under four major regions, namely North America, Europe, APAC, and Rest-of-the-World. Data for each of these regions (by country) is provided.

Key Companies in the Global Radiation-Hardened Electronics Industry

The key players in the global radiation-hardened electronics market include Analog Devices Inc., BAE System, Cobham PLc, Honeywell, IBM, Infineon, Microchip, Renesas, ST Microelectronics, Texas, Boeing, Xilinx Inc., Maxwell, Psemi Corporation, Teledyne E2v Semiconductors, 3d Plus, Micropac Industries, Inc, Anaren Inc, Tt Electronics Plc, Data Device Corporation (Transdigm), and Solid-State Devices, Inc. (SSDI).

Table of Contents

Executive Summary

1 Market Dynamics

  • 1.1 Drivers
    • 1.1.1 Rising Satellite Launches and Deep Space Activities
    • 1.1.2 Establishment of Autonomous Military Operations in Hostile Environment
    • 1.1.3 Growing Demand for Radiation-Hardened Electronics in Nuclear and Healthcare Industry
  • 1.2 Market Restraints
    • 1.2.1 High Initial Investment
    • 1.2.2 Difficulties in Creating Real Testing Environment
  • 1.3 Opportunities
    • 1.3.1 Increasing Demand for COTS Radiation-Hardened Electronics in Different Verticals
    • 1.3.2 Rising Requirement for Reconfigurable Radiation-Hardened Electronics

2 Competitive Insights

  • 2.1 Key Market Strategies and Development
    • 2.1.1 Partnerships, Collaborations, Contracts, and M&A
    • 2.1.2 New Product Launches and Other Developments
  • 2.2 Competitive Benchmarking
  • 2.3 Market Share Analysis

3 Industry Analysis

  • 3.1 Industry Overview
  • 3.2 Comparison of Radiation-Hardened Products Standard Requirements and Regulations (by End User)
  • 3.3 Impact of New Technologies on Radiation-Hardened Electronics in New Space
  • 3.4 Radiation-Hardened Electronics Manufacturers and Certifications
  • 3.5 Patent Analysis
  • 3.6 Supply Chain Analysis
  • 3.7 Impact of COVID-19 On Radiation-Hardened Electronics Market
    • 3.7.1 COVID-19 Effect on Manufacturing Sector

4 Global Radiation-Hardened Electronics Market, 2020 to 2025

  • 4.1 Assumptions and Limitations
  • 4.2 Market Overview

5 Global Radiation-Hardened Electronics Market (by Manufacturing Technique)

  • 5.1 Market Overview (by Manufacturing Technique)
    • 5.1.1 Rad-Hard by Design (RHBD)
    • 5.1.2 Rad-Hard by Process (RHBP)
    • 5.1.3 Rad-Hard by Software (RHBS)

6 Global Radiation-Hardened Electronics Market (by Component)

  • 6.1 Market Overview
    • 6.1.1 Microprocessors and Controllers
    • 6.1.2 Discrete Semiconductors
    • 6.1.3 Power Sources
    • 6.1.4 Memory
    • 6.1.5 Field-Programmable Gate Array
    • 6.1.6 Analog and Mixed Signals
    • 6.1.7 Sensors
    • 6.1.8 Application-Specific Integrated Circuit
    • 6.1.9 Others

7 Global Radiation-Hardened Electronics Market (by End User)

  • 7.1 Market Overview
  • 7.2 Space
    • 7.2.1 Satellite
    • 7.2.2 Launch Vehicles
  • 7.3 Military
    • 7.3.1 Missiles
    • 7.3.2 Defense vehicle
    • 7.3.3 Munitions
  • 7.4 Nuclear Power Plant
  • 7.5 Aerospace
  • 7.6 Others

8 Global Radiation-Hardened Electronics Market (by Region)

  • 8.1 Market Overview
  • 8.2 North America
    • 8.2.1 North America Radiation-Hardened Electronics Market Size (by End User)
    • 8.2.2 North America Radiation-Hardened Electronics Market Size (by Component)
    • 8.2.3 North America Radiation-Hardened Electronics Market Size (by Manufacturing Technique)
    • 8.2.4 North America Radiation-Hardened Electronics Market Size (by Country)
      • 8.2.4.1 U.S.
        • 8.2.4.1.1 U.S. Radiation-Hardened Electronics Market (by End User)
        • 8.2.4.1.2 U.S. Radiation-Hardened Electronics Market (by Component)
        • 8.2.4.1.3 U.S. Radiation-Hardened Electronics Market (by Manufacturing Technique)
      • 8.2.4.2 Canada
        • 8.2.4.2.1 Canada Radiation-Hardened Electronics Market (by End User)
        • 8.2.4.2.2 Canada Radiation-Hardened Electronics Market (by Component)
        • 8.2.4.2.3 Canada Radiation-Hardened Electronics Market (by Manufacturing Technique)
  • 8.3 Europe
    • 8.3.1 Europe Radiation-Hardened Electronics Market (by End User)
    • 8.3.2 Europe Radiation-Hardened Electronics Market (by Component)
    • 8.3.3 Europe Radiation-Hardened Electronics Market (by Manufacturing Technique)
    • 8.3.4 Europe (by Country)
      • 8.3.4.1 U.K.
        • 8.3.4.1.1 U.K. Radiation-Hardened Electronics Market (by End User)
      • 8.3.4.2 Germany
        • 8.3.4.2.1 Germany Radiation-Hardened Electronics Market (by End User)
      • 8.3.4.3 France
        • 8.3.4.3.1 France Radiation-Hardened Electronics Market (by End User)
      • 8.3.4.4 Russia
        • 8.3.4.4.1 Russia Radiation-Hardened Electronics Market (by End User)
      • 8.3.4.5 Spain
        • 8.3.4.5.1 Spain Radiation-Hardened Electronics Market (by End User)
      • 8.3.4.6 Rest-of-Europe
        • 8.3.4.6.1 Rest-of-Europe Radiation-Hardened Electronics Market (by End User)
  • 8.4 Asia-Pacific
    • 8.4.1 Asia-Pacific Radiation-Hardened Electronics Market (by End User)
    • 8.4.2 Asia-Pacific Radiation-Hardened Electronics Market (by Component)
    • 8.4.3 Asia-Pacific Radiation-Hardened Electronics Market (by Manufacturing Technique)
    • 8.4.4 Asia-Pacific (by Country)
      • 8.4.4.1 China
        • 8.4.4.1.1 China Radiation-Hardened Electronics Market (by End User)
      • 8.4.4.2 Japan
        • 8.4.4.2.1 Japan Radiation-Hardened Electronics Market (by End User)
      • 8.4.4.3 South Korea
        • 8.4.4.3.1 South Korea Radiation-Hardened Electronics Market (by End User)
      • 8.4.4.4 Australia
        • 8.4.4.4.1 Australia Radiation-Hardened Electronics Market (by End User)
      • 8.4.4.5 India
        • 8.4.4.5.1 India Radiation-Hardened Electronics Market (by End User)
      • 8.4.4.6 Rest-of-Asia-Pacific
        • 8.4.4.6.1 Rest-of-Asia-Pacific Radiation-Hardened Electronics Market (by End User)
  • 8.5 Rest-of-the-World
    • 8.5.1 Rest-of-the-World Radiation-Hardened Electronics Market (by End User)
    • 8.5.2 Rest-of-the-World Radiation-Hardened Electronics Market (by Component)
    • 8.5.3 Rest-of-the-World Radiation-Hardened Electronics Market (by Manufacturing Technique)
    • 8.5.4 Rest-of-the-World Radiation-Hardened Electronics Market (by Country)
      • 8.5.4.1 Brazil
        • 8.5.4.1.1 Brazil Radiation-Hardened Electronics Market (by End User)
      • 8.5.4.2 U.A.E
        • 8.5.4.2.1 U.A.E. Radiation-Hardened Electronics Market (by End User)
      • 8.5.4.3 South Africa
        • 8.5.4.3.1 South Africa Radiation-Hardened Electronics Market (by End User)
      • 8.5.4.4 Mexico
        • 8.5.4.4.1 Mexico Radiation-Hardened Electronics Market (by End User)
      • 8.5.4.5 Others
        • 8.5.4.5.1 Others Radiation-Hardened Electronics Market (by End User)

9 Company Profiles

  • 9.1 3D Plus (HEICO Corporation)
    • 9.1.1 Company Overview
    • 9.1.2 Financial Overview
    • 9.1.3 Product Portfolio
    • 9.1.4 Strategic Overview
    • 9.1.5 SWOT Analysis of 3D Plus (HEICO Corporation)
  • 9.2 Analog Devices Inc.
    • 9.2.1 Company Overview
    • 9.2.2 Financial Overview
    • 9.2.3 Product Portfolio
    • 9.2.4 Strategic Overview
      • 9.2.4.1 Conferences and Expo
      • 9.2.4.2 Business Collaboration
    • 9.2.5 SWOT Analysis of Analog Devices
  • 9.3 Anaren Inc. (TTM Technologies)
    • 9.3.1 Company Overview
    • 9.3.2 Financial Overview
    • 9.3.3 Product Portfolio
    • 9.3.4 SWOT Analysis: Anaren Inc. (TTM Technologies)
  • 9.4 BAE Systems
    • 9.4.1 Company Overview
    • 9.4.2 Product Portfolio
    • 9.4.3 Financial Overview
    • 9.4.4 Strategic Overview
      • 9.4.4.1 New Product Launch
    • 9.4.5 SWOT Analysis of BAE Systems
  • 9.5 Cobham plc
    • 9.5.1 Company Overview
    • 9.5.2 Financial Overview
    • 9.5.3 Product Portfolio
    • 9.5.4 Business Strategies
    • 9.5.5 SWOT Analysis of Cobham PLC
  • 9.6 Data Device Corporation
    • 9.6.1 Company Overview
    • 9.6.2 Product Portfolio
    • 9.6.3 Business Strategies
    • 9.6.4 SWOT Analysis: Data Device Corporation
  • 9.7 Honeywell International Inc.
    • 9.7.1 Company Overview
    • 9.7.2 Financial Overview
    • 9.7.3 Product Portfolio
    • 9.7.4 Corporate Strategies
      • 9.7.4.1 Contract
    • 9.7.5 SWOT Analysis: Honeywell
  • 9.8 IBM Corporation
    • 9.8.1 Company Overview
    • 9.8.2 Financial Overview
    • 9.8.3 Product Portfolio
    • 9.8.4 SWOT: IBM Corporation
  • 9.9 Infineon Technologies Inc.
    • 9.9.1 Company Overview
    • 9.9.2 Financial Overview
    • 9.9.3 Product Portfolio
    • 9.9.4 Business Strategies
    • 9.9.5 SWOT: Infineon Technologies Inc
  • 9.1 Microchip Technology Inc.
    • 9.10.1 Company Overview
    • 9.10.2 Financial Overview
    • 9.10.3 Product Portfolio
    • 9.10.4 Business Strategies
    • 9.10.5 SWOT: Microchip Technology Inc
  • 9.11 Micropac Industries Inc.
    • 9.11.1 Company Overview
    • 9.11.2 Product Portfolio
    • 9.11.3 Strength and Weakness of Micropac Industries Inc.
  • 9.12 Renesas Electronics Corporation
    • 9.12.1 Company Overview
    • 9.12.2 Financial Overview: Renesas Electronics Corporation
    • 9.12.3 Product Portfolio
    • 9.12.4 Business Strategies
    • 9.12.5 SWOT: Renesas Electronics Corporation
  • 9.13 Solid State Devices Inc.
    • 9.13.1 Company Overview
    • 9.13.2 Product Portfolio
    • 9.13.3 Business Strategies
      • 9.13.3.1 New Product Launch
    • 9.13.4 SWOT: Solid State Devices
  • 9.14 STMicroelectronics N.V
    • 9.14.1 Company Overview
    • 9.14.2 Financial Overview
    • 9.14.3 Product Portfolio
    • 9.14.4 Business Strategies
    • 9.14.5 SWOT: STMicroelectronics N.V.
  • 9.15 Texas Instruments Inc
    • 9.15.1 Company Overview
    • 9.15.2 Financial Overview
    • 9.15.3 Product Portfolio
    • 9.15.4 Business Strategies
    • 9.15.5 SWOT: Texas Instruments Inc.
  • 9.16 Teledyne Technologies Incorporated.
    • 9.16.1 Company Overview
    • 9.16.2 Financial Overview
    • 9.16.3 Product Portfolio
    • 9.16.4 Business Strategies
    • 9.16.5 SWOT: Teledyne Technologies
  • 9.17 The Boeing Company
    • 9.17.1 Company Overview
    • 9.17.2 Financial Overview
    • 9.17.3 Product Portfolio
    • 9.17.4 Business Strategies
    • 9.17.5 SWOT: The Boeing Company.
  • 9.18 Xilinx Inc.
    • 9.18.1 Company Overview
    • 9.18.2 Financial Overview
    • 9.18.3 Product Portfolio
    • 9.18.4 Business Strategies
    • 9.18.5 SWOT: Xilinx Inc
  • 9.19 Other Key Players
    • 9.19.1 AIS Tech Space
    • 9.19.2 Hiber Global
    • 9.19.3 Hera Systems
    • 9.19.4 Helios Wire
    • 9.19.5 Kepler Communications
    • 9.19.6 Swarm Technology
    • 9.19.7 Sen
    • 9.19.8 Unseen Labs

10 Research Scope and BIS Methodology

  • 10.1 Scope of the Report
  • 10.2 Global Radiation-Hardened Electronics Market Research Methodology

11 Appendix

  • 11.1 Related Reports

List of Tables

  • Table 1: Market Snapshot: Global Radiation-Hardened Electronics Market, $Million, 2019 and 2025
  • Table 2: Comparison between COTS and QML Rad-Hard
  • Table 3: Partnerships, Collaborations, Contracts, and M&A
  • Table 4: New Product Launches and Other Developments
  • Table 5: End User Specification, Requirements
  • Table 6: List of Certifications
  • Table 7: Major Patents Granted for Radiation-Hardened Electronics
  • Table 8: Global Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025
  • Table 9: Global Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Table 10: Global Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 11: Global Radiation-Hardened Electronics Market (by Region), $Million, 2019-2025
  • Table 12: North America Radiation-Hardened Market (by End User), $Million, 2019-2025
  • Table 13: North America Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 14: North America Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 15: North America Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Table 16: North America Radiation-Hardened Market (by Manufacturing Technique), $Million, 2019-2025
  • Table 17: U.S. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 18: U.S. Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 19: U.S. Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 20: U.S. Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Table 21: U.S. Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025
  • Table 22: Canada Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 23: Canada Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 24: Canada Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 25: Canada Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Table 26: Canada Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025
  • Table 27: Europe Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 28: Europe Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 29: Europe Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 30: Europe Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Table 31: Europe Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025
  • Table 32: U.K. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 33: Germany Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 34: France Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 35: Russia Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 36: Spain Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 37: Rest-of-Europe Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 38: Asia-Pacific Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 39: Asia-Pacific Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 40: Asia-Pacific Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 41: Asia-Pacific Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Table 42: Asia-Pacific Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025
  • Table 43: China Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 44: Japan Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 45: South Korea Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 46: Australia Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 47: India Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 48: Rest-of-Asia-Pacific Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 49: Rest-of-the-World Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 50: Rest-of-the-World Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 51: Rest-of-the-World Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025
  • Table 52: Rest-of-the-World Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Table 53: Rest-of-the-World Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025
  • Table 54: Brazil Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 55: U.A.E. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 56: South Africa Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 57: Mexico Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 58: Others Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Table 59: 3D Plus (HEICO Corporation): Product Portfolio
  • Table 60: Contract
  • Table 61: Analog Devices: Product Portfolio
  • Table 62: Conferences and Expo
  • Table 63: Business Collaboration
  • Table 64: Anaren Inc. (TTM Technologies): Product Portfolio
  • Table 65: BAE Systems Product Portfolio
  • Table 66: New Product Launch
  • Table 67: Cobham PLC: Product Portfolio
  • Table 68: Business Strategies
  • Table 69: Data Device Corporation: Product Portfolio
  • Table 70: Business Strategies
  • Table 71: Honeywell International Inc.: Product Portfolio
  • Table 72: Long Term Contract
  • Table 73: IBM Corporation Product Portfolio
  • Table 74: Infineon Technologies Inc.: Product Portfolio
  • Table 75: Infineon Technologies Inc..: Long Term Agreement
  • Table 76: Microchip Technology Inc: Product Portfolio
  • Table 77: Acquisition
  • Table 78: Micropac Industries Inc.: Product Portfolio
  • Table 79: Renesas Electronics Corporation: Product Portfolio
  • Table 80: Product Developments
  • Table 81: Solid State Devices: Product Portfolio
  • Table 82: New Product Launch
  • Table 83: STMicroelectronics N.V.: Product Portfolio
  • Table 84: New Product Launch
  • Table 85: Texas Instruments Inc.: Product Portfolio
  • Table 86: Internal Management
  • Table 87: Teledyne Technologies Incorporated: Product Portfolio
  • Table 88: Business Strategies
  • Table 89: The Boeing Company: Product Portfolio
  • Table 90: Licensing
  • Table 91: Xilinx Inc.: Product Portfolio
  • Table 92: Collaboration

List of Figures

  • Figure 1: Global Radiation-Hardened Electronics Market, $Million, 2019-2025
  • Figure 2: Global Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025
  • Figure 3: Global Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025
  • Figure 4: Global Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025
  • Figure 5: Global Radiation-Hardened Electronics Market (by Region), 2019-2025
  • Figure 6: Market Dynamics Snapshot
  • Figure 7: Satellites Launches, 2014-2019
  • Figure 8: Key Strategies Adopted by Market Players
  • Figure 9: Competitive Benchmarking, 2019
  • Figure 10: Market Share Analysis, 2019
  • Figure 11: Industry Insights
  • Figure 12: Supply Chain Analysis, 2019
  • Figure 13: Global Radiation-Hardened Electronics Market (by Manufacturing Technique)
  • Figure 14: Global Radiation-Hardened Electronics Market (Rad-Hard by Design), 2019-2025
  • Figure 15: Global Radiation-Hardened Electronics Market (Rad-Hard by Process), 2019-2025
  • Figure 16: Global Radiation-Hardened Electronics Market (Rad-Hard by Software), 2019-2025
  • Figure 17: Global Radiation-Hardened Electronics Market (by Component)
  • Figure 18: Global Radiation-Hardened Electronics Market (Microprocessors and Controllers), 2019-2025
  • Figure 19: Global Radiation-Hardened Electronics Market (Discrete Semiconductors), 2019-2025
  • Figure 20: Global Radiation-Hardened Electronics Market (Power Sources), 2019-2025
  • Figure 21: Global Radiation-Hardened Electronics Market (Memory), 2019-2025
  • Figure 22: Global Radiation-Hardened Electronics Market (Field-Programmable Gate Array), 2019-2025
  • Figure 23: Global Radiation-Hardened Electronics Market (Analog and Mixed Signals), 2019-2025
  • Figure 24: Global Radiation-Hardened Electronics Market (Sensors), 2019-2025
  • Figure 25: Global Radiation-Hardened Electronics Market (Application-Specific Integrated Circuit), 2019-2025
  • Figure 26: Global Radiation-Hardened Electronics Market (Others), 2019-2025
  • Figure 27: Global Radiation-Hardened Electronics Market (by End User)
  • Figure 28: Global Radiation-Hardened Electronics Market (by Space), 2019-2025
  • Figure 29: Global Radiation-Hardened Electronics Market (by Satellite), 2019-2025
  • Figure 30: Global Radiation-Hardened Electronics Market (by Launch Vehicle), 2019-2025
  • Figure 31: Global Radiation-Hardened Electronics Market (by Military), 2019-2025
  • Figure 32: Global Radiation-Hardened Electronics Market (by Missile), 2019-2025
  • Figure 33: Global Radiation-Hardened Electronics Market (by Defense Vehicle), 2019-2025
  • Figure 34: Global Radiation-Hardened Electronics Market (by Munitions), 2019-2025
  • Figure 35: Global Radiation-Hardened Electronics Market (by Nuclear Power Plant), 2019-2025
  • Figure 36: Global Radiation-Hardened Electronics Market (by Aerospace), 2019-2025
  • Figure 37: Global Radiation-Hardened Electronics Market (by Others), 2019-2025
  • Figure 38: Global Radiation-Hardened Electronics Market (by Region)
  • Figure 39: Regional Distribution of the Global Radiation-Hardened Electronics Market, 2019 and 2025
  • Figure 40: North America Radiation-Hardened Electronics Market (by Country), 2019 - 2025
  • Figure 41: U.S. Radiation-Hardened Electronics Market, 2019-2025
  • Figure 42: Canada Radiation-Hardened Electronics Market, 2019-2025
  • Figure 43: Europe Radiation-Hardened Electronics Market, 2019-2025
  • Figure 44: U.K. Radiation-Hardened Electronics Market, 2019-2025
  • Figure 45: Germany Radiation-Hardened Electronics Market, 2019-2025
  • Figure 46: France Radiation-Hardened Electronics Market, 2019-2025
  • Figure 47: Russia Radiation-Hardened Electronics Market, 2019-2025
  • Figure 48: Spain Radiation-Hardened Electronics Market, 2019-2025
  • Figure 49: Rest-of-Europe Radiation-Hardened Electronics Market, 2019-2025
  • Figure 50: Asia-Pacific Radiation-Hardened Electronics Market, 2019-2025
  • Figure 51: China Radiation-Hardened Electronics Market, 2019-2025
  • Figure 52: Japan Radiation-Hardened Electronics Market, 2019-2025
  • Figure 53: South Korea Radiation-Hardened Electronics Market, 2019-2025
  • Figure 54: Australia Radiation-Hardened Electronics Market, 2019-2025
  • Figure 55: India Radiation-Hardened Electronics Market, 2019-2025
  • Figure 56: Rest-of-Asia-Pacific Radiation-Hardened Electronics Market, 2019-2025
  • Figure 57: Rest-of-the-World Radiation-Hardened Electronics Market, 2019-2025
  • Figure 58: Brazil Radiation-Hardened Electronics Market, 2019-2025
  • Figure 59: U.A.E. Radiation-Hardened Electronics Market, 2019-2025
  • Figure 60: South Africa Radiation-Hardened Electronics Market, 2019-2025
  • Figure 61: Mexico Radiation-Hardened Electronics Market, 2019-2025
  • Figure 62: Others Radiation-Hardened Electronics Market, 2019-2025
  • Figure 63: 3D Plus (HEICO Corporation): Financial Overview, 2017-2019
  • Figure 64: 3D Plus (HEICO Corporation): Segment Split, 2017-2019
  • Figure 65: 3D Plus (HEICO Corporation): Regional Split, 2017-2019
  • Figure 66: Analog Devices: Financial Overview, 2017-2019
  • Figure 67: Analog Devices: Segment Split, 2017-2019
  • Figure 68: Analog Devices: Regional Split, 2017-2019
  • Figure 69: Anaren Inc. (TTM Technologies): Financial Overview, 2017-2019
  • Figure 70: Anaren Inc. (TTM Technologies): Segment Split, 2017-2019
  • Figure 71: BAE Systems: Financial Overview, 2017-2019
  • Figure 72: BAE Systems: Segment Split, 2017-2019
  • Figure 73: Cobham PLC: Financial Overview, 2017-2018
  • Figure 74: Cobham PLC: Segment Split, 2017-2018
  • Figure 75: Cobham PLC: Regional Split, 2017-2018
  • Figure 76: Honeywell International Inc.: Financial Overview, 2017-2019
  • Figure 77: Honeywell International Inc.: Segment Split, 2017-2019
  • Figure 78: Honeywell International Inc.: Regional Split, 2017-2019
  • Figure 79: IBM Corporation.: Financial Overview, 2017-2019
  • Figure 80: IBM Corporation.: Segment Split, 2017-2019
  • Figure 81: IBM Corporation: Regional Split (2017-2019)
  • Figure 82: Infineon Technologies Inc.: Financial Overview, 2017-2019
  • Figure 83: Infineon Technologies Inc.: Segment Split, 2017-2019
  • Figure 84: Infineon Technologies Inc.: Regional Split, 2017-2019
  • Figure 85: Microchip Technology Inc: Financial Overview, 2018-2020
  • Figure 86: Microchip Technology Inc: Segment Split, 2018-2020
  • Figure 87: Microchip Technology Inc: Regional Split, 2018-2020
  • Figure 88: Renesas Electronics Corporation: Financial Overview, 2017-2019
  • Figure 89: STMicroelectronics N.V.: Financial Overview, 2017-2019
  • Figure 90: STMicroelectronics N.V.: Segment Split, 2017-2019
  • Figure 91: STMicroelectronics N.V.: Regional Split, 2017-2019
  • Figure 92: Texas Instruments Inc: Financial Overview (2017-2019)
  • Figure 93: Texas Instruments Inc: Segment Split, 2017-2019
  • Figure 94: Texas Instruments Inc: Regional Split, 2017-2019
  • Figure 95: Teledyne Technologies Incorporated: Financial Overview, 2017-2019
  • Figure 96: Teledyne Technologies Incorporated: Segment Split, 2017-2019
  • Figure 97: Teledyne Technologies Incorporated: Regional Split, 2017-2019
  • Figure 98: The Boeing Company: Financial Overview, 2017-2019
  • Figure 99: The Boeing Company: Segment Split, 2017-2019
  • Figure 100: The Boeing Company: Regional Split, 2017-2019
  • Figure 101: Xilinx Inc.: Financial Overview, 2017-2018
  • Figure 102: Xilinx Inc.: Regional Split, 2017-2018
  • Figure 103: Global Radiation-Hardened Electronics (Market Segmentation)
  • Figure 104: Radiation-Hardened Electronics Market Research Methodology
  • Figure 105: Data Triangulation
  • Figure 106: Top-Down and Bottom-Up Approach
  • Figure 107: Global Radiation-Hardened Electronics Market Influencing Factors
  • Figure 108: Assumptions and Limitations