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混合訊號SoC (混合信號系統晶片) 應用的全球市場:幾何節點

Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries

出版商 BCC Research 商品編碼 918721
出版日期 內容資訊 英文 31 Pages
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混合訊號SoC (混合信號系統晶片) 應用的全球市場:幾何節點 Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries
出版日期: 2019年12月10日內容資訊: 英文 31 Pages
簡介

本報告提供混合訊號SoC (混合信號系統晶片) 應用市場相關調查分析,市場概要,市場趨勢、資料、預測,市場特徵,比較分析,市場成長影響要素,主要企業等相關的系統性資訊。

第1章 簡介

第2章 演進、藍圖,摘要

  • 混合訊號SoC的發展與演進
  • 報告摘要

第3章 混合訊號SoC:未來、成長預測

  • 簡介
  • 未來發展預測
  • 市場動態:促進因素、阻礙因素

第4章 混合訊號SoC:各設計組合比率

  • 簡介
  • 類比數位的組合 (70:30)
  • 類比數位的組合 (30:70)
  • 其他

第5章 混合訊號SoC:各技術節點

  • 簡介
  • 22 nm以上
  • 不滿16 x 不滿22
  • 不滿12 x 不滿16
  • 9以下 x 12以下
  • 其他

第6章 混合訊號SoC:各應用

  • 簡介
  • 汽車
  • 工業
  • 手機終端
  • 通訊
  • 其他

第7章 混合訊號SoC:各地區

  • 簡介
  • 北美
  • 歐洲
  • 亞太地區
  • 其他

第8章 企業簡介

  • BROADCOM
  • INTEL
  • MICRON TECHNOLOGY
  • NXP
  • QUALCOMM
  • SAMSUNG ELECTRONICS CO., LTD.
  • SK HYNIX INC.
  • TAIWAN SEMICONDUCTOR
  • TEXAS INSTRUMENTS
  • 東芝

第9章 混合訊號SoC:專利分析

目錄
Product Code: SMC119A

Report Highlights:

This report on Mixed-signal System-on-Chip (SoC) Applications highlights the factors that drive or inhibit the growth of the current market for semiconductor and electronics industry, and analyzes the main materials, end uses and growth opportunities that are mainly driven by automotive, security, power management, networking and communication applications. Silicon vendors are focusing on node geometry for high performance mixed-signal designs. BCC Research analyzed strong driving forces to boost the development and concepts behind the node geometry of mixed-signal SoC in order to facilitate a better understanding of current and future applications and forecasted market growth.

Report Includes:

  • An overview of the global market for mixed-signal SoC applications and a detailed study on node geometries
  • Analyses of global market trends, with data from 2018, estimates for 2019, and projections of compound annual growth rates (CAGRs) through 2024
  • Characterization and quantification of SoC application market by design, technology node, application and region
  • Comparative study on digital vs manual signals
  • Detailed information about the major factors influencing the market growth and recent developments within the industry
  • Company profiles of the leading players in the industry, including Broadcom Corp., Intel Corp., Micron Technology Inc., Qualcomm Inc., Taiwan Semiconductor, and Toshiba Corp.

Table of Contents

Chapter 1: Introduction

  • Reason for Doing This Study
  • Information Sources
    • Key Data from Secondary Sources
    • Key Data from Primary Sources
  • Methodology
  • Geographic Breakdown
  • Analyst's Credentials
  • Related BCC Research Reports

Chapter 2: Evolution, Roadmap and Summary

  • Development and Evolution of Mixed-Signal SoC
  • Report Summary

Chapter 3: Mixed-Signal SoC: Future and Growth Prospects

  • Introduction
  • Future Prospects
  • Market Dynamics: Drivers and Restraints
    • Market Drivers
    • Restraints
    • Opportunities

Chapter 4: Mixed-Signal SoC by Design Combination Ratio

  • Introduction
  • Analog Digital Combination (Ratio-70:30)
  • Analog Digital Combination (Ratio-30:70)
  • Other Combination Ratios

Chapter 5: Mixed-Signal SoC by Technology Node

  • Introduction
  • 22 nm and Above
  • 16 Less Than x Less Than Equal to 22
  • 12 Less Than x Less Than Equal to 16
  • 9 Less Than x Less Than Equal to 12
  • Others

Chapter 6: Mixed-Signal SoC by Application

  • Introduction
  • Automotive
  • Industrial
  • Handheld Devices
  • Communications
  • Others

Chapter 7: Mixed-Signal SoC by Geography

  • Introduction
  • North America
  • Europe
  • Asia-Pacific
  • Rest of the World

Chapter 8: Company Profiles

  • BROADCOM
  • INTEL
  • MICRON TECHNOLOGY
  • NXP
  • QUALCOMM
  • SAMSUNG ELECTRONICS CO., LTD.
  • SK HYNIX INC.
  • TAIWAN SEMICONDUCTOR
  • TEXAS INSTRUMENTS
  • TOSHIBA

Chapter 9: Mixed-Signal SoC Patent Analysis

  • Patent Review by Region
  • Important Patents on Mixed-Signal SoC Focusing Node Geometry

List of Tables

  • Summary Table: Global Market for Mixed-Signal SoC, by Region, Through 2024
    • Table 1: Global Market for Mixed-Signal SoC, by Design Combination Ratio, Through 2024
    • Table 2: Global Market for Mixed-Signal SoC, by Technology Node, Through 2024
    • Table 3: Global Market for Mixed-Signal SoC, by Application, Through 2024
    • Table 4: Global Market for Mixed-Signal SoC, by Region, Through 2024

List of Figures

  • Summary Figure: Global Market for Mixed-Signal SoC, by Region, 2018-2024
    • Figure 1: Global Market for Mixed-Signal SoC, by Design Combination Ratio, 2018-2024
    • Figure 2: Global Market for Mixed-Signal SoC, by Technology Node, 2018-2024
    • Figure 3: Global Market for Mixed-Signal SoC, by Application, 2018-2024
    • Figure 4: Global Market for Mixed-Signal SoC, by Region, 2018-2024
    • Figure 5: Global Mixed-Signal SoC Patents Share Analysis, by Country, 2018
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