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市場調查報告書

半導體矽晶圓的全球市場

Global Semiconductor Silicon Wafer Market

出版商 BCC Research 商品編碼 915158
出版日期 內容資訊 英文 163 Pages
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半導體矽晶圓的全球市場 Global Semiconductor Silicon Wafer Market
出版日期: 2019年10月25日內容資訊: 英文 163 Pages
簡介

半導體晶圓的全球市場預計從2018年到2023年的期間,5.7%的年複合成長率繼續成長,2023年以及市場規模達到213億美元。

本報告含括半導體晶圓的全球市場,提供市場現狀及趨勢與分析未來預測。還有各終端用戶產業,各結晶成長法,各晶圓連接流程,各節點尺寸,以及各地區分類的各種詳細分析與預測市場。

第1章 序論

  • 調查目標及目的
  • 調查理由
  • 報告範圍
  • 主要讀者
  • 資訊來源
  • 調查手法及資訊來源
  • 地區的分析
  • 分析師的經歷
  • BCC的定購調查
  • BCC Research的相關報告

第2章 摘要整理

第3章 半導體設備製造和材料的性質

  • 半導體設備的製造階段
    • 晶圓加工
    • 製造
    • 包裝
  • 矽 (Si)
    • 矽和週期律表
    • 碳族
  • 化合物半導體
    • 鎵砷 (GaAs)
    • 銦磷 (InP)
    • 氮化鎵 (GaN)
    • II - VI屬: 氧化物,硫化物,硒化物,碲化物
    • IV屬: 矽為基礎的化合物及合金
  • 閘極結構手法
    • TTL (電晶體-電晶體、邏輯)
    • CMOS
  • `FET (場效電晶體)
    • MISFET/MOSFET
    • 雙極CMOS
    • MESFET
    • HEMT (高電子移動性電晶體)
    • HBT (異質接頭雙極性電晶體)
  • 晶圓尺寸
    • 450 mm晶圓的挑戰

第4章 結晶成長法

  • 序論
  • 柴可斯基法 (CZ) 及相關手法
  • 布里奇曼、庫存量漢堡法及相關手法
  • 浮融帶子溶融法 (FZ) 及類似手法
  • 市場概要
  • 結晶成長後的晶圓加工

第5章 晶圓連接流程

  • 直持續接
  • 表面活性化連接 (SAB)
  • 等離子活性化連接 (PAB)
  • 陽極連接
  • 市場概要

第6章 節點尺寸

  • 序論
  • 蝕刻加工概要
  • 摩爾定律
  • 10 nm以下
  • 12 nm - 22 nm
  • 28 nm以上
  • 市場概要

第7章 地區市場

  • 南北美洲市場
  • 歐洲、中東、非洲市場
  • 亞太地區市場
  • 市場概要

第8章 全球市場

  • 電訊
  • 測量器及科學研究
  • 醫療
  • 能源,防衛,及監視
  • 運算及娛樂
  • 產業用及汽車用
  • 零售業,其他

第9章 專利分析

  • 各類別分析
  • 各年度分析
  • 各國分析
  • 受讓人簡介

第10章 企業簡介

  • 晶圓製造及加工設備供應商
  • 添加物供應商
  • 晶圓製造企業
  • 晶圓代工廠及半導體設備設計企業
  • 主要企業
目錄
Product Code: SMC112A

Report Highlights:

The global market for semiconductor wafers should grow from $16.2 billion in 2018 to $21.3 billion by 2023 with a compound annual growth rate (CAGR) of 5.7% for the period of 2018-2023.

Americas semiconductor wafers market should grow from $4.5 billion in 2018 to $5.8 billion by 2023 with a compound annual growth rate (CAGR) of 5.4% for the period of 2018-2023.

EMEA semiconductor wafers market should grow from $4.0 billion in 2018 to $5.1 billion by 2023 with a compound annual growth rate (CAGR) of 5.0% for the period of 2018-2023.

Report Scope:

This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).

Dollar value and shipment volume are broken down along the following end uses -

  • Telecommunications.
  • Instrumentation and scientific research.
  • Healthcare.
  • Energy, defense and surveillance.
  • Computing and entertainment.
  • Industrial and automotive.
  • Retail and others.

Each of the end applications is further broken down by crystal growth methods -

  • Bridgman and allied methods (Bridgman).
  • Float-zone (FZ).
  • Czochralski (CZ) and allied methods (Czochralski).

Each end application is broken down by the following wafer-bonding methods -

  • Direct bonding.
  • Surface-activated bonding.
  • Anodic bonding.
  • Plasma bonding.

Each end application is further broken down by node size -

  • 10 nm and lower.
  • 12 to 22 nm.
  • 28 nm and above.

Each end-application is further broken down by regional market -

  • Americas.
  • Europe, Middle East and Africa (EMEA).
  • Asia Pacific (APAC).

Report Includes:

  • 72 data tables and 10 additional tables
  • An overview of the global markets for semiconductor silicon wafers
  • Analyses of global market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
  • Identification of potential applications of semiconductor silicon wafers in consumer electronics, telecommunications, automotive, defence, and healthcare industry
  • Overview of various bonding technologies in the semiconductor silicon wafers industry, including direct bonding, surface activated bonding, plasma activated bonding and anodic bonding
  • Coverage of major innovation initiatives in silicon wafer fabrication technology
  • Detailed analysis of major vendors and suppliers of the industry, including 3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba and Wafer World Inc

Table of Contents

Chapter 1: Introduction

  • Study Goals and Objectives
  • Reasons for Doing the Study
  • Scope of the Report
  • Intended Audience
  • Methodology and Information Sources
  • Geographic Breakdown
  • Analyst's Credentials
  • BCC Custom Research
  • Related BCC Research Reports

Chapter 2: Executive Summary

Chapter 3: Semiconductor Device Manufacturing and Material Properties

  • Steps in Semiconductor Device Manufacturing
    • Wafering
    • Fabrication
    • Packaging
  • Silicon (Si)
    • Silicon and the Periodic Table
    • The Carbon Family
    • Silicon
  • Compound Semiconductors
    • Gallium Arsenide (GaAs)
    • Indium Phosphide (InP)
    • Gallium Nitride (GaN)
    • Group II-VI: Oxides, Sulfides, Selenides and Tellurides
    • Group IV: Silicon-Based Compounds and Alloys
  • Gate Definition Methodology
    • Transistor-Transistor Logic (TTL)
    • Complementary Metal Oxide Semiconductor (CMOS)
    • Field Effect Transistor (FET)
    • Metal Oxide/Insulator Semiconductor Field Effect Transistor (MISFET/MOSFET)
    • Bipolar CMOS (BiCMOS)
    • Metal Semiconductor Field Effect Transistor (MESFET)
    • High Electron Mobility Transistor (HEMT)
    • Hetero-Junction Bipolar Transistor (HBT)
  • Wafer Sizing
    • The 450 mm Wafer Challenge

Chapter 4: Crystal Growth Methods

  • Introduction
  • Czochralski (CZ) and Related Methods
    • Methodology
    • Key Vendors and Innovations
  • Bridgman-Stockbarger and Related Methods
    • Methodology
    • Key Vendors and Innovations
  • Float Zone (FZ) and Allied Methods
    • Methodology
    • Key Vendors and Innovations
  • Market Overview
  • Post-Crystal Growth Wafer Processing
    • Ingot Formation, Grinding and Trimming
    • Wafer Slicing and Rounding
    • Lapping

Chapter 5: Wafer-Bonding Process

  • Direct Bonding
    • Methodology
    • Advantages
  • Surface-Activated Bonding (SAB)
    • Methodology
    • Advantages
  • Plasma-Activated Bonding (PAB)
    • Methodology
    • Advantages
  • Anodic Bonding
    • Methodology
    • Advantages
  • Market Overview

Chapter 6: Node Sizes

  • Introduction
  • Overview of the Etching Process
    • Equipment Involved
    • Process Challenges
  • Moore's Law
  • 10 nm and Less
    • Architecture
    • Key Developments
  • 12 nm to 22 nm
    • Architecture
    • Key Developments
  • 28 nm and More
    • Architecture
    • Key Developments
  • Market Overview

Chapter 7: Regional Markets

  • Americas
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • EMEA
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • APAC
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • Market Overview

Chapter 8: Global Markets

  • Telecommunications
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Instrumentation and Scientific Research
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Healthcare
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Energy, Defense and Surveillance
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Computing and Entertainment
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Industrial and Automotive
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Retail and Others
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market

Chapter 9: Patent Analysis

  • Introduction
  • Breakdown by Category
  • Breakdown by Year
  • Breakdown by Country
  • Profile of Assignees

Chapter 10: Company Profiles

  • Wafer Manufacturing and Processing Equipment Vendors
    • Pricing Dynamics
    • Key Companies
    • Semiconductor Material Suppliers
    • Pricing Dynamics
    • Key Companies
  • Additive Materials Suppliers
    • Pricing Dynamics
    • Key Companies
  • Wafer Manufacturers
    • Pricing Dynamics
    • Key Companies
  • Foundries and Semiconductor Device Designers
    • Pricing Dynamics
    • Key Companies
  • Companies
    • 3M
    • II-VI EPIWORKS
    • AIXTRON
    • APPLIED MATERIALS
    • ALINEASON
    • BREWER SCIENCE INC.
    • CMK SRO
    • DISCO CORP.
    • ELECTRONICS AND MATERIALS CORP. LTD (E&M)
    • ELKEM
    • EV GROUP
    • GLOBALWAFERS JAPAN CO. LTD.
    • HEMLOCK SEMICONDUCTOR CORP.
    • KOKUSAI ELECTRIC
    • INTEL
    • LINTEC CORP.
    • MECHATRONIK SYSTEMTECHNIK GMBH
    • MICRON
    • NICHIA CORP.
    • NISSAN CHEMICAL CORP.
    • OKMETIC
    • POWERCHIP
    • SAMSUNG
    • SHANGHAI SIMGUI TECHNOLOGY
    • SHIN-ETSU CHEMICAL CO. LTD.
    • SILTRONIX SILICON TECHNOLOGIES
    • SILICON MATERIALS INC.
    • SILICON VALLEY MICROELECTRONICS
    • SILTRONIC AG
    • SK HYNIX
    • SK SILTRON
    • SOITEC
    • SUMCO CORP.
    • SUSS MICRO TEC AG
    • SYNOVA
    • THERMCRAFT
    • TOKUYAMA CORP.
    • TOSHIBA
    • TSMC
    • ULVAC INC.
    • UMC
    • VIRGINIA SEMICONDUCTOR
    • WACKER CHEMIE AG
    • WAFER WORKS CORP.
    • WAFER WORLD INC

List of Tables

  • Summary Table: Global Market for Semiconductor Wafers, Through 2023
    • Table 1: Physical Properties of the Main Compound Semiconductor Materials Compared to Silicon
    • Table 2: Group III-V Compound Semiconductors, by Chemical Composition
    • Table 3: Group II-VI Compound Semiconductors, by Chemical Composition
    • Table 4: Group IV Compound Semiconductors
    • Table 5: Other Compounds: Semiconductors, by Chemical Composition
    • Table 6: Global Market for Semiconductor Wafers, by Crystal Growth Method, Through 2023
    • Table 7: Global Market Volume for Semiconductor Wafers, by Crystal Growth Method, Through 2023
    • Table 8: Global Market for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
    • Table 9: Global Market Volume for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
    • Table 10: Global Market for Semiconductor Wafers, by Node Size, Through 2023
    • Table 11: Global Market Volume for Semiconductor Wafers, by Node Size, Through 2023
    • Table 12: Global Market for Semiconductor Wafers, by Region, Through 2023
    • Table 13: Global Market Volume for Semiconductor Wafers, by Region, Through 2023
    • Table 14: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, Through 2023
    • Table 15: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 16: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 17: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 18: Global Market Volume for Semiconductor Wafers, in Telecommunications End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 19: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Node Size, Through 2023
    • Table 20: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Node Size, Through 2023
    • Table 21: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
    • Table 22: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
    • Table 23: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, Through 2023
    • Table 24: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 25: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 26: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 27: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 28: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
    • Table 29: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
    • Table 30: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
    • Table 31: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
    • Table 32: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, Through 2023
    • Table 33: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 34: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 35: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 36: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 37: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
    • Table 38: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
    • Table 39: Global Market for Semiconductor Wafers in Healthcare End-Use Applications by Region, Through 2023
    • Table 40: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Region, Through 2023
    • Table 41: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, Through 2023
    • Table 42: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 43: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 44: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 45: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 46: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
    • Table 47: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
    • Table 48: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
    • Table 49: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
    • Table 50: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, Through 2023
    • Table 51: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 52: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 53: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 54: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 55: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size Through 2023
    • Table 56: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size, Through 2023
    • Table 57: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
    • Table 58: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
    • Table 59: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, Through 2023
    • Table 60: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 61: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 62: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 63: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 64: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
    • Table 65: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
    • Table 66: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
    • Table 67: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
    • Table 68: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, Through 2023
    • Table 69: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 70: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 71: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 72: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 73: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
    • Table 74: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
    • Table 75: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Region, Through 2023
    • Table 76: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Region, Through 2023
    • Table 77: U.S. Patents on Semiconductor Wafer Technologies, by Patent Category, 1976 Through Aug. 2018
    • Table 78: U.S. Patent Trends: Semiconductor Wafer Technologies, by Year Granted, 1976 Through Aug. 2018
    • Table 79: U.S. Patent Shares of Semiconductor Wafer Technologies, by Assignee's Country, 1976 Through Aug. 2018
    • Table 80: U.S. Patent Holders of Semiconductor Wafer Technologies, 1976 Through Aug. 2018
    • Table 81: Patent Holders with Three or More U.S. Patents on Food Processing and Food Packaging Technologies, 1976 Through July 2018

List of Figures

  • Summary Figure: Global Market for Semiconductor Wafers, Through 2017-2023