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市場調查報告書

5G晶片組企業的前十大企業

Top Ten 5G Chipset Companies

出版商 BCC Research 商品編碼 891233
出版日期 內容資訊 英文 67 Pages
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5G晶片組企業的前十大企業 Top Ten 5G Chipset Companies
出版日期: 2019年07月16日內容資訊: 英文 67 Pages
簡介

本報告提供全球5G晶片組的10家主要企業及促進產業成長的主要領域關注調查,全球市場概要,各展開類型、晶圓材料、IC類型、頻譜帶子、最終用途、地區的市場分析與收益預測,競爭情形分析,並提供主要企業簡介等資訊。

第1章 簡介

第2章 摘要、亮點

第3章 市場、技術背景

  • 5G晶片組的市場定義、發展
  • 未來展望、預測
  • 市場動態
    • 促進因素
    • 阻礙因素
    • 機會

第4章 5G晶片組市場

  • 簡介
  • 市場:各部署類型
  • 市場:各晶圓材料類型
  • 市場:各IC類型
  • 市場:各頻譜帶
  • 市場:各最終用途
  • 市場:各地區

第5章 競爭情形

  • 市場佔有率分析
  • 市場策略分析
  • 主要市場發展

第6章 企業簡介

  • ERICSSON, INC.
  • 富士通
  • HEWLETT PACKARD ENTERPRISE
  • HUAWEI TECHNOLOGIES CO. LTD.
  • INTEL CORP.
  • MEDIATEK, INC.
  • NOKIA CORP.
  • QUALCOMM, INC.
  • SAMSUNG ELECTRONICS CO. LTD.
  • ZTE CORP.
目錄
Product Code: IAS151A

Report Highlights:

This report provides detailed information on companies that BCC Research has identified as market leaders. These companies are selected based on revenue, innovations, strength of product portfolio, regional presence, investment capacity and similar other factors. The report also provides brief information of the global 5G chipset market.

Report Scope:

The scope of this report is focused on selected top ten companies in 5G chipset, and the key areas in the field that are driving industry growth allowing these companies to succeed. BCC also explores its industry structure, noting strategic alliances and acquisitions.

The scope also includes analysis of the 5G Chipset market based on deployment, wafer material, IC type, spectrum banks, end use and regional markets. Revenue forecasts for 2018 through 2023 are provided at global level for these segments. The 5G chipset market is segmented into the following categories -

  • Deployment type: network infrastructure, smart gadgets, smartphones, routers/modems, and others.
  • Wafer material type: GaN (Gallium Nitride)-based chipsets, GaAs (Gallium Arsenide)-based chipsets, InP (Indium Phosphide)-based chipsets, SiN (Silicon Nitride)-based chipsets, Si-based chipsets, and others.
  • IC type: RFIC, ASIC, cellular IC, and mmWave IC.
  • Spectrum bands: <3GHz, >3GHz-5GHz, >5GHz-6GHz, and >6GHz.
  • End use: telecom infrastructure, automotive, building automation, industrial automation, retail, Energy and utilities, consumer electronics, and others.
  • Region: North America is segmented into the U.S., Canada, and Mexico; Europe is segmented into the U.K., France, Germany, and Rest of Europe; the U.K. is further segmented into England, Wales, Scotland, and Northern Ireland; Asia-Pacific (APAC) is segmented into China, Japan, India, and Rest of Asia-Pacific; Middle East and Latin America is segmented into UAE, Brazil, and Rest of Middle East and Latin America.

Estimated values used are based on manufacturers' total revenues. Projected and forecast revenue values are in constant U.S. dollars unadjusted for inflation.

This report covers analyses of the global market trends, with data from 2018 to 2024 with projection of CAGR during 2019 to 2024. Estimated values used are based on manufacturers' total revenues. Projected and forecasted revenue values are in constant US dollars, unadjusted for inflation.

Report Includes:

  • An overview of the top ten 5G chipset industry players
  • Analyses of global 5G chipset market trends, with data from 2018 estimates for 2019, and projections of compound annual growth rates (CAGRs) through 2024
  • Characterization and quantification of global 5G chipset market data in terms of end use, material type, spectrum bands, deployment type and geographical region
  • Detailed profiles of the top 10 companies of the 5G chipset industry and explores the underlying technologies to determine its market status, impact on future market segments, and future growth potential
  • Discussion on products, technology advancements, executives, geographical presence, history and strategies of the 5G chipset companies

Table of Contents

Chapter 1: Introduction

  • Introduction
  • Study Goals and Objectives
  • Reasons for Doing This Study
  • Scope of Report
  • Methodology
  • Geographic Breakdown
  • Intended Audience
  • Analyst's Credentials
  • BCC Custom Research
  • Related BCC Research Reports

Chapter 2: Summary and Highlights

Chapter 3: Market and Technology Background

  • Market Definition and the Evolution of 5G Chipset
  • Future Outlook and Expectations
  • Market Dynamics
    • Drivers
    • Restraints
    • Opportunities

Chapter 4: 5G Chipset Market

  • Introduction
  • Market by Deployment Type
  • Market by Wafer Material Type
  • Market by IC Type
  • Market by Spectrum Bands
  • Market by End Use
  • Market by Region

Chapter 5: Competitive Landscape

  • Market Share Analysis
  • Market Strategy Analysis
  • Key Market Developments
    • Product Launch/Product Development
    • Collaboration/Partnership/Alliance/Geographic Expansion

Chapter 6: Company Profiles

  • ERICSSON, INC.
  • FUJITSU LTD.
  • HEWLETT PACKARD ENTERPRISE
  • HUAWEI TECHNOLOGIES CO. LTD.
  • INTEL CORP.
  • MEDIATEK, INC.
  • NOKIA CORP.
  • QUALCOMM, INC.
  • SAMSUNG ELECTRONICS CO. LTD.
  • ZTE CORP.

List of Tables

  • Summary Table: Global 5G Chipset Market, by Deployment Type, Through 2024
    • Table 1: Global 5G Chipset Market, by Deployment Type, Through 2024
    • Table 2: Global 5G Chipset Market, by Wafer Material Type, Through 2024
    • Table 3: Global 5G Chipset Market, by IC Type, Through 2024
    • Table 4: Global 5G Chipset Market, by Spectrum Bands, Through 2024
    • Table 5: Global 5G Chipset Market, by End Use, Through 2024
    • Table 6: Global 5G Chipset Market, by Region, Through 2024
    • Table 7: Key Developments in 5G Chipset Market, by Top 10 Companies, 2018-2019*
    • Table 8: Key Developments in 5G Chipset Market, by Top 10 Companies, 2017-2019*
    • Table 9: Ericsson, Inc.: 5G Chipset Products and Services
    • Table 10: Ericsson, Inc.: Company Financials, 2015-2018
    • Table 11: Ericsson, Inc.: Recent Developments, 2017-2019
    • Table 12: Ericsson, Inc: Key Management
    • Table 13: Fujitsu Ltd.: 5G Chipset Products and Services
    • Table 14: Fujitsu Ltd.: Company Financials, 2015-2018
    • Table 15: Fujitsu Ltd.: Recent Developments, 2018
    • Table 16: Fujitsu Ltd.: Key Management
    • Table 17: Hewlett Packard Enterprise: 5G Chipset Products and Services
    • Table 18: Hewlett Packard Enterprise: Company Financials, 2015-2018
    • Table 19: Hewlett Packard Enterprise: Recent Developments, 2019
    • Table 20: Hewlett Packard Enterprise: Key Management
    • Table 21: Huawei Technologies Co. Ltd.: 5G Chipset Products and Services
    • Table 22: Huawei Technologies Co. Ltd.: Company Financials, 2015-2018
    • Table 23: Huawei Technologies Co. Ltd.: Recent Developments, 2018-2019
    • Table 24: Huawei Technologies Co. Ltd.: Key Management
    • Table 25: Intel Corp.: 5G Chipset Products and Services
    • Table 26: Intel Corp.: Company Financials, 2015-2018
    • Table 27: Intel Corp.: Recent Developments, 2019
    • Table 28: Intel Corp.: Key Management
    • Table 29: MediaTek, Inc.: 5G Chipset Products and Services
    • Table 30: MediaTek, Inc.: Company Financials, 2015-2018
    • Table 31: MediaTek, Inc.: Recent Developments, 2018-2019
    • Table 32: MediaTek, Inc.: Key Management
    • Table 33: Nokia Corp.: 5G Chipset Products and Services
    • Table 34: Nokia Corp.: Company Financials, 2015-2018
    • Table 35: Nokia Corp.: Recent Developments, 2018-2019
    • Table 36: Nokia Corp.: Key Management
    • Table 37: Qualcomm, Inc.: 5G Chipset Products and Services
    • Table 38: Qualcomm, Inc.: Company Financials, 2015-2018
    • Table 39: Qualcomm, Inc.: Recent Developments, 2018-2019
    • Table 40: Qualcomm, Inc.: Key Management
    • Table 41: Samsung Electronics Co. Ltd.: 5G Chipset Products and Services
    • Table 42: Samsung Electronics Co. Ltd.: Company Financials, 2014-2017
    • Table 43: Samsung Electronics Co. Ltd.: Recent Developments, 2018-2019
    • Table 44: Samsung Electronics Co. Ltd.: Key Management
    • Table 45: ZTE Corp.: 5G Chipset Products and Services
    • Table 46: ZTE Corp.: Company Financials, 2015-2018
    • Table 47: ZTE Corp.: Recent Developments, 2018-2019
    • Table 48: ZTE Corp.: Key Management

List of Figures

  • Summary Figure: Global 5G Chipset Market, by Deployment Type, 2018-2024
    • Figure 1: Global 5G Chipset Market, by Deployment Type, 2018-2024
    • Figure 2: Global 5G Chipset Market, by Wafer Material Type, 2018-2024
    • Figure 3: Global 5G Chipset Market, by IC Type, 2018-2024
    • Figure 4: Global 5G Chipset Market, by Spectrum Bands, 2018-2024
    • Figure 5: Global 5G Chipset Market, by End Use, 2018-2024
    • Figure 6: Global 5G Chipset Market, by Region, 2018-2024
    • Figure 7: Global 5G Chipset Market Share Analysis, by Company, 2018
    • Figure 8: Global Market Share of Key Strategies Adopted, by Companies, 2014-2018
    • Figure 9: Ericsson, Inc.: Revenue Share, by Business Segment, 2017-2018
    • Figure 10: Fujitsu Ltd.: Revenue Share, by Business Segment, 2017-2018
    • Figure 11: Hewlett Packard Enterprise: Revenue Share, by Business Segment, 2017-2018
    • Figure 12: Huawei Technologies Co. Ltd.: Revenue Share, by Business Segment, 2017-2018
    • Figure 13: Intel Corp.: Revenue Share, by Business Segment, 2017-2018
    • Figure 14: MediaTek, Inc.: Revenue Share, by Business Segment, 2017-2018
    • Figure 15: Qualcomm, Inc.: Revenue Share, by Business Segment, 2017-2018
    • Figure 16: Samsung Electronics Co. Ltd.: Revenue Share, by Business Segment, 2016-2017
    • Figure 17: ZTE Corp.: Revenue Share, by Business Segment, 2017-2018