Product Code: ANV786
REPORT HIGHLIGHT
The Flip chip Technology market is estimated to be worth US$ 30,600.8 million in 2020. Flip chip Technology market is expected to expand at an 8.2% CAGR during the forecast period.
Market Introduction
Flip-chip improves the appearance of electrical devices that operate at higher frequencies, making them more useful in ultrasonic and microwave applications. In comparison to its competitors, the technology has a high overall system efficiency and low inductance while taking up less area. Flip chips are used in electronic equipment because of their explicit characteristics. Flip chips are commonly found in high-volume consumer items, including computer peripherals, cell phones, and cameras. Flip chips offer a wide range of advantages, including strong electrical performance, high speed, and dependability, and thus perform better than wire-bond packaging.
Market Dynamics
The growing demand for miniaturization and high performance in electronic devices, as well as the strong penetration of advanced packaging technology in the consumer electronics sector, are driving the growth of the flip-chip technology market. With the introduction of flip-chip packaging technology, the size of the die has been significantly reduced, resulting in a significant reduction in silicon cost. Using flip-chip technology, the total package size can also be reduced. Other advantages of flip-chip technology include lower signal inductance, lower power inductance, and higher signal density. Because of the long-term lockdown caused by the Covid-19 pandemic, all production industries and bases are affected globally, hampering the growth of the flip-chip technology business. Furthermore, the market players continue to expand their processing capacity for high-end packaging technologies, which will result in significant growth opportunities for the flip-chip technology market during the forecast period.
Segmentation Analysis
The flip-chip technology market is segmented by product, wafer bumping process, packaging technology, end-user, regional distribution, and competitive landscape. Based on end-user, the consumer electronics segment holds the largest share of ~35% of the global market. In recent years, there has been a surge in demand for electronic products that utilize flip-chip technology. The internet, digital cameras, laptop computers, digital cameras, cell phones, and other electronics consumer products are all advancing flip-chip technology. As the market is witnessing an expansion, variables such as product functionality, volume production, and speed to market became increasingly important. Because of the widespread usage of flip-chip technology in some of these goods, there is a demand for the next generation, which involves integration and innovation, resulting in an expansion of applications across a wide range of industries. As a result, the market's growth is fueled by the ease with which electronic gadgets can be integrated.
Competitive Landscape
The key market players in the market are adopting various strategies such as new product launches, mergers, acquisitions, and partnerships to strengthen their presence in the market. For instance, in March 2021, Samsung Electronics and Marvell (jointly introduced a new System-on-a-Chip to enhance 5G network performance, which will be used in Samsung Electronic's Massive MIMO and other advanced radios. In addition to this, companies are also focusing on expansion. For instance, in 2020, leading players such as Taiwan Semiconductor Manufacturing Company, Chang Chun Petrochemical Co. Ltd, and Mirle Automation Corporation announced the establishment of new facilities in Arizona to strengthen their global position.
Key features of the study:
This proposed research study on Flip chip Technology market provides market size (US$ million), compound annual growth rate (CAGR %) and forecast estimation (2021-2027), considering 2020 as the base year
The research report elucidates potential growth opportunities across different segments/countries and explains attractive investment proposition matrix for Flip chip Technology market.
The overall report identifies new investment opportunities, challenges faced by established players, and growth factors to sustain in the Flip chip Technology market.
Impact of COVID-19 on Flip chip Technology market size, forecast, CAGR, and market dynamics are discussed in detail under the research scope. Detailed insight on Flip chip Technology market post-COVID will also be covered.
In order to give the users of this report a comprehensive view on the Flip chip Technology market, we have also included competitive landscape and key innovator analysis for the Flip chip Technology market
The study encompasses a growth prospect mapping analysis, wherein all the industry segments are benchmarked based on their market size, growth rate and attractiveness.
The report offers detailed company profiling featuring major market participants which will help users to understand their financial information and strategic initiatives of players operating in the Flip chip Technology market.
In addition, the report also unveil the important acquisitions & mergers, collaborations & joint ventures, new launch, research & development, regional expansion of major participants involved in the market on global as well as regional level.
The Flip chip Technology market report primarily caters to various stakeholders in this industry including suppliers, investors, new entrants, distributors, and financial analysts
SCOPE OF THE REPORT
The scope of this report covers the market by its major segments, which include as follows:
Flip chip Technology Market Key Players
Taiwan Semiconductor Manufacturing Company Limited (TSMC Ltd.)
Samsung Electronics Co., Ltd.
Intel Corp.
United Microelectronics Corp.
ASE Group
Amkor Technology
Siliconware Precision Industries Co., Ltd.
Powertech Technology, Inc.
Stats Chippac Ltd.
Jiangsu Changjiang Electronics Technology Co., Ltd
Flip chip Technology Market by Product
Memory
LED
CMOS Image sensor
RF, analog, mixed signal, and power IC
CPU
SoC
GPU
Flip chip Technology Market by Wafer Bumping Process
Copper (Cu) pillar
Lead-free
Tin/lead eutectic solder
Gold stud+ plated solder
Flip chip Technology Market by Packaging Type
FC BGA
FC PGA
FC LGA
FC QFN
FC SiP
FC CSP
Flip chip Technology Market by Packaging Technology
2D IC
2.5D IC
3D IC
Flip chip Technology Market by End User
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace
Flip chip Technology Market by Region
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
France
Italy
Spain
Rest of Europe
Asia-Pacific
China
Japan
India
Australia
South Korea
Rest of Asia-Pacific
Latin America
Brazil
Argentina
Rest of Latin America
Middle-East and Africa
GCC
South Africa
Rest of Middle-East and Africa
TABLE OF CONTENT
1. Flip chip Technology Market Overview
2. Executive Summary
- 2.1. Market Snippet
- 2.1.1. Market Snippet by Product
- 2.1.2. Market Snippet by Wafer bumping Process
- 2.1.3. Market Snippet by Packaging Type
- 2.1.4. Market Snippet by Packaging Technology
- 2.1.5. Market Snippet by End-user
- 2.1.6. Market Snippet by Region
- 2.2. Competitive Insights
3. Flip chip Technology Key Market Trends
- 3.1. Market Drivers
- 3.1.1. Impact Analysis of Market Drivers
- 3.2. Market Restraints
- 3.2.1. Impact Analysis of Market Restraints
- 3.3. Market Opportunities
- 3.4. Market Future Trends
4. Flip chip Technology Industry Study
- 4.1. Porter's Five Forces Analysis
- 4.2. Marketing Strategy Analysis
- 4.3. Growth Prospect Mapping
- 4.4. Regulatory Framework Analysis
5. Flip chip Technology Market: COVID-19 Impact Analysis
- 5.1. Pre-COVID-19 Impact Analysis
- 5.2. Post-COVID-19 Impact Analysis
- 5.2.1. Top Performing Segments
- 5.2.2. Marginal Growth Segments
- 5.2.3. Top Looser Segments
- 5.2.4. Marginal Loss Segments
6. Flip chip Technology Market Landscape
- 6.1. Market Share Analysis, 2019
- 6.2. Key Innovators Analysis
- 6.3. Breakdown Data, by Key Manufacturer
- 6.3.1. Established Players' Analysis
- 6.3.2. Emerging Players' Analysis
7. Flip chip Technology Market - By Product
- 7.1. Overview
- 7.1.1. Segment Share Analysis, By Product, 2020 & 2027 (%)
- 7.1.2. Memory
- 7.1.3. LED
- 7.1.4. CMOS Image sensor
- 7.1.5. RF, analog, mixed signal, and power IC
- 7.1.6. CPU
- 7.1.7. SoC
- 7.1.8. GPU
8. Flip chip Technology Market - By Wafer bumping Process
- 8.1. Overview
- 8.1.1. Segment Share Analysis, By Wafer bumping Process, 2020 & 2027 (%)
- 8.1.2. Copper (Cu) pillar
- 8.1.3. Lead-free
- 8.1.4. Tin/lead eutectic solder
- 8.1.5. Gold stud+ plated solder
9. Flip chip Technology Market - By Packaging Type
- 9.1. Overview
- 9.1.1. Segment Share Analysis, By Packaging Type, 2020 & 2027 (%)
- 9.1.2. FC BGA
- 9.1.3. FC PGA
- 9.1.4. FC LGA
- 9.1.5. FC QFN
- 9.1.6. FC SiP
- 9.1.7. FC CSP
10. Flip chip Technology Market - By Packaging Technology
- 10.1. Overview
- 10.1.1. Segment Share Analysis, By Packaging Technology, 2020 & 2027 (%)
- 10.1.2. 2D IC
- 10.1.3. 2.5D IC
- 10.1.4. 3D IC
11. Flip chip Technology Market - By End-user
- 11.1. Overview
- 11.1.1. Segment Share Analysis, By End-user, 2020 & 2027 (%)
- 11.1.2. Consumer electronics
- 11.1.3. Telecommunication
- 11.1.4. Automotive
- 11.1.5. Industrial sector
- 11.1.6. Medical devices
- 11.1.7. Smart technologies
- 11.1.8. Military & aerospace
12. Flip chip Technology Market- By Geography
- 12.1. Introduction
- 12.1.1. Segment Share Analysis, By Geography, 2020 & 2027 (%)
- 12.2. North America
- 12.2.1. Overview
- 12.2.2. Key Manufacturers in North America
- 12.2.3. North America Market Size and Forecast, By Country, 2016 - 2027 (US$ Million)
- 12.2.4. North America Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 12.2.5. North America Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 12.2.6. North America Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 12.2.7. North America Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 12.2.8. North America Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.2.9. U.S.
- 12.2.9.1. Overview
- 12.2.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 12.2.9.3. U.S. Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 12.2.9.4. U.S. Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 12.2.9.5. U.S. Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 12.2.9.6. U.S. Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 12.2.9.7. U.S. Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.2.10. Canada
- 12.2.10.1. Overview
- 12.2.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.1. Canada Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.2. Canada Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.3. Canada Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.4. Canada Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.5. Canada Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.3. Europe
- 12.3.1. Overview
- 12.3.2. Key Manufacturers in Europe
- 12.3.3. Europe Market Size and Forecast, By Country, 2016 - 2027 (US$ Million)
- 12.3.4. Europe Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 12.3.5. Europe Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 12.3.6. Europe Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 12.3.7. Europe Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 12.3.8. Europe Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.3.9. Germany
- 1.1.1.6. Overview
- 1.1.1.7. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.8. Germany Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.9. Germany Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.10. Germany Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.11. Germany Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.12. Germany Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.3.10. Italy
- 12.3.11. Overview
- 12.3.12. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 12.3.13. Italy Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 12.3.14. Italy Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 12.3.15. Italy Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 12.3.16. Italy Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 12.3.17. Italy Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.3.18. United Kingdom
- 1.1.1.13. Overview
- 1.1.1.14. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.15. United Kingdom Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.16. United Kingdom Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.17. United Kingdom Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.18. United Kingdom Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.19. United Kingdom Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.3.19. France
- 1.1.1.20. Overview
- 1.1.1.21. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.22. France Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.23. France Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.24. France Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.25. France Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.26. France Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.3.20. Rest of Europe
- 1.1.1.27. Overview
- 1.1.1.28. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.29. Rest of Europe Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.30. Rest of Europe Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.31. Rest of Europe Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.32. Rest of Europe Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.33. Rest of Europe Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.4. Asia Pacific (APAC)
- 12.4.1. Overview
- 12.4.2. Key Manufacturers in Asia Pacific
- 12.4.3. Asia Pacific Market Size and Forecast, By Country, 2016 - 2027 (US$ Million)
- 12.4.4. Asia Pacific Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 12.4.5. Asia Pacific Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 12.4.6. Asia Pacific Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 12.4.7. Asia Pacific Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 12.4.8. Asia Pacific Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.4.9. India
- 1.1.1.34. Overview
- 1.1.1.35. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.36. India Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.37. India Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.38. India Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.39. India Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.40. India Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.4.10. China
- 1.1.1.41. Overview
- 1.1.1.42. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.43. China Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.44. China Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.45. China Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.46. China Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.47. China Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.4.11. Japan
- 1.1.1.48. Overview
- 1.1.1.49. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.50. Japan Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.51. Japan Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.52. Japan Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.53. Japan Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.54. Japan Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.4.12. South Korea
- 1.1.1.55. Overview
- 1.1.1.56. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.57. South Korea Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.58. South Korea Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.59. South Korea Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.60. South Korea Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.61. South Korea Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.4.13. Rest of APAC
- 1.1.1.62. Overview
- 1.1.1.63. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.64. Rest of APAC Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.65. Rest of APAC Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.66. Rest of APAC Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.67. Rest of APAC Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.68. Rest of APAC Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.5. Latin America
- 12.5.1. Overview
- 12.5.2. Key Manufacturers in Latin America
- 12.5.3. Latin America Market Size and Forecast, By Country, 2016 - 2027 (US$ Million)
- 12.5.4. Latin America Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 12.5.5. Latin America Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 12.5.6. Latin America Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 12.5.7. Latin America Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 12.5.8. Latin America Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.5.9. Brazil
- 1.1.1.69. Overview
- 1.1.1.70. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.71. Brazil Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.72. Brazil Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.73. Brazil Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.74. Brazil Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.75. Brazil Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.5.10. Mexico
- 1.1.1.76. Overview
- 1.1.1.77. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.78. Mexico Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.79. Mexico Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.80. Mexico Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.81. Mexico Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.82. Mexico Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.5.11. Argentina
- 1.1.1.83. Overview
- 1.1.1.84. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.85. Argentina Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.86. Argentina Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.87. Argentina Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.88. Argentina Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.89. Argentina Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.5.12. Rest of LATAM
- 1.1.1.90. Overview
- 1.1.1.91. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.92. Rest of LATAM Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.93. Rest of LATAM Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.94. Rest of LATAM Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.95. Rest of LATAM Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.96. Rest of LATAM Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.6. Middle East and Africa
- 12.6.1. Overview
- 12.6.2. Key Manufacturers in Middle East and Africa
- 12.6.3. Middle East and Africa Market Size and Forecast, By Country, 2016 - 2027 (US$ Million)
- 12.6.4. Middle East and Africa Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 12.6.5. Middle East and Africa Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 12.6.6. Middle East and Africa Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 12.6.7. Middle East and Africa Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 12.6.8. Middle East and Africa Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.6.9. Saudi Arabia
- 1.1.1.97. Overview
- 1.1.1.98. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.99. Saudi Arabia Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.100. Saudi Arabia Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.101. Saudi Arabia Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.102. Saudi Arabia Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.103. Saudi Arabia Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
- 12.6.10. United Arab Emirates
- 1.1.1.104. Overview
- 1.1.1.105. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2016 - 2027, (US$ Million)
- 1.1.1.106. United Arab Emirates Market Size and Forecast, By Product, 2016 - 2027 (US$ Million)
- 1.1.1.107. United Arab Emirates Market Size and Forecast, By Wafer bumping Process, 2016 - 2027 (US$ Million)
- 1.1.1.108. United Arab Emirates Market Size and Forecast, By Packaging Type, 2016 - 2027 (US$ Million)
- 1.1.1.109. United Arab Emirates Market Size and Forecast, By Packaging Technology, 2016 - 2027 (US$ Million)
- 1.1.1.110. United Arab Emirates Market Size and Forecast, By End-user, 2016 - 2027 (US$ Million)
13. Key Vendor Analysis
- 13.1. Competitive Dashboard
- 13.2. Company Profiles
- 13.2.1. Taiwan Semiconductor Manufacturing Company Limited (TSMC Ltd.)
- 13.2.2. Samsung Electronics Co., Ltd.
- 13.2.3. Intel Corp.
- 13.2.4. United Microelectronics Corp.
- 13.2.5. ASE Group
- 13.2.6. Amkor Technology
- 13.2.7. Siliconware Precision Industries Co., Ltd.
- 13.2.8. Powertech Technology, Inc.
- 13.2.9. Stats Chippac Ltd.
- 13.2.10. Jiangsu Changjiang Electronics Technology Co., Ltd
14. 360 Degree Analyst View
15. Appendix
- 15.1. Research Methodology
- 15.2. References
- 15.3. Abbreviations
- 15.4. Disclaimer
- 15.5. Contact Us