市場調查報告書

5G時代的大型晶片供應商:成為成功關鍵的全程(端到端)平台

Major Chip Providers in the 5G Era: End-to-end Platforms May Be the Key to Success

出版商 Analysys Mason 商品編碼 896926
出版日期 內容資訊 英文 PPTX and PDF (23 slides); PDF (3 pages)
商品交期: 最快1-2個工作天內
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5G時代的大型晶片供應商:成為成功關鍵的全程(端到端)平台 Major Chip Providers in the 5G Era: End-to-end Platforms May Be the Key to Success
出版日期: 2019年07月30日內容資訊: 英文 PPTX and PDF (23 slides); PDF (3 pages)
簡介

透過將無線接取網路(RAN)功能引進至既有硬體,市售中央處理器廠商也能夠加入5G市場,然而卻面臨了必須一邊進行極為困難的作業一邊大幅降低成本的挑戰。因此,僅有一部分的供應商做出可以確保整體供應鏈雲端RAN服務盈利能力的端到端平台。

本報告針對大型晶片供應商因應5G時代的行動提供了詳細分析。

主要內容

  • 打算加入5G市場,或是希望守住市場地位的大型晶片供應商,要獲得成功的不可或缺因素
  • 預想中的支援5G晶片市場情形,以及和廣泛雲端基礎設施的關聯性
  • 能夠化解持續下降的網路總持有成本要件,與持續增加多樣性和複雜性的網路晶片之間的矛盾的最新電腦系統結構
  • 網路機器供應商與通訊業者將市售平台與開放原始碼框架結合,可以改善5G和雲端的經濟性,降低總成本
目錄

"A leading role in 5G is at stake for major chip providers if they can create an end-to-end platform as networks move to the cloud."

Deploying a RAN on commodity hardware opens the door for merchant processor makers in the 5G market, but comes with the challenge to reduce costs significantly while supporting extremely demanding tasks. Only a few vendors will achieve the end-to-end platform that will make the cloud-RAN economically viable for the whole supply chain.

In this report, we answer the following questions.

  • What are the critical success factors for large chip providers that are entering or defending their position in the 5G market?
  • What will the 5G chip landscape look like, and how will it relate to the broader cloud infrastructure?
  • How can new architecture resolve the conflict between falling network TCO requirements and the rising variety and complexity of network chips?
  • How can NEPs and operators improve their 5G and cloud economics and reduce their overall costs by combining merchant platforms with open-source frameworks?

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