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市場調查報告書

倒裝芯片市場:封裝技術,凸點技術,按機會分析和行業預測(2020-2027)

Flip Chip Market by Packaging Technology, Bumping Technology, and Industry : Global Opportunity Analysis and Industry Forecast, 2020-2027

出版商 Allied Market Research 商品編碼 951399
出版日期 內容資訊 英文 279 Pages
商品交期: 2-3個工作天內
價格
倒裝芯片市場:封裝技術,凸點技術,按機會分析和行業預測(2020-2027) Flip Chip Market by Packaging Technology, Bumping Technology, and Industry : Global Opportunity Analysis and Industry Forecast, 2020-2027
出版日期: 2020年06月01日內容資訊: 英文 279 Pages
簡介

全球倒裝芯片市場的增長主要受到對更小電路的需求增長,物聯網(IoT)的增長趨勢以及相對於引線鍵合的技術優勢的推動。此外,智能手機行業對傳感器的需求激增以及倒裝芯片越來越多地集成到個人電子設備(例如PC和移動電話)中,有望為市場提供機會。但是,安裝新製造設施所需的巨額初始投資和定制選項的減少阻礙了市場的增長。

本報告對全球倒裝芯片市場進行了調查,包括市場機會和影響,增長和限制,封裝技術/碰撞技術/行業/區域市場分析,競爭格局以及主要公司的概況。

內容

第1章簡介

第2章執行摘要

第3章市場概述

  • 市場定義和範圍
  • 波特的五力分析
  • 價值鏈分析
  • 市場動態
    • 生長因子
      • 繁榮的便攜式電子市場和物聯網(IoT)的日益普及
      • 用於焊料凸點的圖形卡和處理器
      • 與引線鍵合相比的技術優勢
    • 抑制因子
      • 與引線鍵合相比,成本高且定制選項少
    • 市場機會
      • 迫切需要電子設備中的高頻
  • COVID-19影響分析
    • 對市場規模的影響
    • 消費者趨勢,偏好和預算影響
    • 監管框架
    • 經濟影響
    • 領先公司應對負面影響的策略
    • 市場機會窗口

第4章市場分析:按包裝技術

  • 概述
    • 3D IC
    • 5D IC
    • 2D IC

第5章按碰撞技術進行市場分析

  • 概述
  • 銅柱(銅柱)
  • 焊錫顛簸
  • 撞金
  • 其他

第6章市場分析:按行業

  • 概述
  • 電子
  • 工業
  • 醫療保健
  • 汽車和運輸
  • IT/通訊
  • 航空航天與國防
  • 其他

第7章按地區進行市場分析

  • 概述
    • 市場規模和地區預測
  • 北美
  • 歐洲
  • 亞太地區
  • 拉丁美洲/中東/非洲

第8章競爭情況

  • 主要公司的職位分析(2019)
  • 主要成功策略
  • 競爭性儀表板
  • 主要發展
    • 產品發佈
    • 聯盟
    • 產品開發
    • 業務擴展
    • 收購

第9章公司簡介

  • 3M
    • 公司簡介
    • 主要軍官
    • 公司快照
    • 業務部門
    • 產品組合
    • 研發費用
    • 成就
    • 主要戰略運動和發展
  • ADVANCED MICRO DEVICES, INC.
  • AMKOR TECHNOLOGY
  • APPLE INC.
  • FUJITSU LIMITED
  • INTEL CORPORATION
  • INTERNATIONAL BUSINESS MACHINES CORPORATION
  • SAMSUNG ELECTRONICS CO., LTD.
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • TEXAS INSTRUMENTS INCORPORATED
目錄
Product Code: A01364

Title:
Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, and 2D IC), Bumping Technology (Solder Bumping, Gold Bumping, and Others), and Industry (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2020-2027.

Flip chip, also known as controlled collapse chip connection (C4), is used for interconnecting semiconductor devices, such as IC chips, microscopic devices, micro sensors, and microprocessor to external circuitry while utilizing deposited solder bumps onto the chip pads. Use of flip chip interconnections offers numerous advantages over conventional wire bond, which includes superior thermal & electrical performance, reduced form factors, well-defined construction, substrate flexibility for varying performance requirements, and the highest I/O capability.

The growth of the global flip chip market is majorly driven by rise in need for circuit miniaturization, rise in trend in Internet of Things (IoT), and technological superiority over wire bonding. However, huge initial investment required for setting up new manufacturing facility and less options for customization are the restraints associated with flip chip, which hamper the market growth. Moreover, surge in demand for sensors in smartphone industry and increase in integration of flip chip in personal electronic devices such as PCs and mobiles are expected to offer lucrative opportunities for the market.

The global flip chip market is segmented on the basis of flip chip packaging technology, bumping technology, industry, and region. On the basis of bumping technology, the market is divided into copper pillar, solder bumping, gold bumping, and others, including aluminum & conductive polymer bumping. The copper pillar segment dominates the market, as it is a next-generation flip chip interconnect, which meet current and future electronic device requirements. It serves as an ideal interconnect option for applications such as transceivers, embedded processors, and electrical processors.

On the basis of packaging technology, the market is categorized into 3D IC, 2.5D IC, and 2D IC. Among these, the 2.5D IC packaging segment dominated the market in 2019 owing to its several advantages such as superior capacity, improved performance, and minimal system space requirements, and low power consumption. Depending on industry, the market is fragmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. Region wise, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

The market players operating in the flip chip market include IBM Corporation, Intel Corporation, Fujitsu Ltd., 3M, Samsung electronics Co., Ltd, Amkor Packaging Technology, Inc., TSMC, Ltd, Apple, Inc., Texas Instruments, Inc., and AMD, Inc. These major players have adopted various key development strategies such as business expansion, and new product launch, which help them to strengthen their foothold in the market.

KEY BENEFITS FOR STAKEHOLDERS

  • The study provides an in-depth analysis of the current & future trends of the market to elucidate the imminent investment pockets.
  • Information about key drivers, restraints, and opportunities and their impact analysis on the global flip chip market share is provided.
  • Porter's five forces analysis illustrates the potency of the buyers and suppliers operating in the global flip chip industry.
  • The quantitative analysis of the market from 2019 to 2027 is provided to determine the global flip chip market potential.

KEY MARKET SEGMENTS

By Packaging Technology

  • 3D IC
  • 2.5D IC
  • 2D IC

By Bumping Technology

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others (Aluminum & Conductive Polymer)

By Industry

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense
  • Others

By Region

  • North America
    • U.S.
    • Canada
  • Europe
    • Germany
    • France
    • UK
    • Rest of Europe
  • Asia-Pacific
    • Japan
    • China
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

KEY MARKET PLAYERS

  • 3M
  • Advanced Micro Devices, Inc.
  • Amkor Technology
  • Apple Inc.
  • Fujitsu Limited
  • Intel Corporation
  • International Business Machines Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

  • 1.1.REPORT DESCRIPTION
  • 1.2.KEY BENEFITS FOR STAKEHOLDERS
  • 1.3.KEY MARKET SEGMENTS
  • 1.4.KEY MARKET PLAYERS
  • 1.5.RESEARCH METHODOLOGY
    • 1.5.1.Secondary research
    • 1.5.2.Primary research
    • 1.5.3.Analyst tools & models

CHAPTER 2: EXECUTIVE SUMMARY

  • 2.1.KEY FINDINGS
    • 2.1.1.Top impacting factors
    • 2.1.2.Top investment pockets
  • 2.2.CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW

  • 3.1.MARKET DEFINITION AND SCOPE
  • 3.2.KEY FORCES SHAPING THE GLOBAL FLIP CHIP MARKET
  • 3.3.VALUE CHAIN ANALYSIS
  • 3.4.MARKET DYNAMICS
    • 3.4.1.Drivers
      • 3.4.1.1.Thriving portable electronic market and increasing popularity of internet of things (IoT)
      • 3.4.1.2.Usage in graphic cards and processors used in real world Solder Bumping
      • 3.4.1.3.Technological superiority over wire bonding
    • 3.4.2.Restraint
      • 3.4.2.1.Higher cost and less customization options available in comparison to wire bonding
    • 3.4.3.Opportunity
      • 3.4.3.1.Impending need of high frequency in electronic gadget
  • 3.5. COVID-19 IMPACT ANALYSIS ON CLOUD MIGRATION SERVICES MARKET
    • 3.5.1. Impact on market size
    • 3.5.2. Consumer trends, preferences, and budget impact
    • 3.5.3. Regulatory framework
    • 3.5.4. Economic impact
    • 3.5.5. Key player strategies to tackle negative impact
    • 3.5.6. Opportunity window

CHAPTER 4: GLOBAL FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY

  • 4.1.OVERVIEW
    • 4.2. 3D IC
      • 4.2.1.Key market trends, growth factors, and opportunities
      • 4.2.2.Market size and forecast, by region
      • 4.2.3.Market analysis, by country
    • 4.3. 2.5D IC
      • 4.3.1.Key market trends, growth factors, and opportunities
      • 4.3.2.Market size and forecast, by region
      • 4.3.3.Market analysis, by country
    • 4.4. 2D IC
      • 4.4.1.Key market trends, growth factors, and opportunities
      • 4.4.2.Market size and forecast, by region
      • 4.4.3.Market analysis, by country

CHAPTER 5: GLOBAL FLIP CHIP MARKET, BY BUMPING TECHNOLOGY

  • 5.1.OVERVIEW
  • 5.2.COPPER PILLAR
    • 5.2.1.Key market trends, growth factors, and opportunities
    • 5.2.2.Market size and forecast, by region
    • 5.2.3.Market analysis, by country
  • 5.3.SOLDER BUMPING
    • 5.3.1.Key market trends, growth factors, and opportunities
    • 5.3.2.Market size and forecast, by region
    • 5.3.3.Market analysis, by country
  • 5.4.GOLD BUMPING
    • 5.4.1.Key market trends, growth factors, and opportunities
    • 5.4.2.Market size and forecast, by region
    • 5.4.3.Market analysis, by country
  • 5.5.OTHERS
    • 5.5.1.Key market trends, growth factors, and opportunities
    • 5.5.2.Market size and forecast, by region
    • 5.5.3.Market analysis, by country

CHAPTER 6: GLOBAL FLIP CHIP MARKET, BY INDUSTRY VERTICAL

  • 6.1.OVERVIEW
  • 6.2.ELECTRONICS
    • 6.2.1.Key market trends, growth factors, and opportunities
    • 6.2.2.Market size and forecast, by region
    • 6.2.3.Market analysis, by country
  • 6.3.INDUSTRIAL
    • 6.3.1.Key market trends, growth factors, and opportunities
    • 6.3.2.Market size and forecast, by region
    • 6.3.3.Market analysis, by country
  • 6.4.HEALTHCARE
    • 6.4.1.Key market trends, growth factors, and opportunities
    • 6.4.2.Market size and forecast, by region
    • 6.4.3.Market analysis, by country
  • 6.5.AUTOMOTIVE & TRANSPORT
    • 6.5.1.Key market trends, growth factors, and opportunities
    • 6.5.2.Market size and forecast, by region
    • 6.5.3.Market analysis, by country
  • 6.6.IT & TELECOMMUNICATION
    • 6.6.1.Key market trends, growth factors, and opportunities
    • 6.6.2.Market size and forecast, by region
    • 6.6.3.Market analysis, by country
  • 6.7.AEROSPACE & DEFENSE
    • 6.7.1.Key market trends, growth factors, and opportunities
    • 6.7.2.Market size and forecast, by region
    • 6.7.3.Market analysis, by country
  • 6.8.OTHERS
    • 6.8.1.Key market trends, growth factors, and opportunities
    • 6.8.2.Market size and forecast, by region
    • 6.8.3.Market analysis, by country

CHAPTER 7: GLOBAL FLIP CHIP MARKET, BY REGION

  • 7.1.OVERVIEW
    • 7.1.1.Market size and forecast, by region
  • 7.2.NORTH AMERICA
    • 7.2.1.Key market trends, growth factors, and opportunities
    • 7.2.2.Market size and forecast, by packaging technology
    • 7.2.3.Market size and forecast, by bumping technology
    • 7.2.4.Market size and forecast, by industry vertical
    • 7.2.5.Market analysis, by country
      • 7.2.5.1.U.S.
      • 7.2.5.1.1.Market size and forecast, by packaging technology
      • 7.2.5.1.2.Market size and forecast, by bumping technology
      • 7.2.5.1.3.Market size and forecast, by industry vertical
      • 7.2.5.2.CANADA
      • 7.2.5.2.1.Market size and forecast, by packaging technology
      • 7.2.5.2.2.Market size and forecast, by bumping technology
      • 7.2.5.2.3.Market size and forecast, by industry vertical
  • 7.3.EUROPE
    • 7.3.1.Key market trends, growth factors, and opportunities
    • 7.3.2.Market size and forecast, by packaging technology
    • 7.3.3.Market size and forecast, by bumping technology
    • 7.3.4.Market size and forecast, by industry vertical
    • 7.3.5.Market analysis, by country
      • 7.3.5.1.GERMANY
      • 7.3.5.1.1.Market size and forecast, by packaging technology
      • 7.3.5.1.2.Market size and forecast, by bumping technology
      • 7.3.5.1.3.Market size and forecast, by industry vertical
      • 7.3.5.2.FRANCE
      • 7.3.5.2.1.Market size and forecast, by packaging technology
      • 7.3.5.2.2.Market size and forecast, by bumping technology
      • 7.3.5.2.3.Market size and forecast, by industry vertical
      • 7.3.5.3.UK
      • 7.3.5.3.1.Market size and forecast, by packaging technology
      • 7.3.5.3.2.Market size and forecast, by bumping technology
      • 7.3.5.3.3.Market size and forecast, by industry vertical
      • 7.3.5.4.SPAIN
      • 7.3.5.4.1.Market size and forecast, by packaging technology
      • 7.3.5.4.2.Market size and forecast, by bumping technology
      • 7.3.5.4.3.Market size and forecast, by industry vertical
      • 7.3.5.5.REST OF EUROPE
      • 7.3.5.5.1.Market size and forecast, by packaging technology
      • 7.3.5.5.2.Market size and forecast, by bumping technology
      • 7.3.5.5.3.Market size and forecast, by industry vertical
  • 7.4.ASIA-PACIFIC
    • 7.4.1.Key market trends, growth factors, and opportunities
    • 7.4.2.Market size and forecast, by packaging technology
    • 7.4.3.Market size and forecast, by bumping technology
    • 7.4.4.Market size and forecast, by industry vertical
    • 7.4.5.Market analysis, by country
      • 7.4.5.1.JAPAN
      • 7.4.5.1.1.Market size and forecast, by packaging technology
      • 7.4.5.1.2.Market size and forecast, by bumping technology
      • 7.4.5.1.3.Market size and forecast, by industry vertical
      • 7.4.5.2.CHINA
      • 7.4.5.2.1.Market size and forecast, by packaging technology
      • 7.4.5.2.2.Market size and forecast, by bumping technology
      • 7.4.5.2.3.Market size and forecast, by industry vertical
      • 7.4.5.3.INDIA
      • 7.4.5.3.1.Market size and forecast, by packaging technology
      • 7.4.5.3.2.Market size and forecast, by bumping technology
      • 7.4.5.3.3.Market size and forecast, by industry vertical
      • 7.4.5.4.AUSTRALIA
      • 7.4.5.4.1.Market size and forecast, by packaging technology
      • 7.4.5.4.2.Market size and forecast, by bumping technology
      • 7.4.5.4.3.Market size and forecast, by industry vertical
      • 7.4.5.5.REST OF ASIA-PACIFIC
      • 7.4.5.5.1.Market size and forecast, by packaging technology
      • 7.4.5.5.2.Market size and forecast, by bumping technology
      • 7.4.5.5.3.Market size and forecast, by industry vertical
  • 7.5.LAMEA
    • 7.5.1.Key market trends, growth factors, and opportunities
    • 7.5.2.Market size and forecast, by packaging technology
    • 7.5.3.Market size and forecast, by bumping technology
    • 7.5.4.Market size and forecast, by industry vertical
    • 7.5.5.Market analysis, by country
      • 7.5.5.1.LATIN AMERICA
      • 7.5.5.1.1.Market size and forecast, by packaging technology
      • 7.5.5.1.2.Market size and forecast, by bumping technology
      • 7.5.5.1.3.Market size and forecast, by industry vertical
      • 7.5.5.2.MIDDLE EAST
      • 7.5.5.2.1.Market size and forecast, by packaging technology
      • 7.5.5.2.2.Market size and forecast, by bumping technology
      • 7.5.5.2.3.Market size and forecast, by industry vertical
      • 7.5.5.3.AFRICA
      • 7.5.5.3.1.Market size and forecast, by packaging technology
      • 7.5.5.3.2.Market size and forecast, by bumping technology
      • 7.5.5.3.3.Market size and forecast, by industry vertical

CHAPTER 8: COMPETITIVE LANDSCAPE

  • 8.1.KEY PLAYERS POSITIONING ANALYSIS, 2019
  • 8.2.TOP WINNING STRATEGIES
  • 8.3.COMPETITIVE DASHBOARD
  • 8.4.KEY DEVELOPMENTS
    • 8.4.1.Product launches
    • 8.4.2.Partnership
    • 8.4.3.Product development
    • 8.4.4.Business expansion
    • 8.4.5.Acquisition

CHAPTER 9: COMPANY PROFILE

  • 9.1.3M
    • 9.1.1.Company overview
    • 9.1.2.Key executives
    • 9.1.3.Company snapshot
    • 9.1.4.Operating business segments
    • 9.1.5.Product portfolio
    • 9.1.6.R&D expenditure
    • 9.1.7.Business performance
    • 9.1.8.Key strategic moves and developments
  • 9.2.ADVANCED MICRO DEVICES, INC.
    • 9.2.1.Company overview
    • 9.2.2.Key executives
    • 9.2.3.Company snapshot
    • 9.2.4.Operating business segments
    • 9.2.5.Product portfolio
    • 9.2.6.R&D expenditure
    • 9.2.7.Business performance
    • 9.2.8.Key strategic moves and developments
  • 9.3.AMKOR TECHNOLOGY
    • 9.3.1.Company overview
    • 9.3.2.Key executives
    • 9.3.3.Company snapshot
    • 9.3.4.Product portfolio
    • 9.3.5.R&D expenditure
    • 9.3.6.Business performance
    • 9.3.7.Key strategic moves and developments
  • 9.4.APPLE INC.
    • 9.4.1.Company overview
    • 9.4.2.Key executives
    • 9.4.3.Company snapshot
    • 9.4.4.Operating business segments
    • 9.4.5.Product portfolio
    • 9.4.6.R&D expenditure
    • 9.4.7.Business performance
    • 9.4.8.Key strategic moves and developments
  • 9.5.FUJITSU LIMITED
    • 9.5.1.Company overview
    • 9.5.2.Key Executives
    • 9.5.3.Company snapshot
    • 9.5.4.Operating business segments
    • 9.5.5.Product portfolio
    • 9.5.6.R&D Expenditure
    • 9.5.7.Business performance
    • 9.5.8.Key strategic moves and developments
  • 9.6.INTEL CORPORATION
    • 9.6.1.Company overview
    • 9.6.2.Key executives
    • 9.6.3.Company snapshot
    • 9.6.4.Operating business segments
    • 9.6.5.Product portfolio
    • 9.6.6.R&D expenditure
    • 9.6.7.Business performance
    • 9.6.8.Key strategic moves and developments
  • 9.7.INTERNATIONAL BUSINESS MACHINES CORPORATION
    • 9.7.1.Company overview
    • 9.7.2.Key Executives
    • 9.7.3.Company snapshot
    • 9.7.4.Operating business segments
    • 9.7.5.Product portfolio
    • 9.7.6.R&D expenditure
    • 9.7.7.Business performance
    • 9.7.8.Key strategic moves and developments
  • 9.8.SAMSUNG ELECTRONICS CO., LTD.
    • 9.8.1.Company overview
    • 9.8.2.Key Executives
    • 9.8.3.Company snapshot
    • 9.8.4.Operating business segments
    • 9.8.5.Product portfolio
    • 9.8.6.R&D expenditure
    • 9.8.7.Business performance
    • 9.8.8.Key strategic moves and developments
  • 9.9.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • 9.9.1.Company overview
    • 9.9.2.Key executives
    • 9.9.3.Company snapshot
    • 9.9.4.Product portfolio
    • 9.9.5.R&D expenditure
    • 9.9.6.Business performance
    • 9.9.7.Key strategic moves and developments
  • 9.10.TEXAS INSTRUMENTS INCORPORATED
    • 9.10.1.Company overview
    • 9.10.2.Key executives
    • 9.10.3.Company snapshot
    • 9.10.4.Operating business segments
    • 9.10.5.Product portfolio
    • 9.10.6.R&D expenditure
    • 9.10.7.Business performance

LIST OF TABLES

  • TABLE 01.COMPARISON BETWEEN THE PROPERTIES OF WIRE BONDING AND FLIP CHIP
  • TABLE 02.GLOBAL FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 03.FLIP CHIP MARKET REVENUE FOR 3D IC, BY REGION 2019-2027 ($BILLION)
  • TABLE 04.FLIP CHIP MARKET REVENUE FOR2.5D IC, BY REGION 2019-2027 ($BILLION)
  • TABLE 05.FLIP CHIP MARKET REVENUE FOR 2D IC, BY REGION 2019-2027 ($BILLION)
  • TABLE 06.GLOBAL FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 07.FLIP CHIP MARKET REVENUE FORCOPPER PILLAR, BY REGION 2019-2027 ($BILLION)
  • TABLE 08.FLIP CHIP MARKET REVENUE FORSOLDER BUMPING, BY REGION, 2019-2027 ($BILLION)
  • TABLE 09.FLIP CHIP MARKET REVENUE FOR GOLD BUMPING, BY REGION 2019-2027 ($BILLION)
  • TABLE 10.FLIP CHIP MARKET REVENUE FOR OTHERS, BY REGION 2019-2027 ($BILLION)
  • TABLE 11.GLOBAL FLIP CHIP MARKET, BY INDUSTRY VERTICAL, 2019-2027 ($BILLION)
  • TABLE 12.FLIP CHIP MARKET REVENUE FORELECTRONICS, BY REGION, 2019-2027 ($BILLION)
  • TABLE 13.FLIP CHIP MARKET REVENUE FOR INDUSTRIAL, BY REGION, 2019-2027 ($BILLION)
  • TABLE 14.GLOBAL FLIP CHIP MARKET REVENUE FOR HEALTHCARE, BY REGION 2019-2027 ($BILLION)
  • TABLE 15.GLOBAL FLIP CHIP MARKET REVENUE FOR AUTOMOTIVE & TRANSPORT, BY REGION 2019-2027 ($BILLION)
  • TABLE 16.GLOBAL FLIP CHIP MARKET REVENUE FOR IT & TELECOMMUNICATION, BY REGION 2019-2027 ($BILLION)
  • TABLE 17.GLOBAL FLIP CHIP MARKET REVENUE FOR AEROSPACE & DEFENSE, BY REGION 2019-2027 ($BILLION)
  • TABLE 18.GLOBAL FLIP CHIP MARKET REVENUE FOR OTHERS, BY REGION 2019-2027 ($BILLION)
  • TABLE 19.FLIP CHIP MARKET REVENUE, BY REGION, 2019-2027 ($BILLION)
  • TABLE 20.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 21.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 22.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019-2027 ($BILLION)
  • TABLE 23.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019-2027 ($BILLION)
  • TABLE 24.U.S. FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 25.U.S. FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 26.U.S. FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 27.CANADA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 28.CANADA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 29.CANADA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 30.EUROPE FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 31.EUROPE FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 32.EUROPE FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019-2027 ($BILLION)
  • TABLE 33.EUROPE FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019-2027 ($BILLION)
  • TABLE 34.GERMANY FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 35.GERMANY FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 36.GERMANY FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 37.FRANCE FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 38.FRANCE FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 39.FRANCE FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 40.UK FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 41.UK FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 42.UK FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 43.SPAIN FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 44.SPAIN FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 45.SPAIN FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 46.REST OF EUROPE FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 47.REST OF EUROPE FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 48.REST OF EUROPE FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 49.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 50.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 51.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019-2027 ($BILLION)
  • TABLE 52.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019-2027 ($BILLION)
  • TABLE 53.JAPAN FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 54.JAPAN FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 55.JAPAN FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 56.CHINA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 57.CHINA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 58.CHINA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 59.INDIA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 60.INDIA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 61.INDIA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 62.AUSTRALIA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 63.AUSTRALIA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 64.AUSTRALIA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 65.REST OF ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 66.REST OF ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 67.REST OF ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 68.LAMEA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 69.LAMEA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 70.LAMEA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019-2027 ($BILLION)
  • TABLE 71.LAMEA FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019-2027 ($BILLION)
  • TABLE 72.LATIN AMERICA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 73.LATIN AMERICA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 74.LATIN AMERICA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 75.MIDDLE EAST FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 76.MIDDLE EAST FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 77.MIDDLE EAST FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 78.AFRICA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 79.AFRICA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)
  • TABLE 80.AFRICA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019-2027 ($BILLION)
  • TABLE 81.KEY NEW PRODUCT LAUNCHES (2016-2019)
  • TABLE 82.PARTNERSHIP (2016-2019)
  • TABLE 83.PRODUCT DEVELOPMENT (2016-2019)
  • TABLE 84.KEY EXPANSION (2016-2019)
  • TABLE 85.KEY ACQUISITION (2016-2019)
  • TABLE 86.3M: KEY EXECUTIVES
  • TABLE 87.3M: COMPANY SNAPSHOT
  • TABLE 88.3M: OPERATING SEGMENTS
  • TABLE 89.3M: PRODUCT PORTFOLIO
  • TABLE 90.3M: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 91.ADVANCED MICRO DEVICES, INC.: KEY EXECUTIVES
  • TABLE 92.ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
  • TABLE 93.ADVANCED MICRO DEVICES, INC.: OPERATING SEGMENTS
  • TABLE 94.ADVANCED MICRO DEVICES, INC.: PRODUCT PORTFOLIO
  • TABLE 95.AMKOR TECHNOLOGY.: COMPANY SNAPSHOT
  • TABLE 96.AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO
  • TABLE 97.APPLE INC.: KEY EXECUTIVES
  • TABLE 98.APPLE INC.: COMPANY SNAPSHOT
  • TABLE 99.APPLE INC.: PRODUCT CATEGORIES
  • TABLE 100.APPLE INC.: PRODUCT PORTFOLIO
  • TABLE 101.FUJITSU LIMITED: KEY EXECUTIVES
  • TABLE 102.FUJITSU LIMITED: COMPANY SNAPSHOT
  • TABLE 103.FUJITSU LIMITED: OPERATING SEGMENTS
  • TABLE 104.FUJITSU LIMITED: PRODUCT PORTFOLIO
  • TABLE 105.INTEL CORPORATION: KEY EXECUTIVES
  • TABLE 106.INTEL CORPORATION: COMPANY SNAPSHOT
  • TABLE 107.INTEL CORPORATION: OPERATING SEGMENTS
  • TABLE 108.INTEL CORPORATION: VIDEO ANALYTICS PRODUCT PORTFOLIO
  • TABLE 109.INTERNATIONAL BUSINESS MACHINES CORPORATION: KEY EXECUTIVES
  • TABLE 110.INTERNATIONAL BUSINESS MACHINES CORPORATION: COMPANY SNAPSHOT
  • TABLE 111.INTERNATIONAL BUSINESS MACHINES CORPORATION: OPERATING SEGMENTS
  • TABLE 112.INTERNATIONAL BUSINESS MACHINES CORPORATION: PRODUCT PORTFOLIO
  • TABLE 113.SAMSUNG ELECTRONICS CO., LTD.: KEY EXECUTIVES
  • TABLE 114.SAMSUNG ELECTRONICS CO., LTD.: COMPANY SNAPSHOT
  • TABLE 115.SAMSUNG ELECTRONICS CO., LTD.: OPERATING SEGMENTS
  • TABLE 116.SAMSUNG ELECTRONICS CO., LTD.: PRODUCT PORTFOLIO
  • TABLE 120.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 121.TEXAS INSTRUMENTS INCORPORATED: KEY EXECUTIVES
  • TABLE 122.TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
  • TABLE 123.TEXAS INSTRUMENTS INCORPORATED: OPERATING SEGMENTS
  • TABLE 124.TEXAS INSTRUMENTS INCORPORATED: PRODUCT PORTFOLIO

LIST OF FIGURES

  • FIGURE 01.KEY MARKET SEGMENTS
  • FIGURE 02.GLOBAL FLIP CHIP MARKET, 2019-2027
  • FIGURE 03.GLOBAL FLIP CHIP MARKET, BY REGION, 2019-2027
  • FIGURE 04.TOP IMPACTING FACTORS
  • FIGURE 05.TOP INVESTMENT POCKETS
  • FIGURE 06.TOP PLAYERS OF THE GLOBAL FLIP CHIP MARKET
  • FIGURE 07.MODERATE-TO-HIGH BARGAINING POWER OF SUPPLIERS
  • FIGURE 08.MODERATE-TO-HIGH BARGAINING POWER OF BUYER
  • FIGURE 09.MODERATE-TO-HIGH THREAT OF SUBSTITUTES
  • FIGURE 10.MODERATE-TO-HIGH THREAT OF NEW ENTRANTS
  • FIGURE 11.LOW-TO-HIGH COMPETITIVE RIVALRY
  • FIGURE 12.VALUE CHAIN ANALYSIS OF FLIP CHIP MARKET
  • FIGURE 13.MARKET DYNAMICS: GLOBAL FLIP CHIP MARKET
  • FIGURE 14.GLOBAL FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY, 2019-2027
  • FIGURE 15.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR 3D IC, BY COUNTRY, 2018 &2026 (%)
  • FIGURE 16.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR 2.5D IC, BY COUNTRY, 2018 &2026 (%)
  • FIGURE 17.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR 2D IC, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 18.GLOBAL FLIP CHIP MARKET, BY BUMPING TECHNOLOGY, 2019-2027
  • FIGURE 19.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR COPPER PILLAR, BY COUNTRY, 2018 & 2026(%)
  • FIGURE 20.COMPARATIVE SHARE ANALYSIS OF GLOBAL FLIP CHIP MARKET FOR SOLDER BUMPING, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 21.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET GOLD BUMPING, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 22.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR OTHERS, BY COUNTRY, 2018 &2026 (%)
  • FIGURE 23.GLOBAL FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019-2027 ($BILLION)
  • FIGURE 24.COMPARATIVE SHARE ANALYSIS OF GLOBAL FLIP CHIP MARKET FOR ELECTRONICS, BY COUNTRY, 2018 &2026 (%)
  • FIGURE 25.COMPARATIVE SHARE ANALYSIS OF GLOBAL FLIP CHIP MARKET FOR INDUSTRIAL, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 26.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR HEALTHCARE, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 27.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR AUTOMOTIVE & TRANSPORT, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 28.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR IT & TELECOMMUNICATION, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 29.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR AEROSPACE & DEFENSE, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 30.COMPARATIVE SHARE ANALYSIS GLOBAL FLIP CHIP MARKET FOR OTHERS, BY COUNTRY, 2018 & 2026 (%)
  • FIGURE 31.FLIP CHIP MARKET REVENUE, BY REGION, 2019-2027 ($BILLION)
  • FIGURE 32.U.S. FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 33.CANADA FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 34.GERMANY FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 35.FRANCE FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 36.UK FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 37.SPAIN FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 38.REST OF EUROPE FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 39.JAPAN FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 40.CHINA FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 41.INDIA FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 42.AUSTRALIA FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 43.REST OF ASIA-PACIFIC FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 44.LATIN AMERICA FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 45.MIDDLE EAST FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 46.AFRICA FLIP CHIP MARKET REVENUE, 2019-2027 ($BILLION)
  • FIGURE 47.KEY PLAYER POSITIONING ANLYSIS: GLOBAL FLIP CHIP MARKET
  • FIGURE 48.TOP WINNING STRATEGIES, BY YEAR, 2017-2020
  • FIGURE 49.TOP WINNING STRATEGIES, BY DEVELOPMENT, 2017-2020
  • FIGURE 50.TOP WINNING STRATEGIES, BY COMPANY, 2017-2020
  • FIGURE 51.COMPETITIVE DASHBOARD
  • FIGURE 52.COMPETITIVE DASHBOARD
  • FIGURE 53.COMPETITIVE HEATMAP OF KEY PLAYERS
  • FIGURE 54.3M: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 55.3M: REVENUE, 2017-2019 ($BILLION)
  • FIGURE 56.3M: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 57.3M: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 58.3M: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 59.ADVANCED MICRO DEVICES, INC.: REVENUE, 2017-2019 ($BILLION)
  • FIGURE 60.ADVANCED MICRO DEVICES, INC.: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 61.ADVANCED MICRO DEVICES, INC.: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 62.AMKOR TECHNOLOGY: KEY EXECUTIVES
  • FIGURE 63.AMKOR TECHNOLOGY: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 64.AMKOR TECHNOLOGY: REVENUE, 2017-2019 ($BILLION)
  • FIGURE 65.AMKOR TECHNOLOGY: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 66.R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 67.APPLE INC.: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 68.APPLE INC.: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 69.APPLE INC.: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 70.R&D EXPENDITURE, 2016-2018 ($MILLION)
  • FIGURE 71.FUJITSU LIMITED: REVENUE, 2016-2018 ($MILLION)
  • FIGURE 72.FUJITSU LIMITED: REVENUE SHARE BY SEGMENT, 2018 (%)
  • FIGURE 73.FUJITSU LIMITED: REVENUE SHARE BY REGION, 2018 (%)
  • FIGURE 74.R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 75.INTEL CORPORATION: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 76.INTEL CORPORATION: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 77.R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 78.INTERNATIONAL BUSINESS MACHINES CORPORATION: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 79.INTERNATIONAL BUSINESS MACHINES CORPORATION: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 80.INTERNATIONAL BUSINESS MACHINES CORPORATION: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 81.R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 82.SAMSUNG ELECTRONICS CO., LTD.: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 83.SAMSUNG ELECTRONICS CO., LTD.: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 84.SAMSUNG ELECTRONICS CO., LTD.: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 85.R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 86.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 87.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 88.R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 89.TEXAS INSTRUMENTS INCORPORATED: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 90.TEXAS INSTRUMENTS INCORPORATED: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 91.TEXAS INSTRUMENTS INCORPORATED: REVENUE SHARE BY REGION, 2019 (%)