iPhone 7 Plus的分解分析:摘要
iPhone 7 Plus Teardown Summary Report
|出版日期||內容資訊||英文 11 Pages
|iPhone 7 Plus的分解分析:摘要 iPhone 7 Plus Teardown Summary Report|
|出版日期: 2017年09月27日||內容資訊: 英文 11 Pages||
本報告提供iPhone 7 Plus的內部結構和使用零件相關分析，產品整體X光掃描攝影，及內部拆卸後的零件單位的說明、插圖說明，功能機制 (方塊圖)，零件一覽 (Bill of materials) 和各分類的明細，零件供應商的概要的資訊彙整，為您概述為以下內容。
This Teardown Summary Report is being made available to subscribers of the ABI Research Handsets & Device Service to provide additional value to the data, reports and insights already included within the service. Subscribers to the ABI Research teardown services can access additional details and tools at the above link.
ABI Research's Teardowns uncover innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs. We provide clients unmatched intelligence into phones, tablets, wearables, smart home devices, and components. Teardown reports include pinpoint power measurements, detailed parts lists, block diagrams, x-rays, and high-resolutions photos. Each step of the teardown process is carefully documented by our experts to present detailed insights into component parts and costs, as well as chip system functionality. And, our web-based format allows our clients to access immediate updates of our Teardowns, as our analysis progresses.
this report includes the following information: