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iPhone 7 Plus的分解分析:摘要

iPhone 7 Plus Teardown Summary Report

出版商 ABI Research 商品編碼 559642
出版日期 內容資訊 英文 11 Pages
商品交期: 最快1-2個工作天內
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iPhone 7 Plus的分解分析:摘要 iPhone 7 Plus Teardown Summary Report
出版日期: 2017年09月27日 內容資訊: 英文 11 Pages

本報告提供iPhone 7 Plus的內部結構和使用零件相關分析,產品整體X光掃描攝影,及內部拆卸後的零件單位的說明、插圖說明,功能機制 (方塊圖),零件一覽 (Bill of materials) 和各分類的明細,零件供應商的概要的資訊彙整,為您概述為以下內容。


  • 設備的特徵
  • 內部零件、設備 (附插圖說明)
  • 設備全體/基板的X光掃描攝影照片
  • 方塊圖
  • 材料清單 (BOM)的概要
  • 零件的類別與供應商
Product Code: PT-2046


This Teardown Summary Report is being made available to subscribers of the ABI Research Handsets & Device Service to provide additional value to the data, reports and insights already included within the service. Subscribers to the ABI Research teardown services can access additional details and tools at the above link.

ABI Research's Teardowns uncover innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs. We provide clients unmatched intelligence into phones, tablets, wearables, smart home devices, and components. Teardown reports include pinpoint power measurements, detailed parts lists, block diagrams, x-rays, and high-resolutions photos. Each step of the teardown process is carefully documented by our experts to present detailed insights into component parts and costs, as well as chip system functionality. And, our web-based format allows our clients to access immediate updates of our Teardowns, as our analysis progresses.

Features Summary


this report includes the following information:

  • Device features
  • Box content and device photos
  • Full device X-rays and board photos
  • Block diagram
  • Bill of materials (BOM) summary
  • Component category and supplier
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