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Materials Market Data Subscription (MMDS)

出版商 SEMI 商品編碼 44297
出版日期 4 Issues/Year 內容資訊 英文
全球半導體材料市場資料 Materials Market Data Subscription (MMDS)
出版日期: 4 Issues/Year 內容資訊: 英文

身為半導體、FPD、MEMS、奈米科技相關生產設備・材料產業的國際工會,同時也從事該領域市場調查及統計分析的SEMI(總公司:California State),提供彙整全球半導體材料市場資料的年度資訊服務"Material Market Data Subscription (MMDS)"



  • 製造材料
    • 矽晶
    • SOI
    • 光罩
    • 抗蝕劑
    • 附屬品
    • 瓦斯
    • 化學藥品
    • 目標
    • CMP
    • 其他
  • 封裝材料
    • 導線架
    • 封裝載板
    • 銲線
    • 黏晶片
    • 封模化合物/封膠材料
    • 陶瓷封裝材料
    • 其他


  • 北美
  • 歐洲
  • 其他(ROW)
  • 日本
  • 台灣
  • 韓國
  • 中國


The SEMI Materials Market Data Subscription includes current revenue data along with two-year forecast and ten years of historical data.

The report contains 10 segments for wafer fab related materials and 7 segments for packaging related materials. In addition, quarterly revenues are included for photoresist, photoresit ancillaries and electronic gases. Shipment numbers are included for silicon* (quarterly) and leadframe (monthly).

Seven regions of the world are covered in this report including North America, Japan, Korea, Taiwan, China, and Rest of World (ROW).

All sales revenue estimates are reflected in U.S dollars.

Product Information:

  • Fab Materials Covered: Silicon, SOI, Photomasks, Photoresists, Photoresist Ancillaries, Gases, Process Chemicals, CMP, Other Wafer Fab Materials;
  • Packaging Materials Covered: Leadframes, Substrates, Bonding Wire, Die Attatch, Mold Compound/Encapsulants, Ceramic Packages, Other Packaging Materials

Table of Contents(Tabs of Spreadsheet)

  • Intro
  • Category Definitions
  • Detailed Annual Silicon Data
  • Bonding Wire Market
  • Wafer Fab Materials
  • Packaging Materials
  • Detailed Annual Gas Sales
  • Quarterly Silicon Shipments
  • Quarterly Photoresist Sales
  • Quarterly PR Ancillary Sales
  • Quarterly Process Gas Sales
  • Monthly Leadframe Shipments