|
|
|
市場調查報告書
IPD（Integrated Passive Device）市場：技術・應用・市場・企業動向 - 2009年
IPD 2009 - Integrated Passive & Active devices
|
IPD（Integrated Passive Device）市場：技術・應用・市場・企業動向 - 2009年 是由出版商Yole Developpement在2009年07月所出版的。
這份英文市場調查報告書包含430 pages 價格從美金5790起跳。
IPD（整合被動元件）市場的規模在今年預計超週6億美元，在2013年達到10億美元。
本報告書內容包括：IPD的技術動向及在個別應用領域的市場佔有率、供應商價值鏈、目前主要企業的策略及未來預測等。內容綱要摘記如下：
第1章 介紹、定義、本報告書的範圍
- 固態 vs. 整合被動元件解決方案概要
- 集積主動式・被動式結構的定義
- 薄膜／厚膜IPD技術比較
第2章 薄膜IPD應用及促進市場發展因素
- IPD的分類
- 現在及未來的應用
- IPD的優點及各區隔市場及詳細用途
第3章 薄膜IPD市場動向及2008年至2015年的預測
- IPD市場預測
- 每一種用途的出貨量
- 區隔市場別
- 電路板別
- 整合程度別
- 包裝平台
- 主要企業的市場佔有率及收益
- 前15大企業2008年收益
- 根據2008年收益計算的市場佔有率
- 特定的市場佔有率
第4章 薄膜IPD技術
- IPD元件條件及技術選擇
- IPD製造課題及相關設備・材料工具箱
- 系統水準共同開發的IPD設計、模擬及預測
第5章 薄膜IPD架構、組裝、包裝
- 針對IPD的整合、包裝、組裝平台
- 矽：實現3D的必要步驟
- 擴散型晶圓水準包裝及內建晶圓概念
- IPD整體的技術藍圖
第6章 薄膜IPD供應鏈及主要企業
- 各種企業的地理地圖
- IPD商業模式分析
- IPD企業能力摘要
- 目前及未來的IPD商品化課題
第7章 結論及未來預測
Abstract
MARKET TREND
From a commodity technology initially developed to replace bulky discrete
passive components, thin-film Integrated Passive Devices (IPD' s) are now a
growing industry trend driven by RF, High Brightness LEDs, Digital & Mixed
Signal applications.
Yole' s new research study on Thin-film Integrated Passive and Active devices
estimates the total IPD market to grow from more than $600M this year to over
$1B by 2013. Whether it is to reduce space on the application board, to
enhance performance or to reduce cost at the system level, IPD' s are spreading
to most electronic sectors, from low volume to mass market businesses in
aerospace, military, medical, industrial, lighting, communications, and PC
applications.
Over the past few years, IPD' s have become an essential enabler of
System-in-Packages (Sip) realizations. Looking to tomorrow, IPD' s have become
an essential enabler of System-in-Packages (Sip) realizations. Looking to
tomorrow, IPD' s are paving the way to the bright future of the "More than
Moore" heterogeneous integration as they contribute greatly to bridging
technologies. IPD' s enable the assembly of shrinking geometries of CMOS IC' s
and the lagging packaging technologies. IPD' s enable the assembly of
increasingly complete and autonomous systems with the integration of diverse
electronic functions such as sensors, RF transceivers, MEMS, power amplifiers,
power management units and digital processors.
Table of Contents
1. INTRODUCTION, DEFINITIONS & SCORE OF THE REPORT
- Overview of discrete versus integrated passives solutions
- Integrated active and passive, structures definitions (inductor,
capacitor; resistors, diodes, combinations...)
- Comparison between thin film/thick film IPD technologies (including
ceramic LTCC)
2. THIN FILM IPD APPLICATIONS AND MARKET DRIVERS
- IPD categories (ESD/EMI protection IPD, high brightness LED silicon
submount, RF IPD, Digital & Mixed Signal IPD)
- IPD current and future applications
- IPD benefits and market drivers description for each IPD category and
application
3. THIN FILM IPD MARKET STATUS AND 2008-2015 FORECASTS
- IPD market forecasts are provided both in M$, Munits and in wafer eg. with
attached growth rates
- Volume shipments for IPD per applications (cell-phone, mp3 players,
medical, sutomotive...)
- IPD shipments per category (ESD/EMI protection, LED silicon submount, RF
IPDs, Digital & Mixed signal IPDs)
- Specific applicative breakdown and forecasted evolution for each category
- IPD shipments per substrate type (Silicon, Glass, GaAs, SOI...) and
wafer size (4"/6"/8"/12")
- IPD shipments per packaging platform (WLP, Wire bond, Flip-chip,
Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate...)
- IPD player market shares and revenues
- "Top 15" IPD players 2008 revenues
- Overall players market shares based on 2008 IPD revenues
- Specific market share breakdown for ESD/EMI protection IPD applications
- Specific market share breakdown for RF IPD applications
4. THIN FILM IPD TECHNOLOGIES
- IPD components requirements and technology options
- Performance and integration capabilities
- Inductors (multilayer planar inductors, 3D inductors...)
- Capacitors (planar versus trench geometries, SiO2 versus SiN versus
BST versus PXZT capacitors...)
- Others structures (resistors, diodes...)
- IPD Manufacturing challenges and related equipment & material tool-box
- Substrate choice technology comparisons: high resistivity Silicon /
Glass / SOI / GaAs / Plastic laminate
- Dielectric layers options (low k / high k)
- Available photoresists, oxide and other layer solutions, impact of
layer thickness
- Metallic layers formation (A, Copper, Gold...)
- Process options (line width, multiple layer IPDs, lithographic versus
non lithographic patterning, advanced depositions...)
- IPD Design, Simulation and predictability through system level co-design
5. THIN FILM IPD ARCHITECTURES, ASSEMBLY & PACKAGING
- Integration, packaging and assembly platforms options for IPDs
- through silicon Via manufacturing: a necessary step to reach the 3rd
dimension
- Fan-Out Wafer level packaging and embedded die concepts
- Overall IPD Technology roadmap
6. THIN FILM IPD SUPPLY CHAIN & PLAYERS
- Geographical mapping of different players
- Business models analysis for IPD (specialty foundries, Integrated Device
Manufactures, Turnkey packaging providers, module makers, fabless & end
integrators)
- Summary of IPD players capabilities (manufacturing, design/ library,
packaging & assembly...)
- Present and future challenges ahead for successful commercialization of
IPDs
7. CONCLUSIONS & PERSPECTIVES
|
 |
