記憶體的用途、封裝、集積化趨勢：2009年

記憶體的用途、封裝、集積化趨勢：2009年 是由出版商Yole Developpement在2009年05月所出版的。 這份英文市場調查報告書包含283 slides 價格從美金5290起跳。

簡介

目錄

Abstract

How 3-D integration will challenge and reshape the memory industry?

The memory semiconductor industry is about to go through a period of major technological changes as new integration trends and disruptive packaging technologies pave the way to the future growth of this industry

Historically, the DRAM memory market has been mostly driven by computing applications while NOR Flash has been mainly deployed into consumer and communication devices. More recently, NAND Flash memory has emerged as the most promising solid state storage solution for current consumer devices and is showing as the best candidate for hard disk drive replacement in the near future.

INTEGRATION IS THE NEXT CHALLENGE

On the other hand, today wireless is growing and enabling new market segments everywhere, (smart-phones, mobile pocket computing devices ). As a result, CONNECTIVIY and INTEGRATION are now new drivers to deal with. Demand for data is increasing everywhere: Faster pipes, more pipes (WAN, LAN, PAN), HD multimedia Current complexity and concurrency require more than ever higher data capacity, improved power consumption and is stressing existing well established architectures: new interconnects, integration schemes and packaging technologies are needed to support higher performance, breakthrough density and low power consumption devices. 3-D IC integration is showing as a major solution path to tackle these challenges and memories will be key components in achieving this successful integration.

3-D INTEGRATION WILL OPEN A NEW APPLICATION SPACE FOR MEMORY MARKET

Yole Developpement has followed the burgeoning 3-D Packaging industry since its early beginning The global economic downturn is challenging the fast adoption of the "Through Silicon Vias" technology into high volume applications such as low cost memories. However, we are seeing concrete signs that this market is definitely taking-off, with the first 3-D integrated DRAM memories being shipped this year: we estimate that about 20 000 wafers of DRAM memory will be shipped with 3D TSV by the end of 2009, with production moving forward to higher volumes in 2010. By 2013, we expect that telecom and computing industries will drive more than 70% of the volume for 3-D TSV integrated memories.

3-D integration with memories is a hot topic at the moment because of the challenging market conditions and of the important investment needed for building the required infrastructure. As a result, precompetitive alliances and partnerships may be necessary to drive the risk down while accelerating product adoption. Memory manufacturers, CMOS foundries, OSAT packaging houses, Fab-less IC players and integrated device manufacturers are all concerned and actively preparing for this ultimate integration.

This new study aims at answering the following questions: What are the end applications driving the use of 3-D integrated memories? Who are the key players doing it? How will it happen? When will the market ramp up? What is the impact of the current economic turmoil? How big is this 3-D memory market going to be and at which conditions? How will 3D TSV technologies boost new applications and drive the growth of Flash and DRAM market?

Key features of the report

• Up-to-date Key metrics of the memory market:
• Per application (more than 30 products screened)
• Per type of memory (DRAM / SRAM / NOR / NAND Flash)
• In Munits shipment and in 300mm wafer equivalent
• Impact of 3-D integration on the memory market and applications
• Key players strategy for 3DIC integration with memories
• Cost analysis & challenges for TSV manufacturing:
• How to make TSV interconnects happen in high volume / low cost memory markets?

Companies cited in the report:

• AMD, Amkor
• Chartered Semiconductor
• Dai Nippon Printing
• Dongbu HiTek
• Ibiden
• IBM
• IMFlash
• Intel
• Elpida
• Excico
• Freescale
• Fujitsu
• Hynix
• Micron
• Nanya
• NEC
• Numonyx
• Qualcomm
• Renesas
• TSMC
• Texas Instruments
• Samsung
• SanDisk
• Seagate
• Shinko
• SOITEC / Tracit
• Sony
• StatsChipPac
• STMicroelectronics
• Spansion
• SPIL
• Swissbit
• Tezzaron
• Toshiba
• UMC
• Xilinx
• Ziptronix
• and more

Table of Contents

Introduction to memory technologies 1

• DRAM / SRAM / NOR Flash / NAND Flash
  • 2008 overall memory shipment market (in Units)
  • 2008 overall memory market revenues (in $B)
• Trends for next generation Non-Volatile memory technologies:
  • M-RAM / PC-RAM: status of industrialization and near-term opportunities

Memory Applications & Markets .. 18

• Current & future applications driving DRAM / SRAM / NAND / NOR Flash memory demand
  • Per industry:
    • 2008 Market forecasts in Munits shipment and in 300mm wafers equivalent
    • Breakdown for Telecom / Computing / Consumer / Servers / Automotive / Industrial & Medical markets
  • Per product / application:
    • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
    • Breakdown for Desktop PCs / Notebooks / Net books / MID / Regular & Blade Servers / Data storage servers / Portable media players / Portable game stations / Memory Cards / USB Stick / Cell-phones / Game stations / Set-Top Box / HD camcorders / DSC / SLR / Automotive / Base stations / Portable navigation Sys  GPS / Digital TV / Workstations / Memory Upgrades / HDD / Printer / Analog TV / DVD Player / HPC / ATE systems

Memory Packaging & Integration Trends 33

• Architectures and memory die quantity analysis in current product generation:
  • Focus on Cell-phones, SSDs, DSCs, servers, Portable media players and game stations
• Single Die versus Stacked packaging:
  • 2008-2015 Key market metrics and trends for memory - integration using TSO P / FBGA / PoP / PiP / WLP Fan-in / Fan-out WLP packages / Silicon interposers

Impact of 3-D integrations on the memory market 55

• Applications and market drivers for 3D integration with memories
• �gEmbedded 3D-SOC memories�h Versus �g3-D Stacked memories in SiP�h:
• Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
  • "3D Chip Stacking" Vs. "Circuit Transfer 3D" Vs. "Monolithic 3D" integration
  • Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
• Impact of MLC versus SLC Flash memory architecture on adoption of 3-D TSV memories
  • Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
• Silicon interposers for 3D TSV memories:
  • Definitions, players and roadmaps
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
• TSV manufacturing cost challenge:
  • What is the process and cost of TSV in memories today?
  • What is the targeted cost for a broad adoption of 3-D TSV into low cost memory markets?
• Overall Roadmap for 3-D integration with Memories (2008  2015)
• Impact of 3-D integration on DRAM / SRAM / NAND / NOR Flash memory markets
  • 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
  • Breakdown per mount technology: forecast for Single die / Wire Bond stacked / 3-D TSV memory
  • Breakdown per application:

• Opportunities of 3-D integrated memory in DDR3 / DDR4 / Wireless Application processors / Wireless Baseband - DSP / SSDs / Graphic memory / Micro-Cards / Embedded & Cache CPU-GPU / FPGAs

Player' s strategy for 3-D integration with memories �c 85

• Supply chain analysis: Memory fabs / CMOS foundries / / OSAT packaging houses / IDMs / Fab-less / Integrator player activities
• Infrastructure & pre-competitive alliances in 3-D IC system integration

Perspectives & Conclusions 98

Annexes 104

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