本報告已在2011年05月12日停止出版。
更改為出版
TSV CoSim+
出版日期 : 2009年10月
商品編碼: 103347
本資料庫是介紹在一定的TSV製程下分析製造成本的成本模式工具，內容包括有益於TSV選擇的經濟可行性分析的各種資料。內容綱要摘記如下：
資料庫内容
- 製程圖：利用機器類型・步驟數
- 晶圓廠資料
- 每台機器的資料
- 每個晶圓的製程時間
- 每個晶圓的作業時間
- 機器價格
- 消費量（電力等）
- 每個晶圓的消費財（研磨液等）
- 3D堆疊的TSV成本結構詳細内容、等
Abstract
How can Yole' s "TSV+ Cost Analysis Tool" help you?
Stacking chips in 3D with TSV (Through Silicon Vias) is a new breakthrough
packaging technology platform for 3D integration of ICs, logic, RF-SiP, CMOS
image sensors and MEMS. However, cost of the technology is still a major
hurdle today as TSVs are competing against low cost interconnect technologies
such as wire bond interconnects among others. The added dilemma is the wide
range of technological TSV scenarios available making the choice of the most
cost effective TSV technology quite complex.
Any company choosing to implement a TSV process will face with many decisions such as:
- Vias dimensions (diameter, depth, tapered via or not),
- Vias drilling processes (Wet, DRIE or laser),
- Vias filling (Copper, Tungsten, PolySi, Paste printing …),
- Bonding / stacking process (Metal thermo-compression,direct oxide
fusion,hybrid adhesive...),
- Choice for a temporary bonding step or not
Being in strong interactions with 3D IC equipments, materials and chip makers,
we have carefully developed among time an intuitive Cost of Ownership (CoO)
tool model specifically designed to evaluate the cost of a given TSV process
flow. It has been developed using ExcelTM in order to be widely exploitable
and upgraded. This Yole' s CoO tool will enable you the possibility to evaluate
what is the cost per wafer level for manufacturing your TSVs using your own
inputs or using pre-defined parameters.
This tool is ideal for purchasers, strategic marketing executives, process
managers and R&D engineers analyzing the economical feasibility of different
TSV options.
Yole' s CoO tool can be used two different ways:
If you are not yet familiar with the different TSV option choices available,
you will have the possibility to use a beginner mode. Some parameters have
been pre-defined but you will still be able to choose the following:
- Vias' characteristics (diameter, depth, angle, density)
- Choice between DRIE or laser
- Different via filling materials (Cu, Tungsten, PolySi, paste...)
- Type of bonding (Cu-Cu, BCB, direct oxide)
- W2W or C2W stacking
If you are already familiar with TSV technology and want to know the cost of
ownership for your own process, you will be able to access the expert mode.
This will allow you to define your own TSV process scenario with related
materials & equipments libraires as well as generic fab parameters. For
example, you will be able to define for each equipment its:
- Throughput
- Operator and Engineering time
- Equipment footprint
- Associated consumables (gases, slurries, glass wafer, advanced resists...)
- Tool price and amortization time period
The tool will allow you to define and tune your own fab parameters:
- number of wafers / year processed,
- global process yield,
- # working days / year,
- operator cost / year,
- engineer cost / year,
- clean Room (CR) class,
- CR maintenance cost ($/m²/year),
- CR electricity consumption ($/m²/year),
- CR amortization period (year),
- equipment amortization period (year),
Additionally, you will be able to consider the level of automation of your
fab, and its geographical location (will TSV fab located in North America,
China, Japan, Europe, Taiwan...).
… and then, access directly to the TSV cost breakdown showing where
the cost "pain points" are!
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