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市場調查報告書
歐洲IC製造及其他相關設施的趨勢
IC EUROPE: European Database of Integrated Circuit, Packaging, MEMS, R&D & Power Devices Players and Market Study
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本報告已在2011年05月12日停止出版。
專門於半導體、高科技產業市場策略、技術策略相關顧問服務的法國市調公司 Yole Developpement（總公司：里昂市），針對歐洲IC製造及其他相關設施的趨勢進行調查分析，並出版系統整理的報告書 "IC EUROPE: European Database of Integrated Circuit, Packaging, MEMS, R&D & Power Devices Players and Market Study" 。
本報告書內容包括：歐洲48國的IC・MEMS・封裝・晶圓設備・化合物半導體設備相關生產設備及R&D施設的調查分析結果、生產據點、生產產品、技術、設備、財務狀況等。內容綱要摘記如下：
實施概要
電子產業：全球及歐洲市場・技術
- 半導體設備
- 晶圓設備
- MEMS/MST
- 墨水噴頭
- 各種感應器
- 光學MEMS
- RF MEMS
- 其他
- 化合物半導體設備
- 封裝
- R&D研究機構
歐洲的生產設施
- 生產據點
- 技術
- 製品
- 晶圓尺寸
- 製造容量計畫・未來需求/投資
總論
Abstract
Europe accounts for more than 280 production and research fabs active in one
or more of the investigated technology fields.
In this report details are given about the specific facilities:
- ICs
- MEMS
- Packaging
- Power Devices
- R&D institutes
- Compound Semiconductors
Product objectives
The objectives of “IC Europe” are:
- To understand, based on facts, the complex and diverse collection of
semiconductor equipment and material suppliers' customers.
- To create a tool for the equipment and material suppliers and others to
assess business opportunities in the European market
- To enable suppliers of semiconductor industry to detect new opportunities
in the European Semiconductor market.
Product overview
This comprehensive report details fab locations, contacts, products,
technologies, manufacturing facilities, and financial information. The covered
geographical area includes 48 countries such as the European Union, Eastern
European countries, Turkey, Morocco, Israel, and Russia.
Key Product Features
The database includes:
- ICs (Memory, Logic, Analog and mixed signal, ASICs, Other IC devices)
- MEMS (Ink jet head; Sensors: pressure, inertial, IR Image, specific
chemicals & gasses; optical MEMS; RF MEMS; other MEMS devices)
- Compound Semiconductors (GaAs, SiC, GaN, InP based devices)
- Power devices
- Packaging (Discrete packaging, Zero and first-level packaging, Wafer Level
Packaging, other packaging techniques such as 3D)
- Major R&D labs
The report includes:
- Executive summary
- Statistical analysis of the breakdown of corporate and manufacturing sites
by size, geography, technology, and products
- Trends analysis for products and manufacturing
- Summary of key points that includes key concerns and initiatives related
to the development, purchase and use of equipment and materials.
The accompanying database includes detail for the manufacturing sites*:
- Name of the company, including Website
- Size (number of employees, sales figures for 2005)
- General activities (applications, devices and markets)
- Addresses of the different manufacturing sites in Europe
- Per manufacturing site:
- Technology(s) implemented
- Capacity (wafer starts per week)
- Capacity forecast
- Size and type of the clean room
- Full coordinates of contact point (name, title, email and/or telephone,
location)
Why buy this report
- By acquiring this new report and database, you will have an access to a
fully detailed list of European fabs of Integrated Circuit, Packaging, MEMS
Power Devices, and R&D centres.
- The Database is a really helpful tool to classify, extract and choose
company name and related information.
- The accompanying report will help you to get a better understanding of the
European fab market and trends: global sales, products and technology
breakdown, future fab opening, 300 mm based wafer fab.
Who should buy this report
- The report & database is of great interest for equipment and material
suppliers in order to prepare marketing approach, to forecast opening and
expansion fab and to contact the right person within an organisation.
- Report and database are also useful for devices manufacturer to look at
production and foundry partners or packaging services companies.
Companies described in the database
3DPlus, ABB Semiconductor, ACREO, AEMtec, Alcatel Alenia Space Italia, AMD,
Analog Devices Inc, Atmel, AMS, Boehringer Ingelheim, Bookham Technology Ltd.,
Colibrys, COM, CSEM, Cube Optics, DALSA Nederland B.V., Dynex Semiconductor,
ELMO Semi-conductors, Fraunhofer, Freescale Semiconductor Inc., GE
Infrasctructure Sensing, Hymite, IMEC, Infineon Technologies AG, LETI,
Microtech, NEC Semiconductors, Olivetti I Jet, Osram Opto Semiconductors
GmbH&Co, Philips Semiconductors, Qinetiq, Robert Bosch, Sensitec, Sensonor,
Silex Microsystems, STMicroelectronics...
Table of Contents
- Executive summary
- General trends for the micro-electronics industry: market and
technologies worldwide and in Europe
- Semiconductor devices
- Power devices
- MEMS/MST
- Compound semiconductor devices
- Packaging
- R&D
- Statistical analysis for European fabs
- Manufacturing locations
- Technologies
- Products
- Wafer size
- Capacity planning and future needs/investments
- Conclusions
Executive summary
Analysis of European fabshas shown that:
- There are 281 production fabsin Europe for ICs, MEMS, power devices,
compound semiconductors and packaging. 34 have 2 or more activities (ICs and
MEMS, ICs and power devices ...)
- For ICs:
- Europe accounts for 12% of worldwide 8' ' eq. wspw
- STM and Infineon are among the TOP 10 worldwide SC companies sales
- Germany, France and UK have more than 50% of the total number ofIC
fabsin Europe
- For power devices:
- Europe accounts for less than 30% of the world production
- The fabsare evenly distributed through Europe. UK has the highest number
of fabs(6 out of 31 fabsin total)
- STM ranks as the 5th worldwide player in power device sales
- For MEMS:
- Europe accounts for 16% of worldwide sales
- Germany has the highest number of MEMS fabs(25 out of 67 fabsin total)
- STM and Bosch are respectively 3rd and 4th MEMS players in revenue
- For packaging:
- There are 50 fabsin Europe
- There is no large OSAT player in Europe (most of them are in Asia)
- For compound semiconductors:
- For compound semiconductors, the activity is mainly localized inWestern
Europe and Israel (29 fabsin total).
- There are two large players involved in LEDs: Osramand
Philips/Lumileds(but no facility in Europe for the latter)
- For R&D:
- There are 27 large R&D public institutes
- Europe has three world-class semiconductor R&D centresof semiconductor
excellence: IMEC, Letiand Fraunhofer
- In 2005, R&D spending by European IC companies stands at:
- STM: $6.4B (17% of sales)
- Infineon: $6.3B (19% of sales)
- There are seven 12”wafer fabsin Europe and 11 sub-90 nm
fabs(including one 45 nm Intel fabin Leixlip, Ireland)
- For ICs, most of the production is done on 8”wafers:
- MPUs, DRAMsand Flash are processed on 8”and 12”wafers→
60% of MPUs, DRAMsand Flash are processed on 8”
- For MEMS and Power Devices, most of the production is done on
4”and 6”wafers (no 8”wafer line in production today for
MEMS in Europe)
- ICs represent 74% of total wspm(231 Fabsrepresent a total of 2.04 million
of wspm).
- European fabsrepresent a total area of 682,442 m2(corrected data, taking
into account combined activities).
- IC represent almost 75% of the total clean room surface
- Europe employs about 65,000 people related to fabmanufacturing activity.
- IC manufacturing is the major employer with about 51% of total European
fabemployment.
- CMOS, biCMOSand bipolar are the most used technologies.
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