Abstract
DESCRIPTION
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Evolutions of front-end, assembly & test based on the teardown of 23 MEMS (accelerometers, gyroscopes, magnetometers & combos)
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MAJOR MARKET DRIVERS & TECHNICAL ANSWERS IN INERTIAL MEMS & MAGNETOMETERS
Accelerometer MEMS size evolution
MEMS accelerometer die size evolution
Over the last 3 years, inertial MEMS & magnetometers have been subject to
dramatic market & technological evolutions. This has been driven by a large
increase of the consumer market: mobile phones and tablets for accelerometers;
gaming for gyros; mobile phones for magnetometers.
Along with “stand-alone” MEMS devices, inertial combo sensors, a
combination of several inertial sensors into a single package, are also
coming. Main applications are consumer (e.g. accelerometer with magnetometeror
accelerometer with gyro) and automotive for ESC and rollover functions first.
Inertial MEMS & magnetometers are today driven by 4 major market trends:
- 1. Future generation of sensors will deliver functions and will
become “solutions”
- 2. Fusion of sensors (combining data from different sensors) is
starting to be widely used
- 3. New architectures are developed
- 4. Price pressure is still very strong (5% drop per quarter for
consumer applications).
On the technical side, form factor is ever decreasing with reduced footprint
and thickness. And power consumption has been reduced to a few microA while
performances are still increasing.
The most successful type for inertial MEMS is based on capacitive
transduction. Reasons are simplicity of the sensor element, no requirement for
exotic materials, low power consumption and good stability over temperature.
But will comb-drive architecture for accelerometers continue to be the main
detection principle as MEMS die size keeps shrinking?
Regarding gyroscopes, most are falling into the categories of tuning vibrating
fork/plate (STM, Bosch) or vibrating shells (Silicon Sensing Systems). This
very common design gives ease of fabrication and possible integration in
standard IC manufacturing industry.
For magnetometers, Hall Effect has been the dominant technology for a long
time, but today it is changing as Magneto Impedance, Giant Magneto Resistance
and Anisotropic Magneto Resistance are used. A new approach, Lorentz effect
based on MEMS technology, is currently in R&D (VTT and others). This could
bring easier integration in MEMS combo sensors.
MEMS TESTING WILL HAVE TO EVOLVE
Testing has been also subject to strong evolution over the last years. For
example, combo sensors will require new test solutions compared to
“stand-alone” sensors. Beyond the usual wafer-level electrical
test and package-level electrical and mechanical or functional testing, these
sensor combos will need module level testing and calibration of the combined
sensors. If they include an MCU in the package, the communication between the
sensors and the MCU will also need to be tested. Solutions need to be cost
effective with high throughput to test multiple axes of multiple devices,
either in parallel or in separate modules, rather like separate chambers in IC
equipment.
Standardization in testing! Inertial MEMS testing matures to limit the increase in cost
The world of MEMS testing has moved in the last several years from internal
development at MEMS makers to co-development with test suppliers to commercial
off-the-shelf equipment. So combo solutions that can test all axes of the
module in a single tool for higher throughput will also likely be co-developed
with the test equipment suppliers and available commercially. Assembly and
test houses may also start to offer these test services on an outsource basis
for fabless or fab-light MEMS makers. The Yole report will analyze the latest
trends in MEMS testing.
A COMPARATIVE ANALYSIS OF 23 MEMS DEVICES FROM 13 DIFFERENT MANUFACTURERS!
In order to understand the key evolutionary changes, a total of 23 different
MEMS devices (9 accelerometers, 10 gyros, 3 combos and 1 magnetometer) -
mostly consumer MEMS - have been disassembled, analyzed and cost simulations
have been constructed for MEMS, ASIC and Packaging/Test. One of the key
features of the reports is that ASICs have been analyzed as well. The MEMS
have been analyzed and production costs have been simulated by System Plus
Consulting, the reverse costing specialist company.
The teardown analysis results have been compared in terms of performance,
total cost, MEMS size, ASIC lithography node, ASIC size, package size, year
for market introduction.
From our analysis, we found there is a clear MEMS die size decrease over
2007-2011. For example, in 2008, the average size for an accelerometer
(3-axis) was 4-5 mm2. 3 years later, size is about 2 mm2. ASIC size has been
following the same trend with a lithography node in the range 0.18-0.35μ
today. With latest ST announcement about the use of through silicon vias for
inertial, we can expect even lower cost and size in the future.
The same analysis has been performed for gyros comps, combos and magnetometers.
KEYS FEATURES OF THE REPORT
The objectives of the reports are the following:
- Provide an understanding of the market drivers for inertial MEMS
- Consumer
- Automotive
- High-end
- Give trends about packaging and tests strategies
- Provide in-depth analysis for 23 MEMS devices in terms of:
- Production cost breakdown for MEMS, ASIC, Packaging & Test
- ASIC litho nodes
- Die & package size
- Package type
- Comparative analysis in terms of performance, production cost for MEMS,
ASIC, sizes, year for market introduction.
- For each device, photos are depicting:
- MEMS close-up structure
- MEMS dimensions
- ASIC dimensions
- Package view
- Specific process steps
- Cost breakdown
BENEFITS
WHO SHOULD BUY THE REPORTS
- MEMS manufacturers
- Identify the key trends into inertial MEMS manufacturing
- Monitor and benchmark your competitor's products
- MEMS integrators
- Identify and evaluate different MEMS devices
- Equipment manufacturers
- Identify the latest trends into manufacturing, packaging and testing
COMPANIES CITED IN THE REPORT
Acutronic, Advanced Microsensors, Advantest, Afore, Aichi, AIS/SSS, AKM,
Analog Devices, ASE, Baolab, Bosch Sensortec, CascadeMicrotech, CEA Leti,
Colibrys, Epson Toyocom, Freescale, Gladiator Technologies, Honeywell,
Invensense, Jyve, Kionix, KYEC, Litef, Memsic, Multitest, Murata, Panasonic,
Polytec, Qualtre, Rohm, Sensonor, Sensordynamics, Sony, SPEA, SSS, STM,
Systron Donner, TEL, Teradyne, Thales, Tronics, VTI, VTT, Yamaha...
BIO
Dr. Eric Mounier has a PhD in microelectronics from the INPG in
Grenoble. He previously worked at CEA LETI R&D lab in Grenoble, France in
Marketing dept.
Laurent Robin is in charge of the MEMS & Sensors market research at
Yole Développement. He previously worked at image sensor company e2v
Technologies (Grenoble, France) and at EM Microelectronics (Switzerland).
ABOUT YOLE DÉVELOPPEMENT
Beginning in 1998 with Yole Développement, we have grown to become a
group of companies providing market research, technology analysis, strategy
consulting, media in addition to fi nance services. With a solid focus on
emerging applications using silicon and/or micro manufacturing Yole
Développement group has expanded to include more than 40 associates
worldwide covering MEMS, Microfluidics & Medical, Advanced Packaging, Compound
Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports
companies, investors and R&D organizations worldwide to help them understand
markets and follow technology trends to develop their business.
Table of Contents
ANALYSIS REPORT
OBJECTIVE OF THE REPORT
TABLE OF CONTENTS
LIST OF COMPANIES MENTIONED IN THE REPORT
EXECUTIVE SUMMARY
INTRODUCTION
THE INERTIAL MEMS MARKETS
- Market forecast in $M, in units, in wafers
- Market drivers
- Technical solutions to answer the market drivers
THE DIFERENT DETECTION PRINCIPALES FOR INERTIAL MEMS
- Manufacturing approaches
- Accelerometers
- Gyroscopes
- Magnetometers Packaging trends
- At the device level
- At the wafer-level
TEST OF INERTIAL MEMS
- Specificities for inertial MEMS testing
- Inertial MEMS - Off-line testing
- Inertial MEMS - Wafer test
- Inertial MEMS - Final test
- Cost of test and trends
- Test supply chain evolution
- Trends in inertial MEMS testing
COMPARATIVE ANALYSIS OF DIFERENT INERTIAL GENERATIONS:
- Production cost breakdown:
- MEMS
- ASIC
- Packaging & Test
- ASIC litho nodes
- Die size
- Package size
- Package type
- Comparative analysis in terms of:
- Performances
- Production cost for MEMS and ASIC
- MEMS size
- ASIC size
- Package size
- Year for market introduction.
CONCLUSIONS
REVERSE COSTING REPORT
For each of the devices below, the following information will be given:
package characteristics, ASIC/MEMS dimensions, cross-section, MEMS process,
cost breakdown.
List of MEMS devices covered into the report:
- 1. ST LIS331DLH
- 2. ST LIS3DH
- 3. Bosch Sensortec BMA180
- 4. Bosch Sensortec BMA250
- 5. Kionix KXTE9
- 6. Freescale MMA8450
- 7. Freescale MMA8451
- 8. Analog Device ADXL278
- 9. Analog Device ADXL346
- 10. Invensense IDG 1004
- 11. Invensense IDG 600/650
- 12. Invensense ITG3200
- 13. ST L3G4200D
- 14. VTI CRM3000
- 15. Sensordynamics SD740
- 16. SSS Pinpoint CRM100
- 17. Epson Toyocom XV-3500CB
- 18. Sony 2-Axis Gyro
- 19. Murata ENC-03RC-10-R A11
- 20. SensorDynamics SD746
- 21. VTI SCC1300
- 22. Invensense MPU6000
- 23. AKM AK8973S
