家電及汽車慣性組合感測器市場 是由出版商Yole Developpement在2011年11月所出版的。
這份英文市場調查報告書價格從美金5390起跳。
在家電及汽車慣性組合感測器快速成長同時,將多數感測器包裝為一之組合感測器受到極大之矚目。低價且高效能之組合感測器預計今後可廣泛用於汽車安全系統及各種家電產品上,若使用多個感測器之傳感器融合新功能可以實現,感測器朝向解決方案發展之可能性也必然增加。但高效能感測器必須要有複雜之軟體及強力之微型控制組,在擁有這些技術之製造商參與下,慣性感測器供應鏈預計將產生極大變化。
本報告為,分析家電及汽車慣性組合感測器之市場機會、挑戰,並匯整顯示市場現況之詳細數據、相關企業競合情形、新的MEMS製造技術、包裝技術等,以下列摘要形式闡述。
簡介、定義及調查方式
實施概要
第1章 2009∼2016年組合感測器之市場概要
第2章 2009∼20016年全球加速度計,陀螺儀,磁感測器市場
第3章 組合感測器之普及情形:2009∼2016年市場預測
第4章 競合情形
- 家電感測器市場中各公司市場佔有率及主要OEM合約
- 汽車用感測器市場中各公司市場佔有率及主要OEM合約
第5章 組合感測器系統整合之挑戰及普及情形
- 家電運動感測器組合系統之挑戰
- 汽車用運動感測器組合系統之挑戰
第6章 運動感測器組合用軟體之挑戰
- 感測器整合
- 感測器至功能:因應不同OS、API、各種功能整合
- 主要運動感測器解決方案之供應商
- 對軟體領域參與較多之主要運動感測器供應商
- 汽車慣性組合感測器數據處理技術之趨勢
第7章 供應鏈及商業模式之進化
- 供應鏈分析:模式不同與策略性合作關係
- 慣性感測器進步及今後預測之競合關係變化
- 慣性組合感測器市場中主要企業之策略分析
- AKM
- Analog Devices
- Bosch
- denso
- Epsontoyocom
- Freescale
- InvenSense
- Kionix
- Memsic
- 村田製作所
- Panasonic
- Qualtre
- SensorDynamics
- Silicon Sensing
- ST Microelectronics
- VTI
結論及展望
Abstract
DESCRIPTION
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Very large market opportunity, supply chain needs to adapt
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The inertial sensor market for consumer and automotive will see healthy 15%
growth this year to surpass $2.6 billion, thanks to the increasing penetration
of more motion sensing into more mobile devices, and more automotive safety
systems in more cars across the globe. Though unit growth will continue at
double digit rates, maturing markets and continued price erosion means sales
revenues from discrete inertial sensors will level off and start to decline
over the next several years.
2009-2016 Consumer and Automotive Inertial Sensor Market
Growth will then come largely from combination sensors, which we project will
jump from very tiny volumes currently to penetrate some 40% of the $2.7
billion consumer inertial market and more than 12% of the $1.1 billion
automotive inertial market by 2016. This report is focused on the analysis of
the opportunities and the challenges for inertial combo sensors in those
high-volume market areas.
One clear motivation for combo sensors is the possibility to reduce both cost
and footprint by combining the two sensors into one package with a single
ASIC. However this cost benefit is not yet obvious with the dynamism of the
evolution of each individual sensor. Such benefit will be very application
dependent. Lower cost units combining multiple MEMS sensors are poised for
healthy growth, starting with ESCs, bringing opportunity for new players and
demands for sensor management solutions. This trend is showing up first in the
more mature automotive MEMS sector, where the price of the sensor unit for the
electronic stability control system (ESC) can now be significantly reduced,
by combining the accelerometer and the gyroscope in one package with one ASIC.
Adoption is a little slower on the consumer side, where the fast changing
technology means discrete device prices are still falling rapidly, so products
from even six months before have less of a cost advantage. But the consumer
market's fast model turnover and short replacement cycles means that once the
economics become compelling and adoption starts in 2012-2013, market
penetration will be faster and deeper than on the automotive side.
EVOLUTION OF THE SUPPLY CHAIN
Evolution of business models
We expect big changes as well in the supply chain, as prices will continue to
drop, and a host of players along the complex new value chain all scramble to
figure out how best to compete and cooperate for the much bigger business of
integrating the silicon sensors into useful functions. Despite the
complexities of designing and fabricating MEMS devices, most of the value in
these functions is not actually in the fabrication of the MEMS die. ASIC,
packaging, test & calibration and software production costs make up a
significant part of the cost, and this will gain importance with the trend for
multi-sensor packages.
COMPLEXITY OF SENSOR FUSION
The second key motivation from combo sensors relies on sensor fusion. New
functionality can now be offered using multiple sensing elements. We see a
strong evolution from sensors to solutions. This is an opportunity for players
in the MEMS industry to compensate for the drastic decrease in price by
selling high value solutions that include more software content. Who will
capture the added value of these smart sensor systems? There is likely room
for multiple alternatives, with the sensor makers supplying the algorithms to
combine and cross-calibrate the sensor data and do some standard applications,
while the software and chipset makers supply the higher level, specialty
functions. Combo sensors require more complex software for the sensor fusion
calculations, and those will likely need to be done on an MCU, not just the
usual ASIC. This is driving changes in the supply chain, as makers of
microcontrollers, software, and subsystems start to take over more of the
sensor management.
Challenges for Combo Sensors
REPORT OUTLINE
- MEMS accelerometers, MEMS gyroscopes, Magnetometers
- Worldwide market metrics:
- 2009 - 2016 market ($M, M units, ASP)
- 2010 market shares, 2011 trends
- 12+ key groups of application for motion sensors are described in
consumer: Mobile phones, Gaming, Personal Media Players, Mobile Internet
Devices (Tablets & E-books), TV remote controls, Cameras, Camcorders, Laptop
- HDD, PC Peripherals , Sport, Handheld GPS, Others (Toys, Model
helicopter...)
- 6+ key groups of application for motion sensors are described in
automotive: ESC, Airbag, Rollover, Navigation, TPMS, Active suspension...
- Market dynamics, Technical trends, Key players, Market forecasts for
each application
- 150+ companies included in the report
- Report is a 290 slides PowerPoint presentation
- Detailed Excel datasheet included
BENEFITS
KEY FEATURE OF THE STUDY
The objectives of this report are the followings:
- To provide a complete overview of the market data for consumer and
automotive motion sensors: key market metrics & dynamics:
- Unit shipments and revenues by type of sensor
- Average selling price analysis and expected evolution
- Market shares with detailed breakdown for each player and major OEM
contracts
- To provide an analysis on the potential for combo sensors for each
category of application:
- Functions that are used, new features and specification requirements
linked to combo sensors
- Which driver for combo sensors, when will it start?
- Penetration of combos and market forecasts for each type of use
- To provide a deep analysis on the challenges and opportunities for
combo sensors in consumer electronics and in automotive:
- Description of the different types of combo sensors
- Motivation for sensor fusion: from a sensor to a solution. Key software
providers
- Different levels of processing and strategies for integration in the
system (MCU...)
- Insight about future technology trends & manufacturing challenges linked
to the emergence of combos: evolution of front-end MEMS manufacturing, new
packaging technologies...
- To provide a clear understanding of motion sensor value chain,
infrastructure & players for consumer and automotive business:
- Exhaustive list of players for each device under consideration, status
of development
- Analysis on the new players and potential new entrants with MEMS
technology
- Analysis on the position and strategy of the main players related to
combo sensors (16 key players: ST, InvenSense, Bosch, VTI...) according to 7
criteria
- Description of the value chain, evolution of the value for each step:
design, front-end, assembly, test, software impact of the technical
evolutions
WHO SHOULD BUY THIS REPORT ?
- MEMS & sensor suppliers
- Evaluate market potential of future technologies and products for new
application markets
- Understand the differentiated value of your products and technologies in
this market
- Build roadmap for combo sensors: which type of combo? When?
- Identify new business opportunities for combo sensor
- Identify potential strategic partners for integration of a new sensing
element or a software part in a combo
- Monitor and benchmark your competitor's advancements
- MEMS & packaging foundries, test houses
- Understand the applications that will drive the volumes in 2016
- Identify new business opportunities and prospects
- Mixed-signal companies & ASIC manufacturers, Software specialists
- Spot new opportunities and define diversification strategies
- Consumer Electronic OEMs, Automotive Tier 1 companies
- Evaluate market potential of future technologies and products for new
application markets
- Evaluate the benefits of using these new technologies in your end
system, design architectures for the next generation of systems
- Screen potential new suppliers able to provide new functionalities, or
cost and size savings
- R&D centers
- Understand how the new front-end and packaging technologies will impact
the future business
- Evaluate market potential of future technologies and products for new
application markets
- Identify the best candidates for technology transfer
- Financial & strategic investors
- Understand the structure and value chain of the consumer and automotive
motion sensing industry
- Estimate the potential of new devices such as 9DOF combo sensors...
- Get the list of the main key players and emerging start-ups of this
industry worldwide
COMPANIES CITED IN THE REPORT:
Acutronic, Advanced Microsensors, Advancedmicrofab, Aichi Steel, AKM, Alps
Electric, Amazon, AMS, Analog Devices, APM, Apple, ASTRI, Atmel, Autoliv,
Baolab, BMW, Bosch, Broadcom, BWI, BYD, Casio Micronics, CEA LETI, Chevrolet,
Chrysler, Continental, CSR, Daesung, Dai Nippon Printing, Daihatsu, Dalsa,
Deep Di Semiconductor, Delphi, Domintech, Eastman Kodak, EM Microelectronics,
Epson Toyocom, Fairchild, Ford, Foxcon, Fraunhofer ISIT, Free / Iliad,
Freescale, Fujitsu, FullPower, Futaba, Garmin, GE, Global Foundries, Google,
Hana Microelectronics , HDK Kokuriku, Hillcrest Labs, Honeywell, HTC, IMU
Solution, InvenSense, ITRI, Jyve, Keynetic, Kionix, Kyocera, Lancia, Lenovo,
LG, Lingsen Precision Industries , Logitech, Mando Corp, Maxim, Mcube,
Mediatek, Memsic, Memsmart, Memstech, Micro Infinity, Microchip, Microsoft,
Mitsubishi, Mobius, Mio, Motorola, Movea, Murata, Navteq, Nike, Nintendo,
Nissan, Nokia, NTT DoCoMo, Nuvoton Technology, Pace, Pacific, Palm, Panasonic,
Parrot, Pixart, PointInside, Prolific Technology, Qualtre, Renault, Ricoh,
RIM, Rohm, Rood Microtec , Samsung, Schraeder, Seagate, Seiko Epson, Seiko
NPC, Senodia, Sensitec, Sensonor, SensorDynamics, SensorPlatforms, Sharp,
SiliconLabs, Sitronix Technology, Skyartec, SMK , Sony, Sony Ericsson, SPIL,
SSS, ST Microelectronics, Sunrex, Systron Donner, Takata, Technitrol, TI, TMT,
TomTom, Toshiba, Toyota, Tronics, Trusted Positioning, TRW, TSMC, Universal
Electronics, Virtus Advanced Sensors, VTI, Wacoh, Western Digital, Wolfson,
Wolkswagen, Xsens, Yamaha, Yishay Sensor, ZillionTV, ZTE...
BIO OF THE AUTHOR
Laurent Robin is in charge of the MEMS & Sensors market research at Yole
Devéloppement. He previously worked at image sensor company e2v Technologies
(Grenoble, France). He holds a Physics Engineering degree from the National
Institute of Applied Sciences in Toulouse, plus a Master Degree in Technology
& Innovation Management from EM Lyon Business School, France.
ABOUT YOLE DEVÉLOPPEMENT
Beginning in 1998 with Yole Devéloppement, we have grown to become a group of
companies providing market research, technology analysis, strategy consulting,
media in addition to fi nance services. With a solid focus on emerging
applications using silicon and/or micro manufacturing Yole Devéloppement group
has expanded to include more than 40 associates worldwide covering MEMS,
Microfluidics & Medical, Advanced Packaging, Compound Semiconductors, Power
Electronics, LE D, and Photovoltaic.
Table of Contents
Introduction, definitions & methodology
Executive summary
- 2009-2016 combo market overview
- 2009-2016 global market for accelerometers, gyroscopes and
magnetometers
- Mobile phone & consumer electronics applications
- Automotive applications
- Penetration of combo sensors: 2009-2016 market forecasts
- Competitive landscape
- Market shares and major OE M contracts in consumer
- Market shares and major OE M contracts in automotive
- System integration challenges and penetration of combo sensors
- System integration challenges for motion sensor combos in consumer
- System integration challenges for motion sensor combos in Auto
- Software challenges for motion sensor combos
- Challenges for sensor fusion
- From a sensor to a function: OS compliance, APIs, functionality
integration
- Key motion sensing solution providers
- Key motion sensor manufacturers with strong software involvment
- Inertial processing trends in automotive
- Evolution of the supply chain and business models
- Supply chain analysis: divergence of models and strategic partnerships
- Evolution of the inertial sensor industry and expected competitive
changes
- Strategic analysis for each key player of the inertial combo market
- AKM, Analog Devices, Bosch, Denso, Epson Toyocom, reescale, InvenSense,
Kionix, Memsic, Murata, anasonic, Qualtre, SensorDynamics, Silicon Sensing, ST
Microelectronics, VTI
Conclusion and perspectives
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