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市場調查報告書

家電及汽車慣性組合感測器市場

Inertial Combo Sensors for Consumer & Automotive

出版商 Yole Developpement
出版日期 2011年11月 商品編碼 219158
內容資訊 英文  
價格
US $ 5390 PDF by E-mail (Single user license)
US $ 7990 PDF by E-mail (Multi User License)


家電及汽車慣性組合感測器市場 是由出版商Yole Developpement在2011年11月所出版的。 這份英文市場調查報告書價格從美金5390起跳。

簡介

在家電及汽車慣性組合感測器快速成長同時,將多數感測器包裝為一之組合感測器受到極大之矚目。低價且高效能之組合感測器預計今後可廣泛用於汽車安全系統及各種家電產品上,若使用多個感測器之傳感器融合新功能可以實現,感測器朝向解決方案發展之可能性也必然增加。但高效能感測器必須要有複雜之軟體及強力之微型控制組,在擁有這些技術之製造商參與下,慣性感測器供應鏈預計將產生極大變化。

本報告為,分析家電及汽車慣性組合感測器之市場機會、挑戰,並匯整顯示市場現況之詳細數據、相關企業競合情形、新的MEMS製造技術、包裝技術等,以下列摘要形式闡述。

簡介、定義及調查方式

實施概要

第1章 2009∼2016年組合感測器之市場概要

第2章 2009∼20016年全球加速度計,陀螺儀,磁感測器市場

  • 行動電話及家電用
  • 汽車用

第3章 組合感測器之普及情形:2009∼2016年市場預測

第4章 競合情形

  • 家電感測器市場中各公司市場佔有率及主要OEM合約
  • 汽車用感測器市場中各公司市場佔有率及主要OEM合約

第5章 組合感測器系統整合之挑戰及普及情形

  • 家電運動感測器組合系統之挑戰
  • 汽車用運動感測器組合系統之挑戰

第6章 運動感測器組合用軟體之挑戰

  • 感測器整合
  • 感測器至功能:因應不同OS、API、各種功能整合
  • 主要運動感測器解決方案之供應商
  • 對軟體領域參與較多之主要運動感測器供應商
  • 汽車慣性組合感測器數據處理技術之趨勢

第7章 供應鏈及商業模式之進化

  • 供應鏈分析:模式不同與策略性合作關係
  • 慣性感測器進步及今後預測之競合關係變化
  • 慣性組合感測器市場中主要企業之策略分析
    • AKM
    • Analog Devices
    • Bosch
    • denso
    • Epsontoyocom
    • Freescale
    • InvenSense
    • Kionix
    • Memsic
    • 村田製作所
    • Panasonic
    • Qualtre
    • SensorDynamics
    • Silicon Sensing
    • ST Microelectronics
    • VTI

結論及展望

目錄

Abstract

DESCRIPTION

Very large market opportunity, supply chain needs to adapt

The inertial sensor market for consumer and automotive will see healthy 15% growth this year to surpass $2.6 billion, thanks to the increasing penetration of more motion sensing into more mobile devices, and more automotive safety systems in more cars across the globe. Though unit growth will continue at double digit rates, maturing markets and continued price erosion means sales revenues from discrete inertial sensors will level off and start to decline over the next several years.

2009-2016 Consumer and Automotive Inertial Sensor Market

Growth will then come largely from combination sensors, which we project will jump from very tiny volumes currently to penetrate some 40% of the $2.7 billion consumer inertial market and more than 12% of the $1.1 billion automotive inertial market by 2016. This report is focused on the analysis of the opportunities and the challenges for inertial combo sensors in those high-volume market areas.

One clear motivation for combo sensors is the possibility to reduce both cost and footprint by combining the two sensors into one package with a single ASIC. However this cost benefit is not yet obvious with the dynamism of the evolution of each individual sensor. Such benefit will be very application dependent. Lower cost units combining multiple MEMS sensors are poised for healthy growth, starting with ESCs, bringing opportunity for new players and demands for sensor management solutions. This trend is showing up first in the more mature automotive MEMS sector, where the price of the sensor unit for the electronic stability control system (ESC) can now be significantly reduced, by combining the accelerometer and the gyroscope in one package with one ASIC. Adoption is a little slower on the consumer side, where the fast changing technology means discrete device prices are still falling rapidly, so products from even six months before have less of a cost advantage. But the consumer market's fast model turnover and short replacement cycles means that once the economics become compelling and adoption starts in 2012-2013, market penetration will be faster and deeper than on the automotive side.

EVOLUTION OF THE SUPPLY CHAIN

Evolution of business models

We expect big changes as well in the supply chain, as prices will continue to drop, and a host of players along the complex new value chain all scramble to figure out how best to compete and cooperate for the much bigger business of integrating the silicon sensors into useful functions. Despite the complexities of designing and fabricating MEMS devices, most of the value in these functions is not actually in the fabrication of the MEMS die. ASIC, packaging, test & calibration and software production costs make up a significant part of the cost, and this will gain importance with the trend for multi-sensor packages.

COMPLEXITY OF SENSOR FUSION

The second key motivation from combo sensors relies on sensor fusion. New functionality can now be offered using multiple sensing elements. We see a strong evolution from sensors to solutions. This is an opportunity for players in the MEMS industry to compensate for the drastic decrease in price by selling high value solutions that include more software content. Who will capture the added value of these smart sensor systems? There is likely room for multiple alternatives, with the sensor makers supplying the algorithms to combine and cross-calibrate the sensor data and do some standard applications, while the software and chipset makers supply the higher level, specialty functions. Combo sensors require more complex software for the sensor fusion calculations, and those will likely need to be done on an MCU, not just the usual ASIC. This is driving changes in the supply chain, as makers of microcontrollers, software, and subsystems start to take over more of the sensor management.

Challenges for Combo Sensors

REPORT OUTLINE

  • MEMS accelerometers, MEMS gyroscopes, Magnetometers
  • Worldwide market metrics:
    • 2009 - 2016 market ($M, M units, ASP)
  • 2010 market shares, 2011 trends
  • 12+ key groups of application for motion sensors are described in consumer: Mobile phones, Gaming, Personal Media Players, Mobile Internet Devices (Tablets & E-books), TV remote controls, Cameras, Camcorders, Laptop - HDD, PC Peripherals , Sport, Handheld GPS, Others (Toys, Model helicopter...)
  • 6+ key groups of application for motion sensors are described in automotive: ESC, Airbag, Rollover, Navigation, TPMS, Active suspension...
  • Market dynamics, Technical trends, Key players, Market forecasts for each application
  • 150+ companies included in the report
  • Report is a 290 slides PowerPoint presentation
  • Detailed Excel datasheet included

BENEFITS

KEY FEATURE OF THE STUDY

The objectives of this report are the followings:

  • To provide a complete overview of the market data for consumer and automotive motion sensors: key market metrics & dynamics:
    • Unit shipments and revenues by type of sensor
    • Average selling price analysis and expected evolution
    • Market shares with detailed breakdown for each player and major OEM contracts
  • To provide an analysis on the potential for combo sensors for each category of application:
    • Functions that are used, new features and specification requirements linked to combo sensors
    • Which driver for combo sensors, when will it start?
    • Penetration of combos and market forecasts for each type of use
  • To provide a deep analysis on the challenges and opportunities for combo sensors in consumer electronics and in automotive:
    • Description of the different types of combo sensors
    • Motivation for sensor fusion: from a sensor to a solution. Key software providers
    • Different levels of processing and strategies for integration in the system (MCU...)
    • Insight about future technology trends & manufacturing challenges linked to the emergence of combos: evolution of front-end MEMS manufacturing, new packaging technologies...
  • To provide a clear understanding of motion sensor value chain, infrastructure & players for consumer and automotive business:
    • Exhaustive list of players for each device under consideration, status of development
    • Analysis on the new players and potential new entrants with MEMS technology
    • Analysis on the position and strategy of the main players related to combo sensors (16 key players: ST, InvenSense, Bosch, VTI...) according to 7 criteria
    • Description of the value chain, evolution of the value for each step: design, front-end, assembly, test, software impact of the technical evolutions

WHO SHOULD BUY THIS REPORT ?

  • MEMS & sensor suppliers
    • Evaluate market potential of future technologies and products for new application markets
    • Understand the differentiated value of your products and technologies in this market
    • Build roadmap for combo sensors: which type of combo? When?
    • Identify new business opportunities for combo sensor
    • Identify potential strategic partners for integration of a new sensing element or a software part in a combo
    • Monitor and benchmark your competitor's advancements
  • MEMS & packaging foundries, test houses
    • Understand the applications that will drive the volumes in 2016
    • Identify new business opportunities and prospects
  • Mixed-signal companies & ASIC manufacturers, Software specialists
    • Spot new opportunities and define diversification strategies
  • Consumer Electronic OEMs, Automotive Tier 1 companies
    • Evaluate market potential of future technologies and products for new application markets
    • Evaluate the benefits of using these new technologies in your end system, design architectures for the next generation of systems
    • Screen potential new suppliers able to provide new functionalities, or cost and size savings
  • R&D centers
    • Understand how the new front-end and packaging technologies will impact the future business
    • Evaluate market potential of future technologies and products for new application markets
    • Identify the best candidates for technology transfer
  • Financial & strategic investors
    • Understand the structure and value chain of the consumer and automotive motion sensing industry
    • Estimate the potential of new devices such as 9DOF combo sensors...
    • Get the list of the main key players and emerging start-ups of this industry worldwide

COMPANIES CITED IN THE REPORT:

Acutronic, Advanced Microsensors, Advancedmicrofab, Aichi Steel, AKM, Alps Electric, Amazon, AMS, Analog Devices, APM, Apple, ASTRI, Atmel, Autoliv, Baolab, BMW, Bosch, Broadcom, BWI, BYD, Casio Micronics, CEA LETI, Chevrolet, Chrysler, Continental, CSR, Daesung, Dai Nippon Printing, Daihatsu, Dalsa, Deep Di Semiconductor, Delphi, Domintech, Eastman Kodak, EM Microelectronics, Epson Toyocom, Fairchild, Ford, Foxcon, Fraunhofer ISIT, Free / Iliad, Freescale, Fujitsu, FullPower, Futaba, Garmin, GE, Global Foundries, Google, Hana Microelectronics , HDK Kokuriku, Hillcrest Labs, Honeywell, HTC, IMU Solution, InvenSense, ITRI, Jyve, Keynetic, Kionix, Kyocera, Lancia, Lenovo, LG, Lingsen Precision Industries , Logitech, Mando Corp, Maxim, Mcube, Mediatek, Memsic, Memsmart, Memstech, Micro Infinity, Microchip, Microsoft, Mitsubishi, Mobius, Mio, Motorola, Movea, Murata, Navteq, Nike, Nintendo, Nissan, Nokia, NTT DoCoMo, Nuvoton Technology, Pace, Pacific, Palm, Panasonic, Parrot, Pixart, PointInside, Prolific Technology, Qualtre, Renault, Ricoh, RIM, Rohm, Rood Microtec , Samsung, Schraeder, Seagate, Seiko Epson, Seiko NPC, Senodia, Sensitec, Sensonor, SensorDynamics, SensorPlatforms, Sharp, SiliconLabs, Sitronix Technology, Skyartec, SMK , Sony, Sony Ericsson, SPIL, SSS, ST Microelectronics, Sunrex, Systron Donner, Takata, Technitrol, TI, TMT, TomTom, Toshiba, Toyota, Tronics, Trusted Positioning, TRW, TSMC, Universal Electronics, Virtus Advanced Sensors, VTI, Wacoh, Western Digital, Wolfson, Wolkswagen, Xsens, Yamaha, Yishay Sensor, ZillionTV, ZTE...

BIO OF THE AUTHOR

Laurent Robin is in charge of the MEMS & Sensors market research at Yole Devéloppement. He previously worked at image sensor company e2v Technologies (Grenoble, France). He holds a Physics Engineering degree from the National Institute of Applied Sciences in Toulouse, plus a Master Degree in Technology & Innovation Management from EM Lyon Business School, France.

ABOUT YOLE DEVÉLOPPEMENT

Beginning in 1998 with Yole Devéloppement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to fi nance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Devéloppement group has expanded to include more than 40 associates worldwide covering MEMS, Microfluidics & Medical, Advanced Packaging, Compound Semiconductors, Power Electronics, LE D, and Photovoltaic.

Table of Contents

Introduction, definitions & methodology

Executive summary

  • 2009-2016 combo market overview
  • 2009-2016 global market for accelerometers, gyroscopes and magnetometers
    • Mobile phone & consumer electronics applications
    • Automotive applications
  • Penetration of combo sensors: 2009-2016 market forecasts
  • Competitive landscape
    • Market shares and major OE M contracts in consumer
    • Market shares and major OE M contracts in automotive
  • System integration challenges and penetration of combo sensors
    • System integration challenges for motion sensor combos in consumer
    • System integration challenges for motion sensor combos in Auto
  • Software challenges for motion sensor combos
    • Challenges for sensor fusion
    • From a sensor to a function: OS compliance, APIs, functionality integration
    • Key motion sensing solution providers
    • Key motion sensor manufacturers with strong software involvment
    • Inertial processing trends in automotive
  • Evolution of the supply chain and business models
    • Supply chain analysis: divergence of models and strategic partnerships
    • Evolution of the inertial sensor industry and expected competitive changes
    • Strategic analysis for each key player of the inertial combo market
  • AKM, Analog Devices, Bosch, Denso, Epson Toyocom, reescale, InvenSense, Kionix, Memsic, Murata, anasonic, Qualtre, SensorDynamics, Silicon Sensing, ST Microelectronics, VTI

Conclusion and perspectives

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