Abstract
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27% of total processed semiconductors are thinned today. In 2016, this ratio will exceed 50%!
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DESCRIPTION:
THIN WAFERS TARGET MANY APPLICATIONS
Thin wafers will be increasingly used in many diverse applications. The Yole
“Thin Wafer Applications” report describes the applications that
require thin and ultra-thin wafers: MEMS, CMOS Image Sensors, 3D Packaging
(incl. Interposers), Memories, RF Devices, Power Devices and LEDs.
While Memories & Logic will account for the largest fraction of thinned
wafers, many other applications are concerned.
Thin Wafers Revenues Breakdown in 2016 - in US$M
Thin wafer applications & market value breakdown by application (2016)
MEMS are always characterized by a wide range of process and technologies.
This is certainly the application where the widest range of wafer thickness
can be found (e.g. the 3-axis gyro from InvenSense is a stack of 3 wafers with
intermediate layer of 33μ thickness). To answer the need for thinner
sensors for cell phone applications, capping, sensitive elements and MEMS ASIC
will get thinner over the next years, specifically for inertial MEMS. For CMOS
Image Sensors (CIS), Backside Illumination (BSI) now enables 100% Fill-factor,
which opens the opportunity for CMOS sensor with higher Sensitivities or
Higher Resolution. But we need to handle VERY thin layer as for a BSI CIS, the
active layer is < 10μ. CIS wafers will also be thinner for packaging
purposes (TSV, WLCSP).
Memories can be stacked in different ways: wire bonding or TSV. 3D stacking is
the next big thing for memory integration with thickness as low as 25μ in
2016. But wire bonding will still be used for a few years and TSV volume will
start to be significant in 2013.
Main Power Devices requiring thin wafers are IGBTs but others power devices
could use thin wafers. For Power Devices, thin wafers allow low Ron, thus
improve current carrying capability and minimize power consumption. For LEDs,
GaAs, sapphire and SiC wafers are thinned as well.
Ratio of thinned wafers vs. total number of shipped wafers
(volume in millions of 300mm eq.)
Market forecast for thinned wafers
MARKET DRIVERS FOR THIN WAFERS
Motivations for thin wafers are: high interconnect density (such as aggressive
TSV pitch & diameters), better power dissipation and higher electrical
performance and reduced package size.
Consumer electronics are driving the need for smaller, higher performing,
lower cost device configurations for use in applications such as memory,
wireless devices... These new options, in turn, are pushing demand for a
reduction in chip thickness from the traditional 500μ thickness to about 40
μm. Thin dies are driving the need for thin and even ultra-thin
semiconductor wafers (below 50μm).
Such dramatic changes will have strong impact on the equipment and materials
side as well as new process and bonding technologies will be required for
handling such fragile wafers. Yole has covered the equipment and processing
aspects in the previous “Thin Wafer Manufacturing” report.
General Wafer Thickness 2010-2016 in μm
Trends by application
Thin wafer roadmap
COMPANIES CITED IN THE REPORT:
3M, Accretech, ADI, AIT, AkM, ALLVIA, ALSI, AMAT, Aptina / Micron, Avago,
Brewer, Canon, Corning, Cree, Dalsa, Denka, Denso, Discera, Disco, Dongbu
HiTek, DoubleCheck Semiconductors, Dynatex, Dupont, Dynatex, Elmos (SMI),
Elpida, Epistar, ERS, ESI, EVG, FhG IZM, Fico, Formosa Epitaxy, Freescale,
Genesis, Furukawa, Hamamatsu, HH NEC / Grace, Hitachi Chemical, Huga, Hynix,
IBM, IMT, Infineon, Intel, Invensense, JCAP, kionix, Laserod, Lextar,
Lighthouse (AU Opto), LG Innotek, Lintec, Loadpoint, Lumileds, Micralyne,
Micron, Mitsui Chemical, Nanya, Nichia, Nitta, Nitto Denko, Osram, Panasonic,
PlanOptik, Powerchip, ProMOS, Renesas, Ricmar, Robert Bosch, Rorze, Samsung,
Schott, Scrypt, Sekusui, Seoul Optodevice, Shinko, Silex, SMIC, Sony,
Spansion, STM, Strasbaugh, Sumitomo Chemical, SUSS MicroTec, Synova, Sysmelec,
Takada, Tekcore, TEL, Texas Instruments, Tezzaron, TMAT, tMt, TOk, Toshiba,
Tower, Toyoda Gosei, Tronic' s, TSMC, Veeco, VTI, X-Fab, Xiamen Sanan
Optoelectronics, Yushin.
BENEFITS:
KEY FEATURES OF THE REPORT
The objectives of the report are the following:
- Provide an understanding of the thin wafer applications:
- Overview of the thin wafer applications: MEMS, CMOS Image Sensors,
Memories, Power Devices, RF Devices, LEDs, Interposers
- Thin wafers roadmaps
- Give market forecasts for thin wafers:
- 2011-2016 Market Forecast in units and US$ for thin wafers
- Detailed forecasts by application, wafer size and thickness
- Analyze the trends for wafer thinning
- Thinning technologies overview
- Players
WHO SHOULD BUY THIS REPORT?
- Foundries & chip manufacturers
- Get an overview of the large panel of accessible applications for thin
wafers
- Identify the key trends into wafer thickness reduction
- Monitor and benchmark your competitor' s advancements
- Thinning tools/services & materials (chemistry, wafers) providers
- Identify and evaluate what the requirements for thinning wafers will be
- Analyze the threads and opportunities
- Evaluate the market value and volume
BIO
Dr. Eric Mouier has a PhD in microelectronics from the INPG in Grenoble. He previously worked at CEA LETI in Grenoble, France in Marketing dept.
Amandine Pizzagalli has recently joined Yole Devéloppement as a technology & marketing analyst in the fields of Advanced Packaging & MEMS manufacturing processes, from both equipment & materials perspectives.
ABOUT YOLE DEVÉLOPPEMENT
Beginning in 1998 with Yole Devéloppement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to fi nance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Devéloppement group has expanded to include more than 40 associates worldwide covering MEMS, Microfluidics & Medical, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
Table of Contents
Objective of the report
Table of contents
List of companies mentioned in the report
Executive summary
2010-2016 Thin wafer market forecasts
- Thinned wafers vs. TOT number of shipped wafers
- Thin wafers shipment in 300 mm eq.
- 2010-2016 thin wafer shipment forecast by application
- 2010-2016 thin wafer shipment forecast by wafer diameter
- 2010-2016 thin wafer shipment forecast by wafer thickness
Thin wafer players
- 2010 main thin wafers
- 2010 geographic breakdown for thin wafer processing in % of number of
processed wafers
- 2010 wafer size breakdown for thin wafer processing in % of number of
processed wafers
- Thin wafer processors
Description oF applications
- MEMS
- CMOS Image Sensors
- Memory & Logic
- Power Devices
- RF Devices (GaAs)
- LEDs
- Advanced Packaging:3D TSV/Interposers
Thin wafer Technologies overview
- Wafer Thinning
- Dry Polishing
- Thin Wafer Handling: the different solutions
- Wafer Dicing
Final conclusions
Appendices
- Yole Devéloppement presentation
