Abstract
Worldwide overview of the activity and installed capacities for packaging at the wafer-scale in 250+ different ‘Mid-end’ factories
DESCRIPTION
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There is an unprecedented growing demand to meet the needs for Wafer Level
Packaging. If flip-chip wafer bumping and WLSCP platforms are well established
today, new technologies are also emerging like TSV for 3D WLP, 2.5D
interposers, 3DIC or FO WLP, requiring new capabilities and additional
capacities for packaging at the wafer-scale.
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Key objectives of the database
This database presents the exhaustive list of players and the different
locations that are involved in Wafer Level Packaging in general. This unique
tool provides a global overview of capabilities (TSV, RDL, wafer bumping,
etc...) and capacities.
- An exclusive tool for equipment & material suppliers to develop worldwide
their business and for Fabless and Fab-light semiconductor players to identify
new sourcing opportunities
- The tool enables you to analyze WLP technologies distribution by players,
technology type, country, business model, investment & growth evaluation
- Already 20+ graphs are included for a better understanding of the global
trends
- Small R&D and prototype lines are also listed
A database dedicated to your needs
Our database references more than 250 fab locations worldwide with technical
information related to Wafer Level Packaging technologies (bumping, RDL,
passivation, TSV) or “mid-end” capabilities
2010 Worldwide wafer bumping* capacity Breakdown by business model
(in 300mm eq wst/y)
*including: stud and plated Au, printed and plated solder, Cu pillar, ball drop, C4/C4NP
The tool provides an exhaustive list of players (IDM, OSAT, packaging house,
bumping house, etc...).
It will enable you to:
- Search by WLP technology capacities and capabilities
- Review the profile and repartition of one given technology among the
different industry players
- Study players manufacturing / outsourcing strategy and supply chain
Identify and source new WLP service suppliers for the wafer -scale packaging
of your products
Companies listed in the database
Our database references over 150 companies (IDMs, OSAT, foundries, MEMS, R&D
Lab, etc...) and their 250 + wafer fab locations worldwide.
Wafer bumping houses:
OSAT:
Wafer packaging houses:
- Xintec
- China WLCSP
- Nemotek
- OptoPac
R&D Lab & prototype lines:
MEMS IDM/foundries:
TSV foundries:
IC manufacturers (IDM):
- Texas Instruments
- STMicroelectronics
- Samsung
CMOS foundries:
BENEFITS
Reason to buy this database?
- Equipment & Material suppliers
- Identify key WLP players and locations worldwide with detailed
quantitative and qualitative information about their installed capacities
for wafer-level-packaging in the Mid-end
- Screen market penetration status of one particular technology (e.g. TSV,
copper pillar bumping, gold bumping, RDL, etc...) worldwide and understand
who are their key users
- IDM, fabless and fab-light players
- Oversee supplier subcontractors capabilities and capacities per WLP
technology.
- Benchmark several different subcontractors
- Identify new sourcing strategies
- Small IDM or niche market IDM
- Identify prototype lines for WLP worldwide
- Identify small fabs capable of handling very specific
wafer-level-packaging schemes (e.g. with exotic materials, 4" small wafer
diameter, etc...)
- OSAT, foundries, packaging and bumping house
- Get an exhaustive list of competitors or potential partners in your field
- Evaluate global WLP capacities by technologies, regions, business models
- Information about key customers' internal installed capacities in the
Mid-end
BIO
Christophe Zinck, PhD joined Yole Devéloppement after several positions in the wafer fab and packaging environment of CE A-Leti, ST and TriQuint Semiconductor, where he has developed WLP & flip-chip technology for S AW duplexers. He is now project manager for Advanced Packaging, WLP & 3D system Integration and RF devices. He authored and co-authored 15+ publications and is currently holding 3 US patents.
ABOUT YOLE DÉVELOPPEMENT
Beginning in 1998 with Yole Devéloppement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Devéloppement group has expanded to include more than 40 associates worldwide covering MEMS and microfluidics, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
Table of Contents
This database lists the following information:
- General information:
- Fab location
- Fab function (Front-end, Back-end, etc...)
- Main customer, JV, partnership
- Technology platforms available by location:
- WLCSP
- FO-WLP
- Flip-chip wafer bumping (Au, solder, Cu, etc...)
- 3D-WLCSP
- 3DIC
- Interposers
- Wafer Level Optic
- Details about technology:
- TSV
- RDL and passivation
- Bumping technologies (plating, printing, ...)
- Stacking technologies (W2W, C2W)
- Capacities information (in 300mm eq wf/year):
- Wafer diameter (4"/6"/8"/12"/panel)
- Wafer type (Si, GaAs, etc...)
- Capacities by platforms
- Capacities by bumping technologies
- Others capabilities: thin wafer handling, wafer bonding, ...
- Business model & region:
- Breakdown by business models
- Breakdown by regions
