Abstract
DESCRIPTION:
“Packaging typically accounts for 20% to 60% of the packaged LED total
cost and therefore represents the single largest opportunity for cost
reduction.”
MORE THAN $2B WILL BE INVESTED OVER THE 2011-2016 PERIOD IN NEW EQUIPMENT
FOR LED PACKAGING (LLO, PERMANENT BONDING, SINGULATION AND TESTING)
LED packagers are still using mostly retrofitted equipment from the IC
industry and relying on existing technology solutions and materials to improve
LED cost of ownership and performance. While this has allowed LED
manufacturers to benefit from decades of research and development and
investments in the IC industry, it also constrains the industry into the space
defined by existing technology platforms that are not optimized for the
specific needs of LEDs. But the industry has now gained enough momentum and
reached a critical mass to entice equipment and material providers into
developing dedicated solutions for LED manufacturing. Many dedicated solutions
are emerging from existing and new players that will allow significant
reduction in LED manufacturing cost through improved yields, throughputs and
material efficiency.
LED Packaging Equipment Market Revenues
LED packaging equipment market forecast to 2016.
Including substrate separation (LLO), permanent bonders, die separation
(diamond scriber, laser scriber, blade dicer, laser dicer), in-line tester (Wafer,
die and package inspection, probers, sorters, tapers...), die-bonder...etc...
LED PACKAGING EQUIPMENT OVER-INVESTMENT IN THE LAST 2 YEARS LEADING TO A
SHORT DOWN-CYCLE STARTING IN 2012
No LED manufacturers want to get caught short of capacity when the general
lighting market scheduled to reach $20B by 2020 takes off. Thus, an
unprecedented investment cycle started toward the end of 2009 and will extend
through early 2012. This cycle initiated in Korea is now essentially fueled by
subsidies and other incentives in China, as the country is aggressively trying
to position itself as a future leader in solid state lighting. New entrants
are investing massive amounts of money in order to displace existing
manufacturers. This will lead to a world averaged overcapacity that will
briefly exceed 50% for some tools (ie: capacity utilization rate of <50%)
by mid-2012.
This in turn will cause a 12-18 month down cycle corresponding to the
absorption of this overcapacity as well as some consolidations that will bring
the industry back to more usual utilization rates of 80%. This down cycle will
extend through mid-2013. Then we expect a new investment cycle to kick in to
respond to further increasing demand for general lighting. This might lead to
another shorter excess investment to be absorbed in 2016.
MATERIAL AND COMPONENT SUPPLIERS WILL ENJOY A SMOOTHER RIDE WITH REGULAR
GROWTH AT A CAGR OF 27.6% BETWEEN 2011 AND 2016
Package substrate makers will see the fastest growth with a CAGR of 45%
through the period. Phosphors will experience strong price pressure but still
enjoy double digit growth with a CAGR of 12%. There' s still a lot of room for
innovation that could allow capturing more added value. For such products
however, it remains paramount that the solution offers an overall reduction in
cost of ownership ($/lumen) to LED manufacturers.
LED Packaging - Material Market Revenues
LED packaging material and consumable
market forecast to 2016. Including package
substrate (Ceramic, lead-frame, silicon,
metal...), phosphor powder, encapsulation
and primary optics, ESD chip.
This report reviews the major challenges associated with the key LED packaging
process steps. It focuses especially on the most recent technologies and
market trends for high power LED and packages and arrays and provides
quantification for various materials and equipment associated with each of
those key steps. Trends are analyzed in detail including emerging technologies
like Silicon substrates, Wafer level packaging, COB etc...
Overview of main LED packaging steps covered in the report
COMPANY INDEX
3M, A-Bright, ACC Silicon, Accretech, ADT Dicing, Advanced Photoelectronic,
ALSI, AM Technology, Amceram, American bright, American Opto Plus, AOT ,
Apeax, APT, Asahi Glass, AS M Pacific, Assymtec, Autec, Avago, Axxon, Bayer,
Bergquist, Brightled, Brightview, BYD, Cascade Microtech, Century epitech,
Ceramtec, Ceratech, CETC, Chroma, Citizen, CMO, Cofan PC B, Cree, CS Bright,
Curamik, Daitron, Datacon, Delphi Laser, Denka, Dian, Disco, Dominant
semiconductor, Doosan, Dow Chemical, Dow Corning, Dowa, Dupont, Dynatex,
Edison Opto, Enfis, Epistar, Epitex, Epoxy Technology, EPW orks, ESEC, ESI ,
Essemtec, Everlight, EV -Group, Evident Technologies, Excellence, Fangda,
Fittech, Formosa Epitaxy, Friatec, GE, Gia Tzoong, Golden Valley, Han' s
Laser, Harvatek, Hauman, Heesung, Heptagon, Hilight, Holy Stone, Huixin,
HuiYuan, Hybond, Hysol (Henkel), Illumitex, Indium Corporation, Intematix,
Ipidia, Ismeca, ITRI, Itswell, Iwashita Engineering, JPSA, JT Corp, KCC ,
Kingbright, KLA Tenkor, Kodenshi, Kulicke & Soffa, Kwality Group, Kyocera,
Laurier, Leatec Fine Ceramics, Ledengin, Ledtech, Lextar, LG Innotek,
Lighting, Lightscape Materials, Ligitek, Lite-on, Loomis, Lord, Lumens, Lumex,
Lumileds, LumiMicro, Luminus Device, Lumitek, Lustrous, Luxpia, LW B, Master
Bond, MDI, Microfab Technology, Micron, Mitsubishi Chemical, Mok san
electronics, Momentive, MPI, Murata, Nanoco, Nanometric, Nanosys, Natel,
Nationstar, Neo-Neon, Neopac, Nexxus Lighting, Nichia, Nihon Garter, NI MS,
Ninex, NN Crystal, Nordson Asymtek, Nusil, NXP, Oasis, Omnivision, On chip,
On Semiconductor, Optek, Optest, Opto Systems, Optotech, Osram, Palomar
Technologies, Panasonic, Perkin Elmer, Phosphortech, Planoptik, Powerlightec,
QD Vision, QMC, Quatek, Remtec, Renaissance Lighting, Renesas, Rohm, Rudolph
Technology, Rudolph Technology, Saint-Gobain, Samsung LED, Sanken, Sanyu,
Seiwa, Semileds, Sentec, Seoul Semiconductor, Shandong Huaguang Opto, Sharp,
Shenzen Mason Technologies, Shenzen Mingxue, Shenzen Refond, Shibuya Kogyo,
Shinetsu, Shinko, Sibdi, Silian, Siliconwafer Precision Industries, Stanley,
Sunpu, Suss Microtech, Synova, System plus consulting, Tai-I Technology, TDK ,
Tecdia, Tekcore, Thermagon, Ticona, Tong Hsing, Top engineering, Toshiba,
Touch Microsystem Technology, Towa, Toyoda Gosei, Tridonic Atco, TSE, TS MC,
Uni Via Technology, U nipress, Unity Opto, Verticle, Viking Tech, Visera Tech,
Vishay, Waker, WenRu, Wenworth Laboratory, Withlight, Wollemi, Wooree LED,
Xiamen Hualian, Xintec, Zeon chemical, Zevac.
WHO SHOULD BUY THIS REPORT
- Equipment, material and chemical manufacturers to:
- Have a global view on main market metrics
- Identify new business opportunities
- Understand the value-proposition of your product in this market
- LED makers
- Get an overview on the competing solutions
- Learn and anticipate the future trends in LED packaging
BIO
Eric VIREY, Ph.D. Eric Virey holds a Ph-D in Optoelectronics from the
National Polytechnic Institute of Grenoble. In the last 12 years, he' s held
various R&D, engineering, manufacturing and marketing position with
Saint-Gobain. Most recently, he was Market Manager at Saint-Gobain Crystals,
in charge of Sapphire substrates and materials for optical telecoms.
Jean-Marc Yannou joined Yole Développement as technology and
market expert in the fields of advanced packaging and Intergrate Passive
Devices. He has 15-years of experience in the semiconductor industry. He
worked for Texas Instruments and Philips (then NXP semiconductor) where he
served as Innovation Manager for System-in-Package technologies.
ABOUT YOLE DÉVELOPPEMENT
Beginning in 1998 with Yole Développement, we have grown to become a
group of companies providing market research, technology analysis, strategy
consulting, media in addition to finance services. With a solid focus on
emerging applications using silicon and/or micro manufacturing Yole
Développement group has expanded to include more than 40 associates
worldwide covering MEMS and microfluidics, Advanced Packaging, Compound
Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports
companies, investors and R&D organizations worldwide to help them understand
markets and follow technology trends to develop their business.
Table of Contents
Acronyms
Introduction
Executive Summary
Methodology
Definitions Used in this Report
Comparison with 2009 LED packaging report
I - LED Market Overview
- High Brightness LED Package Segmentation
- Qualified vs. Non-Qualified LED
- Revenue by Application (Base Scenario)
- Die Surface by Application (Base Scenario)
- Volume by Package Types (Base Scenario)
- LED and Substrates Materials
- Die Surface by Material Type (Base Scenario)
- General Lighting Accelerated Scenario
- Accelerated Scenario: Main Outcomes
- GaN Capacity vs. Demand
- Conclusion
II - LED Packaging Overview
- The functions of LED Packaging: Why Packaging LEDs?
- Integration Strategies
- Key Components of a Packaged LED
- GaN LED Chip Design Overview
- Low & Mid-Power LED Packaging
- High Power LED Packaging
- High Power LED Packages:
- Single vs. multiple dies
- Leading LED Packaging Companies
III - Substrate Removal & Wafer Bonding
- Summary: Substrate Removal and Wafer Bonding
- Introduction
- Substrate Removal:
- Laser Lift Off (LLO)
- Chemical Lift Off (CLO)
- Mechanical
- Case of InGaAlP LEDs
- Laser Lift Off Equipment Market
- Wafer bonding:
- Permanent Bonding
- Wafer Bonding Equipment Volume
IV - Die Singulation
- LED Die Separation techniques
- Blade Dicing
- Laser Dicing
- Diamond Scribing
- UV Laser Scribing
- Examples of manufacturing equipment
- Comparison of Scribing Techniques for Sapphire
- Breaking
- Comparison of Die Singulation Techniques:
- Stealth dicing
- Serial Multibeam Laser Dicing
- Parallel Multibeam Laser Scribing
- Thermal laser separation
- Etching
- Singulation Equipment Market: Market Share per Technology
- Singulation Equipment Market: Equipment ASP
- Singulation Equipment Market: Volumes
- LED Die Separation Equipment: Main Players
V - Packaging Substrates
- Summary
- Substrate Choice: Rationale For Thermal Management
- Substrates for Low/Mid-Power LEDs
- Substrates for mid-power LEDs
- Thermal Management of high power LEDs
- Overview
- Material properties
- Main design options
- Overview of substrates and circuit board material options
- Lead Frame / Heat Slug Substrates for high power LEDs
- Ceramic Substrates For High Power LEDs
- DPC- Direct Plated Copper
- LTCC
- Glass-Ceramic Substrates For High Power LEDs
- Other Substrate Materials
- High Power LEDs Integration Strategies
- SMT Packages versus Chip On Board
- MCPCB example
- High Power LEDs Integration Strategies
- SMT Packages versus Chip On Board
- Chip on Board (COB) LED array
- Connection to the fixture
- COB versus package substrate Summary table
- Other Design Options
- Choosing the Substrate Type
- Market Penetration Forecast by Substrate Type for High Power Packages
(Volume, ASP, M$)
VI - ESD Protection
- Summary
- Introduction
- ESD Protection Adoption
- ESD/TVS protection
- Zener/avalanche diodes
- Where are ESD/TVS diodes used?
- ESD Protection with Silicon Submounts
- ESD in Ceramic
- HB-LED ESD Protection Forecasts in Munits
- High Power LED Package ESD Protection Market Forecast by diode Integration
Scheme (M$)
- Silicon Substrates Forecast
- Key ESD diodes and submounts Manufacturers (non-exhaustive)
VII - Die Attach
- Summary
- Die attach Materials and Techniques
- LED die attach
- Standard epoxy/polymer adhesives
- Silver-filled epoxies
- Vertical LEDs and Back-side metallization
- AuSn solder paste
- AuSn Eutectic bonding
- Eutectic bonding
- Emerging technologies
VIII - Interconnects
- Interconnections of large LED Chips
- Interconnections
- Wire bonding
- Ribbon-bonding
- Flip-Chip
- Flip Chip Layout Principles and Technologies
- World Map of High Power LED Companies Using Flip Chip or designing for
flip chip
- Current Distribution : Vias
IX - Encapsulation and Optics
- Summary
- Encapsulation and Primary Optics
- Overview
- LED Optics Examples
- LED Lens Materials:
- Focus on Silicone
- Process
- Printing
- Molding
- Micro-replication
- Gradient index lens wafers
- Volume breakdown per function
- ASP
- Revenue Breakdown per function
- Volume breakdown per package type
X - Phosphors
- Summary
- How to make white light?
- Key requirements
- Types of pcLEDs:
- Benefits of the various pcLED types - Trends
- Phosphor Converted LEDs:
- Overview
- Phosphors
- Deposition methods
- Dispersion
- Conformal and Plates
- Remote phosphors
- Less common or emerging compositions
- Quantum dots
- Quantum dots: Main Players
- Material Volume and Revenue
XI - Wafer Level Packaging
- Summary
- WLP operations for high power LEDs
- Wafer Level Phosphor Coating
- Wafer Level Optics- lens molding
- Silicon Substrate and WLP for high power LEDs
- Embedded Zener Diodes
- Silicon Substrates, WLP and Flip Chip
- Main actors by wafer sizes (R&D or production)
- Silicon Substrates and WLP
- Cost
- World Map of high Power LED and Equipment Companies with Wafer Level
Packaging Production or R&D projects
- Silicon Substrates and WLP
- WLP Long Term Vision: Wafer to Wafer packaging?
- Challenges for Wafer to Wafer Packaging:
- 3-D interposer to combine MOSFET + ASIC LED driver
- Example of initial achievements
XII - Testing and Binning
- LED Testing and Sorting
- Overview
- Testing Workflow Example
- Measurement Challenges
- Wafer Level And Die Testing
- Optical inspection and probing
- Visual inspection and probing
- Sorting & Binning
- Overview
- Package Testing and Sorting
- Equipment, Capex and Throughput
- Optical and visual Inspection
- Packaged LED Testers, Sorters & Taping
- Software
- Testing Equipments: Volumes
- Testing Equipments: Revenue
- Testing Equipment: Main Players
XIII - Trends in Si Use for LED Packaging
- Silicon in high power LED Packages
- Silicon Submounts
- Silicon in LED Packages
- Market Forecast
- Conclusions
Conclusions
