Abstract
DESCRIPTION:
Temporary bonding equipment market will see 5x growth in value 2011-2016
WHY THIN WAFERS WILL REQUIRE SPECIAL HANDLING PROCESSES & TECHNOLOGIES
Many consumer applications will require the need for ultra-thin semiconductor
wafers (down to 50μm). But as wafer thickness decreases from the
traditional 500μm to 100μm and below, manufacturing challenges arise.
Indeed, ultra-thin wafers are less stable and more vulnerable to stresses, and
die can be prone to breaking and warping - not only during grinding but also
at subsequent processing steps. To address these challenges, as chip thickness
is reduced, new processes including temporary bonding technologies will be
required for handling such fragile wafers, specifically to support the wafer
during backgrinding and subsequent post-thinning processes.
As tapes can no longer be used for ultra-thin wafers (main reasons are the
non-uniformity of the tapes, adhesion and extreme flexibility), new wafer
handling technologies have to be developed. We are at the very start of an
impressive market growth for temporary bonding technology. The “Thin
Wafer Manufacturing Equipment & Materials Market” report is the first
Yole report to describe the markets, applications and technologies for thin
wafer manufacturing: our scope covers temporary bonding markets, applications,
descriptions and trends for wafer thinning and dicing. This report also
includes a market analysis on temporary bonding materials (wax, glue, tapes,
carrier wafers) associated with the temporary bonding technology.
MANY DIFFERENT APPROACHES IN DEVELOPMENT
Temporary bonding technologies are numerous with no clear winning scenario
coming out today. We have identified at least 6 different technologies for
wafer temporary bonding with carriers (see figure 1). Each one of these
approaches might have subtle differences in terms of chemistry, carriers and
other attributes. Along with these approaches came also temporary bonding
without carrier and reconstituted wafer for Fan Out WLP. So, the total number
of approaches is more than 10 as of today. But this market is still in infancy
and no clear temporary bonding technology is emerging. Many companies are
competing to propose the best approach to achieve low cost, high temperature
resistance and resolve topography issues
Figure 1: temporary bonding processes requiring carrier wafer
As temporary bonding is a multi-disciplinary technology, it implies mastering
know-how in process, chemistry and an understanding of the final application
requirements. As a consequence, there are numerous collaborations running
between tool makers, chemical players and substrate suppliers. Some companies
are mastering both process and chemistry (Nitto Denko, TOK or TEL), but for
others, partnerships are necessary.
THE TEMPORARY BONDING MARKET WILL UNDERGO A 5X MARKET GROWTH OVER 2011-2016
Temporary bonding is definitively a multiple-applications market. This is why
the market is expected to boom. We estimate the total number of wafers
requiring temporary wafer bonding will be more than 35M by 2016 (all wafer
sizes). Main applications driving temporary bonding are Advanced Packaging
applications (TSV, interposers and Fan Out WLP), Power Devices (IGBTs), RF
Devices & LEDs.
Figure 2: temporary bonding applications
By 2016, we evaluate the wafer temporary bonding (WTB) market equipment value
for wafer & panels to be $300M by 2016.
Figure 3: forecast for temporary wafer bonders by application
KEY FEATURES OF THE REPORT:
The report will analyze in detail the technical & economic evolution of the
temporary wafer bonding process and wafer thinning and dicing.
It will give:
- 2010-2016 Market Forecasts for temporary bonding in MUS$ value and number
of equipment
- By application (Advanced Packaging: 3D TSV Interposers, FO WLP, LEDs,
RF, Power, MEMS)
- By wafer size
- 2010-2016 Market Forecast for temporary bonding chemistry
- Overview of the different temporary bonding approaches, e.g.:
- Without carrier
- With Carrier:
- UV laser released, Electrostatic, Thermal release, Mechanical release,
Chemical release
- Reconstitued wafer
- What the trends for temporary wafer bonding are
- What the trends for wafer thinning are
- What the trends for wafer dicing are
- Description of the applications for temporary wafer bonding with main
characteristics, challenges
- Equipment players market shares and competitive information
COMPANIES CITED IN THE REPORT:
3M, ABB, Accretech, AIT, All Via, ALSI, AMAT, Brewer Science, Corning,
Danfoss, Denka, Disco, DoubleCheck Semiconductors, Dupont, Dynatex, ERS, ESI,
EVG, Fairchild, FhG IZM, Fico, Furukawa, Hamamatsu, Hitachi Chemical,
Infineon, Invensense, IR, Jenoptik, Laserod, Leti, Lintec, Loadpoint,
Lumileds, Mitsui Chemicals, Nitronex, Nitta, Nitto Denko, OnSemi, Osram,
Panasonic, Plan Optik, ProTec, PVA Tepla, RFMD, Ricmar, Rorze, Schott, Scrypt,
Sekisui, Shibuya, ShinEtsu, Skyworks, STM, Strasbaugh, Sumitomo Bakelite,
Sumitomo Chemical, SUSS MicroTec, Synova, Sysmelec, Takada, TEL, TMAT, TOK,
Triquint, Veeco, Yushin.....
BENEFITS:
WHO SHOULD BUY THIS REPORT?
- Temporary wafer bonder manufacturers
- Identify and evaluate temporary bonding markets with market size, growth
and key customers
- Analyze the threads and opportunities
- Monitor and benchmark your competitor' s advancements
- Chemical companies
- Identify and evaluate what the requirements for temporary bonding
materials will be
- Analyze the threads and opportunities
- Foundries & chip manufacturers
- Get an overview of the large panel of accessible temporary wafer bonding
technologies
- Spot the important temporary wafer bonding technologies in the future
for your application
- Financial & Strategic investors
- Understand the main market dynamics and main technological trends
- Get the list of the key players
BIOS OF THE AUTHOR
Dr. Eric Mounier has a PhD in microelectronics from the INPG in
Grenoble. Since 1998 he is a co-founder of Yole Développement, a market
research company based in France. At Yole Développement, Dr. Eric
Mounier is in charge of market analysis for MEMS, equipment & material. He is
Chief Editor of Micronews, and MEMS' Trends magazines (Magazine on MEMS
Technologies & Markets).
ABOUT YOLE DÉVELOPPEMENT
Beginning in 1998 with Yole Développement, we have grown to become a
group of companies providing market research, technology analysis, strategy
consulting, media in addition to finance services. With a solid focus on
emerging applications using silicon and/or micro manufacturing Yole
Développement group has expanded to include more than 40 associates
worldwide covering MEMS and microfluidics, Advanced Packaging, Compound
Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports
companies, investors and R&D organizations worldwide to help them understand
markets and follow technology trends to develop their business.
Table of Contents
TABLE OF CONTENT
EXECUTIVE SUMMARY
- Why thin wafer handling processes
- Temporary bonding trends
- Temporary bonding technologies
- The different temporary bonding tools
- Temporary bonding materials
- Temporary bonding cost breakdown
- Temporary bonding forecast in number of wafers
- Temporary bonders market forecast in $M
- Temporary bonding tool market forecast 20102016 in US$M
- Temporary bonding market drivers
- Thinning & dicing challenges
WAFER TEMPORARY BONDERS/CARRIERS/MATERIALS FORECAST
- Temporary bonding forecast in number of wafers
- Temporary bonder market forecasts in $M/units
- Si & glass carrier forecast in $M
- Chemistry forecast in $M
TEMPORARY BONDERS PLAYERS
- Estimated 2010 market share for temporary bonding
- Temporary bonding suppliers
- Dicing & grinding/thinning suppliers
- Equipment supplier map
- Materials supplier map
- Companies profiles:
- IP players
- Equipment players
- Materials players
APPLICATIONS
- Power devices
- MEMS
- RF devices
- LEDs
- Advanced packaging
- 3D TSV
- Interposers
- FO WLP
THIN WAFERS TECHNOLOGIES
- Thin wafer roadmap
- Thin wafer applications
- Thin wafer handling: the different solutions
- Wafer handling without carrier: ring
- Wafer handling without carrier: adhesive tapes
- Wafer handling with carrier
- Wafer handling with carrier: electrostatic
- Wafer handling with carrier: temporary bonding
- Temporary bonding principle
- Debonding principle
- Temporary materials
- Temporary bonding techniques overview
- Thermal plastic
- Mechanical release
- Laser release
- Chemical release
- Wafer dicing
FINAL CONCLUSIONS
APPENDIX
- Yole Développement presentation
