Abstract
A Yole 2011 Report on Technologies & Market Trends for Permanent Bonding
Wafer Bonding will be a Key Enabling Technology for Advanced Semiconductor
Manufacturing
Historically developed for MEMS & SOI substrates, wafer bonding technology is
today becoming a key processing technology for a wide range of applications:
MEMS, CMOS Image Sensors, LEDs, Power Devices, RF and Advanced Packaging.
The wafer bonding market is very complex, crossing different wafer sizes (from
2' ' to 12' ' ), different applications (Advanced Substrates such as SOI, MEMS,
LEDs, CMOS Image Sensors, Power Devices, RF Devices & Advanced Packaging) and
different bonding technologies (Adhesive, Anodic, Fusion, Direct Oxide,
Eutectic, Glass Frit, Metal Diffusion).
Our report provides a vision of what the wafer bonding technologies will
become over the 2010-2016 time line.
MARKET TRENDS
Wafer bonding is usually defined as a process that temporarily or permanently
joins two wafers or substrates using a suitable process. Historically
developed for MEMS and then SOI wafers, wafer bonding technology has shifted
to specific IC applications in recent years. Our report aims at analyzing the
market perspectives and technical trends for permanent bonding.
MEMS has been the first application where wafer bonders have been massively
used (the wafer bonding step is mostly used to protect the MEMS sensitive
element). And CMOS Image Sensors is also a very promising application for
wafer bonders. Indeed, up to two different wafer bonding steps can be
necessary for next-generation CMOS Image Sensors: one for Back-Side
Illumination and the second for WLCSP.
But besides MEMS and CIS, wafer bonding can be also used for LEDs or Power
Devices. Indeed, in a typical LED active region, spontaneous emission scatters
photons in all directions. If the substrate material has a smaller band gap
than the active region, approximately half of the light is absorbed in the
substrate; significantly reducing device performance. So, one of the
manufacturing solutions for photon loss involves bonding a wafer containing an
array of devices to another wafer that provides both a reflective surface for
maximum light extraction and a heat sink for thermal management. And of
course, over the 5 past years, much attention has been given to this
technology for 3D integration of memories for example.
TECHNICAL TRENDS
For MEMS, there is today a shift from Glass Frit for eutectic/metal-based
bonding mainly to increase real estate by smaller bond frames. Metal direct
bonding also gives good hermeticity and mechanical stability for many MEMS
applications. For example, Nasiri process is using eutectic bonding of the
MEMS directly on the aluminum layer of the CMOS wafer. This leads to smaller
package footprints & package heights. STMicroelectronics' latest 3-axis
accelerometer (LIS3DH) also shows a different sealing technique compared to
what is usually done: gold eutectic sealing allows a dramatic die size
reduction.
For CMOS Image sensors, the advent of the BSI (Back Side Illumination)
technology has raised a competition between Molecular Bonding and adhesive
bonding. Here, cost and final application will drive the technology final
choice.
We foresee that the wafer bonder will have substantial growth in the forecast
period. The growth will be driven small size wafer for LEDs and 12�h wafer for
3D stacking and CIS.
Although EVGroup is market leader in permanent bonding, the growth of the
bonding equipment market is attracting challengers.
KEY FEATURES OF THE STUDY
The report will analyze in detail the technical & economic evolution of the
permanent wafer bonding process. It will give:
2010-2016 Market Forecasts for permanent bonding in MUS$ value and number
of equipment
- By technology (Adhesive, Anodic, Fusion, Eutectic, Glass Frit, Direct
Bonding �c)
- By application (MEMS, CMOS Image Sensors, LEDs, RF, Power, 3D TSV, SOI)
- By wafer size
Overview of the different bonding approaches, e.g.:
- Thermo-Compression
- Direct Oxide / Molecular / Fusion
- Glass Frit
- Metal Eutectic / Solder
- Polymer / Adhesive
- Anodic
- Hybrid bonding Metal/polymer , micro bumping & Metal/oxide
Trends for permanent bonding
W2W vs. C2W analysis for 3D integration
Description of the applications for wafer bonding with main
characteristics, challenges
Equipment players market shares and competitive information
WHO SHOULD BUY THIS REPORT ?
Wafer bonder manufacturers
- Identify and evaluate permanent bonding markets with market size, growth
and key customers
- Analyze the threads and opportunities
- Monitor and benchmark your competitor' s advancements
Foundries & chip manufacturers
- Get an overview of the large panel of accessible permanent wafer bonding
technologies
- Spot the important permanent wafer bonding technologies in the future for
your application
Financial & Strategic investors
- Understand the main market dynamics and main technological trends
- Get the list of the key players
COMPANIES MENTIONED IN THE REPORT
Acreo, AML, APM/UMC, Avago, Ayumi, Bosch, Colibrys, Dalsa, Discera, EVGroup,
FhG IMS, FLIR, IBM, Icemos, IMEC, IMT, Infineon, Invensense, KTH, Leti,
Lumileds, MEMStech, Micralyne, Mitsubishi Heavy Industries, Okmetic, Omron,
Osram, Qualcomm, Raytheon, RPI, Sand9, Semefab, Sensonor, Silex, SOITEC, STM,
SUSS MicroTEC, Tezzaron, TI, tMt, Tohoku University, TowerJazz, Tracit,
Triquint, Tronic' s, TSMC, VTI, Xcom, Ziptronix
Table of Contents
Wafer Bonding definition
Our approach
Wafer bonding overview
- Devices
- Function
- Technologies
Executive Summary
- Overview
- Market drivers
- Type of bonding by application
- Permanent wafer bonders forecast in $M
- Bonded wafers forecast by wafer size
- Trends in MEMS permanent bonding
- Trends in CIS permanent bonding
- Trends in 3D TSV permanent bonding
- Trends in LEDs permanent bonding
- Trends in SOI permanent bonding
Wafer bonding market forecasts in $M & units
- By application
- In number of wafers
- By technology
- Equipment forecast by application
- Equipment forecast by wafer size
- Equipment forecast by technology
Permanent bonders company profiles
- Market share
- AML
- AST
- Ayumi
- EVGroup
- SUSS microTec
Permanent bonding
- Tools characteristics
- Technologies
- Pros & cons by type of bonding
- Cost analysis
- Direct bonding
- Hybrid bonding
- Indirect bonding
- Wafer bonding requirements
- Alignment accuracy methods
Description of applications
- MEMS
- CMOS Image Sensors
- Advanced Packaging
- LEDs
- Power devices
- RF devices
- SOI
Conclusions
Appendix
