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市場調查報告書
利用矽以及玻璃的3次元中介層市場
3D Silicon & Glass Interposer
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利用矽以及玻璃的3次元中介層市場 是由出版商Yole Developpement在2010年09月所出版的。
這份英文市場調查報告書價格從美金5390起跳。
半導體封裝技術受到系統小型化和高性能化需求的促進，在此10年急速進化，發展出SiP和PoP、fc-BGA、WLP等各種技術。此外，貫通電極的出現，使得對應3次元安裝的中介層（連接晶片與主機板的基板）的需求增加，對半導體產業來說，一個新的商業機會正在擴大當中。
本報告，提出對應各種用途的3次元中介層市場，以成長促進因素和業績展望，彙整各種技術的比較、普及的展望、市場的趨勢和資料、目標晶圓價格的分析、成本分析、供應鏈分析等，由下列摘要形式闡述。
※本報告預計在2010年9月底發行。此外，有可能會有未經預告而變更內容和價格、出版時間的情況。詳細情形，再請詢問本公司。
第1章 本報告的調查範圍與定義
第2章 報告摘要
第3章 用途與普及促進因素
- 對應MEMS與感應器的中介層
- 邏輯中介層
- 邏輯＋記憶體中介層
- CMOS影像感應器用的中介層
- 對應高亮度LED的3次元基板
- 3次元動力/無線/類比整合被動零件
- 記憶體堆疊用中介層
- 各種玻璃/矽封裝基板
第4章 3次元矽/玻璃中介層的技術
- 基板的素材、基板的厚度、繞線金屬、繞線層、誘電體、圖案結構法、通過穿孔與充填、晶圓與面板的規格
- 對各種用途的相容性
- 設計上的規定
第5章 用途別的競爭解決方案與技術
第6章 成本
- 矽中介層的成本結構與造成影響的因素
- 可接受的價格、成本面的目標
- 成本降低的技術藍圖
- 各種事例
第7章 供應鏈分析
- 中介層廠商的有力候補以及供應鏈組織的用途別分析
- 挑明參與市場的企業與已經參與的企業、以及其他各家的地位
第8章 市場預測
- 2009∼2015年的市場預測：用途、基板素材規格以及形態別的金額基礎預測
- 2009∼2015年的市場預測：用途、基板素材規格以及形態別的晶圓片數基礎預測
第9章 技術藍圖
第10章 結論
Abstract
Physical Analysis of the Device Step by Step Reconstruction of the Process
Flow Cost of Manufacturing & Estimation of Selling Price.
Yole Dpéveloppement is pleased to publish a reverse costing report on
the LIS331DLH high performance digital 3 axis accelerometer supplied by
STMicroelectronics and targeting low-power consumer & industrial applications.
Based on a complete teardown process, the report provides an estimation of the
production cost as well as the selling price of the chip.
This report provides a reverse costing of the MEMS accelerometer with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
About Yole Dpéveloppement
Our commitment is to facilitate market access for innovative technology,
devices, equipment and materials in the MEMS, compound semiconductor, nano and
life science fields. Founded in 1998, Yole Dpéveloppement is involved
in different fields, with strong leadership worldwide:
- MEMS
- Compound semiconductor
- Nanomaterials
- Equipments & Materials for MEMS/Semiconductor manufacturing
- Micro and nanotechnologies for Life science and chemistry
- Photovoltaic and palm power areas
Our services and publications:
- Market research
- Technology analysis
- Strategy consulting
- M&A support and due diligence
- Market reports & databases
- Magazine Publication Micronews (print version and on line services)
- Exclusive newsletters in MEMS, 3D IC, photovoltaic, compound
semiconductors and microfluidics
- Exclusive newsletters in MEMS, 3D IC, photovoltaic, compound
semiconductors and microfluidics
Yole Dpéveloppement is now the world leader in the analysis of the
microtechnologies and compound semiconductors markets. Each day, YYole
Dpéveloppement' s team of 18 consultants is in contact with worldwide
key industrial companies, R&D institutes and investors in order to help them
to understand the market and technology trends. In its analysis, Yole
Dpéveloppement takes into account the complete value chain including
materials and equipment suppliers, device & system manufacturers and devices
users.
Table of Contents
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
STMicroelectronics Company Profile
- STMicroelectronics
- LIS331DLH Specifications & Block Diagram
Physical analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening & Bonding Number
- Device Structure
- ASIC - Dimensions
- ASIC - Markings & Bond Pads
- ASIC - Functions
- ASIC Synthesis
- MEMS Sensor - Dimensions and Marking
- MEMS Sensor - X-Axis SEM Views
- MEMS Sensor - Y-Axis SEM Views
- MEMS Sensor - Z-Axis SEM Views
- MEMS Sensor - Capacitances electrodes
- Component Cross-Section
- MEMS Cross-Section
- Mobil Elements Cross-Section
- Physical Data Summary
- MEMS process characteristics
Manufacturing Process Flow
- Global Overview
- ASIC Process Flow
- Description of the ASIC Wafer Fabrication Unit
- MEMS Process Flow
- Description of the MEMS Wafer Fabrication Unit
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Die per wafer & Probe Test
- ASIC Wafer Front-End Cost
- ASIC Die Cost
- MEMS Wafer Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- MEMS Back-End 0 : Probe Test & dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End 1 : Packaging, Final test, calibration
- LIS331DLH Component Cost (FE + BE 0 + BE 1)
- Yields Synthesis
Estimated Manufacturer Price Analysis
- Supply Chain Analysis
- Manufacturers ratios
- Estimated manufacturer Price
Conclusion
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