|
市場調查報告書
InvenSense公司的3軸陀螺儀ITG-3200：反轉成本分析
InvenSense ITG-3200 -3-Axis Gyroscope Reverse Costing Analysis
|
InvenSense公司的3軸陀螺儀ITG-3200：反轉成本分析 是由出版商System Plus Consulting在2010年05月所出版的。
這份英文市場調查報告書價格從美金3120起跳。
本報告書為MEMS陀螺儀之詳細分析，包含材料、製造工程流程、經濟分析、製造成本、販售價格預測等，概述如下。
用語
概要／導論
InvenSense企業簡介
物理的分析
- 物理的分析之合成
- 物理的分析方法
- 封裝特徵與標記
- 封裝的開口部・接合部數
- 裝置的構造
- 裝置尺寸
- MEMS感測器：光學視野
- MEMS感測器：X軸SEM視野
- MEMS感測器：Y軸SEM視野
- MEMS感測器：Z軸SEM視野
- ASIC概要
- ASIC行銷與公債基礎
- ASIC共振器
- ASIC簡化
- ASIC邏輯區域與記憶體
- 元件切面圖
- ASIC程序的特徵
- MEMS程序的特徵
- 與前世代的比較
製造工程流程
- 概要
- ASIC工程流程
- MEMS工程流程
- 晶圓製造裝置概要
原價分析
- 原價分析之合成
- 經濟的分析的主要步驟
- 停滯說明
- 各晶圓的印模、測定測試
- ASIC前工程成本
- MEMS前工程成本
- 各工程階段的MEMS前工程成本
- MEMS前工程：各系列的裝置
- MEMS前工程：各系列的材料費
- 前工程成本總額
- 後工程0：測定測試與印模
- 晶圓成本總額
- 印模成本
- 後工程1：封裝成本
- 後工程1：最終檢査成本
- ITG-3200內容成本
製造業者價格分析
結論
Abstract
Physical Analysis of the Device
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
Yole Développement publish the reverse costing report of the 3-Axis
MEMS Gyroscope ITG-3200 supplied by InvenSense.
The ITG-3200 is the first 3-axis(Pitch-Roll Yaw) gyro developed by InvenSense.
It uses a very thin 4x4x0.9mm QFN package. The components are manufactured on
200mm wafers using a three-bonded-wafer process: a thin sensor wafer and a
protective cap wafer both processed by Deep RIE, and an ASIC wafer for signal
conditioning. The ITG-32003-Axis gyroscopes are suitable for various motion
processing solutions for consumer products.
This report provides complete teardown of the MEMS Gyroscope with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation Glossary Overview
BENEFITS:
- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor' s products
Table of Contents
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
InvenSense Company Profile
Physical analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening & Bonding Number
- Device Structure
- Device Dimensions
- MEMS Sensor - Optical Views
- MEMS Sensor - X-Axis SEM Views
- MEMS Sensor - Y-Axis SEM Views
- MEMS Sensor - Z-Axis SEM Views
- ASIC - Overview
- ASIC - Markings & Bond Pads
- ASIC - Cavities
- ASIC - Delayering
- ASIC - Logic Area & Memory
- Component Cross-Sections
- ASIC Process Characteristics
- MEMS process characteristics
- Comparisons with Previous Generations
Manufacturing Process Flow
- Overview
- ASIC Process Flow (CMOS + Cavity Etch)
- MEMS Process Flow (Cap + Sensor + Assembly)
- Description of the Wafer Fabrication Unit
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Die per wafer & Probe Test
- Front-End Cost - Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- Total Front-End Cost (ASIC + MEMS + Assembly)
- Back-End 0 : Probe Test and Dicing
- Total Wafer Cost (Front-End + Back-End 0)
- Die cost
- Back-End 1 : Packaging Cost
- Back-End 1 : Final Test Cost
- ITG-3200 Component Cost (FE + BE 0 + BE 1)
Estimated Manufacturer Price Analysis
Conclusion
|
