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市場調查報告書
SiTime公司的振盪器「SiT8002」：逆向成本分析
SiTime SiT8002 - MEMS Oscillator Reverse Costing Analysis
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SiTime公司的振盪器「SiT8002」：逆向成本分析 是由出版商System Plus Consulting在2010年02月所出版的。
這份英文市場調查報告書價格從美金2340起跳。
本報告，檢視MEMS振盪器相關的材料分析、線路組裝、製造工程、生產成本明細、銷售價格預測等，由下列摘要形式闡述。
專業用語
概述／簡介
SiTime企業檔案資料
物理分析
- 綜合物裡分析
- 物理分析方式
- 封裝的特徵與標記
- 封裝X光
- 封裝的開口數與接合數
- ASIC標記
- ASIC尺寸
- ASIC最小尺寸與金屬層
- ASIC製程特徵
- 共振器標記
- 共振器尺寸
- 附蓋與電子接點的共振器
- 共振器電子接點的詳細內容
- 共振器裝置斷面圖
- MEMS製程特徵
製程流程
- 概述
- ASIC工程流程
- MEMS工程流程
- 晶圓製程裝置詳述
成本分析
- 綜合成本分析
- 經濟分析的主要步驟
- 供應鏈分析
- 製造業者財務比率
- 良率說明
- ASIC前段工程成本：假設
- ASIC前段工程成本
- ASIC後段工程0：探針測試
- ASIC後段工程0：背面研磨・晶圓裁切
- ASIC晶圓成本
- ASIC裁切成本
- MEMS前段工程成本：假設
- MEMS前段工程成本
- MEMS前段工程的各製程成本
- MEMS前段工程：每一事業群的設備成本
- MEMS前段工程：每一事業群的材料成本
- 後段工程0：探針測試
- 後段工程0：背面研磨・晶圓裁切
- MEMS晶圓成本
- MEMS裁切成本
- SiT8002封裝成本：假設與製程流程
- SiT8002封裝成本
- SiT8002最終測試成本
- SiT8002零件生產成本
- 良率
- SiT8002成本分析發展
製造業者價格分析
結論
Abstract
- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor' s products
System Plus Consulting is proud to publish the reverse costing report of the
MEMS Oscillator SiT8002 supplied by SiTime Corporation.
The SiTime SiT8002 is a one-time programmable 1MHz to 125MHz oscillator.
Completely quartz-free, It uses a standard 2.5× 2.0mm 4-land MLF-type
package containing 2 stacked dies: a MEMS resonator and an ASIC for signal
conditioning. The MEMS resonator is manufactured on SOI wafers using MEMS
First™ process licensed by Robert Bosch GmbH. The SiT8002 programmable
oscillator is suitable for use in clock generation for consumer, portable
industrial, automotive, and computation applications.
This report provides complete teardown of the MEMS Oscillator with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Table of Contents
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
SiTime Company Profile
- Product Range
- Business Model
Physical analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package X-Ray
- Package Opening & Bonding Number
- ASIC Markings
- ASIC Dimensions
- ASIC Minimal Dimension and Metal Layers
- ASIC Process Characteristics
- Resonator Markings
- Resonator Dimensions
- Resonator with Cap and Electrical Contacts
- Resonator after Cap Polishing
- Resonator Electrical Contact Details
- Resonator Cross-Section
- MEMS process characteristics
Manufacturing Process Flow
- Overview
- ASIC Process Flow
- MEMS Process Flow
- Description of the Wafer Fabrication Units
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers Financial Ratios
- Yields Explanation
- ASIC Front-End Cost - Hypothesis
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test
- ASIC Back-End 0 : Backgrinding and Dicing
- ASIC Water Cost
- ASIC Die Cost
- MEMS Front-End Cost - Hypothesis
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End Cost: Equipment Cost per Family
- MEMS Front-End Cost material Cost per Family
- MEMS Back End 0: Probe Test
- MEMS Front-End 0 Backgrinding and Dicing
- MEMS Water Cost
- MEMS Die cost
- SiT 80002 Packaging Cost Hypothesis & Process Flow
- SiT 80002 Packaging Cost
- SiT 80002 Final Test Cost
- SiT 80002 Component Manufacturing Cost
- Yield Synthesis
Estimated Manufacturer Price Analysis
Conclusion
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