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市場調查報告書
InvenSense公司的雙軸陀螺儀「IDG-600/650」：逆向成本分析
InvenSense IDG-600/650 2-Axis Gyroscope Reverse Costing Analysis
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InvenSense公司的雙軸陀螺儀「IDG-600/650」：逆向成本分析 是由出版商System Plus Consulting在2010年02月所出版的。
這份英文市場調查報告書價格從美金2600起跳。
本報告，檢視MEMS陀螺儀相關的材料分析、線路組裝、製造工程、生產成本明細、銷售價格預測等，由下列摘要形式闡述。
專業用語
概述／簡介
InvenSense企業檔案資料
物理分析
- 綜合物裡分析
- 物理分析方式
- 封裝的特徵與標記
- 封裝的開口數與接合數
- IDG-600/IDG-650的比較
- 裝置結構
- 裝置尺寸
- ASIC標記
- ASIC最小尺寸與金屬層
- ASIC主體
- ASIC製程特徵
- MEMS標記
- MEMS感測器的IR圖
- MEMS感測器的詳細內容
- 零件斷面圖
- MEMS製程特徵
製程流程
成本分析
- 綜合成本分析
- 經濟分析的主要步驟
- 供應鏈分析
- 製造業者財務比率
- 良率說明
- ASIC前段工程成本
- MEMS前段工程成本
- MEMS前段工程的各製程成本
- MEMS前段工程：每一事業群的設備成本
- MEMS前段工程：每一事業群的材料成本
- 前段工程總成本
- 後段工程0：探針測試與晶圓裁切
- 晶圓成本
- 裁切成本
- 封裝成本
- 最終測試成本
- 零件生產成本
- 良率
製造業者價格分析
結論
Abstract
- Physical Analysis of the Device
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
System Plus Consulting is proud to publish the reverse costing report of the
Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense.
The IDG-600,integrated in the Nintendo Wii Motion Plus accessory, and its
standard variation the IDG-650 share the same hardware. The components are
manufactured using athree-bonded-wafer process :a thin sensor wafer and a
protective cap wafer processed with bulk micromachinning and an ASIC wafer for
signal conditioning.
The IDG-600/650 gyroscopes are suitable for high performance motion sensing
game controllers, pointing devices, multimedia remotes and computer mice
applications.
This report provides complete teardown of the MEMS Gyroscope with:
- Detailedphotos
- Materialanalysis
- Schematicassemblydescription
- ManufacturingProcessFlow
- In-deptheconomicalanalysis
- Manufacturingcostbreakdown
- SellingpriceestimationInvenSense
Table of Contents
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing MethodologyInvenSense Company Profile
InvenSense Company Profile
- Product Range
- Business ModelPhysical analysis
Physical analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening & Bonding Number
- IDG-600 / IDG-650 Comparison
- Device Structure
- Device Dimensions
- ASIC Markings
- ASIC Minimal Dimension and Metal Layers
- ASIC Main Blocks
- ASIC Process Characteristics
- MEMS Markings
- MEMS Sensor IR View
- MEMS Sensor Details
- Component Cross-Section
- MEMS process characteristics
Manufacturing Process Flow
- Overview
- ASIC Process Flow (CMOS + Cavity Etch)
- MEMS Process Flow (Cap + Sensor + Assembly)Cost Analysis
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers financial ratios
- Yields Explanation
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- Total Front-End Cost (ASIC + MEMS + Assembly)
- Back-End 0 : Probe Test and Dicing
- Total Wafer Cost (Front-End + Back-End 0)
- Die cost
- Packaging Cost
- Final Test Cost
- Component Manufacturing Cost
- Yield SynthesisEstimated Manufacturer Price AnalysisConclusion
Estimated Manufacturer price analysis
Conclusion
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