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市場調查報告書
Seoul Semiconductor公司的「Z-Power P9 LED」：逆向成本分析
Seoul Semiconductor - Z-Power P9 LED
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Seoul Semiconductor公司的「Z-Power P9 LED」：逆向成本分析 是由出版商System Plus Consulting在2010年02月所出版的。
這份英文市場調查報告書價格從美金2990起跳。
本報告，針對Seoul Semiconductor公司的「Z-Power P9 LED」進行調查分析，並彙整成本降低的詳細內容、成本推算、製程流程、經濟分析、銷售價格推算等，由下列摘要形式闡述。
專業用語
第1章 概述／簡介
第2章 物理分析
- 關於物理分析
- 物理分析方式
- 封裝特徵
- 封裝X光
- 封裝開口
- 封裝斷面圖
- LED尺寸
- LED斷面圖
- LED結構
第3章 製程流程
第4章 成本分析
- 概述
- 產量說明
- 假設
- LED晶圓成本
- 每一設備事業群的晶圓成本
- 每一消耗品事業群的晶圓成本
- 每片晶圓所產出的晶片&探針測試
- LED晶片：探針測試
- LED晶片：裁切成本
- LED晶片成本
- 封裝假設
- 封裝製程流程
- 封裝成本的詳細內容
- 最終測試成本
- 零件生產成本
- 成本分析的變革
第5章 製造業者價格推算
結論
Abstract
- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor' s products
System Plus Consulting is proud to publish the reverse costing report of the
Z-Power P9 LED supplied by SEOUL Semiconductor. Based on a complete teardown
process performed by MuAnalysis, the report provides an estimation of the
production cost as well as the selling price of the component.
The Z-Power LED P9 series is round type and consumes 0.5 watt at 150mA. It
features a diameter of 5mm and the average brightness is 25lm. The component
is provided in a specific 2-pins package, compatible with SMT process.
It is used in various applications such as automotive lighting, large size LCD
backlight, mobile phone flash.
This report provides complete teardown and cost estimation of the component with :
- Detailed photos
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimationSEOUL
Table of Contents
Glossary
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
2. Physical Analysis
- About the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics
- Package X-Ray
- Package Opening
- Package Cross-Section
- LED Dimensions
- LED Cross-Section
- LED Structure
3. Manufacturing Process Flow
- LED Die Process Flow
- Wafer Fabrication Units
4. Cost Analysis
- Synthesis of the Cost Analysis
- Yields Explanation
- Hypothesis
- LED Wafer Cost
- Wafer Cost per Equipment Family
- Wafer Cost per Consumable Family
- Dies per Wafer & Probe Test
- LED Die -Probe Cost
- LED Die -Dicing Cost
- LED Die Cost
- Packaging Hypothesis
- Packaging Process Flow
- Packaging Cost Details
- Final Test Cost
- Component Manufacturing Cost
- Cost Analysis Evolution
5. Estimated Manufacturer Price Analysis
- Price definitions
- Manufacturers financial ratios
- Estimated manufacturer Price
Conclusion
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