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市場調查報告書
TSV CoSim+：TSV的製造成本解析工具
TSV CoSim+
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TSV CoSim+：TSV的製造成本解析工具 是由出版商System Plus Consulting在2009年10月所出版的。
這份英文市場調查報告書價格從美金11600起跳。
本工具是由Yole Developpement公司與System Plus Consulting公司所共同開發之TSV製造成本解析工具，將支援各種製造手段之經濟可實現性分析以及與競爭企業的成本比較分析、供應商成本的分析等。TSV CoSim+的摘要如下：
TSV CoSim+的功能
- 各種環境下之成本模擬的執行
- 工廠單位資料庫的整合
- Alchimer AquiVia製程的整合
- 非常高度的彈性
- TSV CoSim+：使用者在任何TSV製程流程中皆可輸入
- 製造製程流程：以分層視圖產生，各製程皆可移動•修正•刪除
- 可保存無限數量的製程流程•機器類型•材料
- 專案管理功能：可進行所有使用者假說的保存•再利用
- 機器•晶圓•材料資料庫的整合
- 兩種的計算模式：專用工廠•非專用工廠
- 最多5種情況的同時模擬
- 採用可用性高的Excel介面
TSV CoSim+的用途
- 成本構造的理解
- 競爭分析
- 各種技術選項的成本評價
- 製程之成本痛點的鎖定
- 經營模式的定義（無工廠•輕晶圓廠•製造等）
新的功能（與TSV＋的比較）
- 使用簡易性的提昇
- TSV製程的定義•輸入時的彈性
- 不同經營模式的情況比較
- 機器•材料資料庫的更新
- 先通孔及後通孔腳本的事前載入
- Alchimer AquiVia製程的整合
成本分析內容的範例
- 最多可比較5種的情況
- 晶圓成本的細目
- 晶圓成本：步驟別
- 晶圓的機器成本：步驟步驟別
- 晶圓的機器成本：機器群組別
- 晶圓的材料成本：步驟別
- 晶圓的材料成本：材料群組別
- TSV成本細目
Abstract
A powerful tool designed for the 3D TSV technology
- 3D integration with Trough Si Vias TSV continues to be developed to
address different 3D technology platforms with different characteristics such
as 3D MEMS, 3D TSV for stacking memories and logic, 3D interposers, 3D WLP of
CIS ?
- With manufacturing technologies in constant developments with many
different options, the need for cost simulation of TSV is rising.
- The cost of the TSV technology can be very difficult to estimate due to
the wide range of technological options (via-first, via-last, type of etching
processes ?)
- This is why Yole has improved its TSV+ Cost Simulation Tool to provide a
new, more powerful version with a new interface.
- Yole Developpement, leader in the analysis of MEMS applications and
market, and System Plus Consulting, leader in the cost analysis of electronic
products have joined their experiences to provide this unique cost simulation
tool.
The multiple benefits of TSV CoSim +
The functions:
- Possibility to run the cost simulation for different geographical zone,
clean room class ?
- Integrated Fab units Database
- Integrated Alchimer AquiVia process for comparison between wet and dry
processes for insulation/seed/barrier
- Very High flexibility :
- TSV CoSim+ allows the user to enter any TSV process flow
- The manufacturing process flows are created dynamically in a friendly
hierarchical view (treeview), where each process steps can be moved,
modified or deleted.
- The user can save an unlimited number of process flow, equipment and
materials
- A project manager offer the possibility to save all the user hypotheses
(Wafer Fabunit, process flow, yields?) and to reuse them later.
- Integrated Equipment, Wafer & Materials databases
- Two calculation modes: dedicated and non-dedicated fab
- Up to five scenarios simulation allowing the user to compare yields
improvement, manufacturing location impact on cost?
- TSV CoSim+ is using ExcelTM interface in order to be widely exploitable
and upgraded. This tool will enable you to evaluate what is the cost per wafer
level for manufacturing TSV using your own inputs or using pre-defined
parameters.
The use of TSV CoSim+ :
- Understanding of the cost structure
- Competitive analysis
- Cost evaluation for different technological options
- Identification of the cost pain points in your process
- Definition of a business model (fables, fablight, manufacturing ?)
What is new ?
Compared to the first version of TSV+, numerous new functionalities have
been added:
- More user friendly interface
- Much more flexibility to define and enter your own TSV process
- Possibility to compare different business model scenarios : dedicated fab,
use of external foundry services
- Updated equipment & materials database
- Pre-loaded via-first & via-last scenarios
- Integration of Alchimer AquiVia process for comparison
Examples of results
Typical TSV CoSim+ results are:
- Possibility to compare up to 5 different scenarios
- Cost of the wafer with breakdown (depreciation cost, manufacturing cost,
labor cost, yield losses)
- Cost of the wafer by steps (DRIE, sacrificial release ?)
- Equipment cost of the wafer by steps
- Equipment cost of the wafer by equipment families (etching, deposition,
lithography, bonding?)
- Material cost of the wafer by steps (wet chemicals, gases, sputter targets)
- Material cost of the wafer by material families
- Cost of the TSV with breakdown between wafer, test, dicing
Benefits:
WHO SHOULD BUY THIS REPORT ?
This tool is ideal for strategic marketing executives, process managers and
R&D engineers analyzing the economical feasibility of different TSV
manufacturing approach. Semiconductor equipment suppliers can use TSV CoSim+
to know what the step cost of their equipment is. Thus they can compare with
their competitors.
MULTIPLE BENEFITS OF TSV CoSim +
The functions:
- Possibility to run the cost simulation for different geographical zone,
clean room class ...
- Integrated Fab units Database
- Integrated Alchimer AquiVia process for comparison between wet and dry
processes for insulation/seed/barrier
- Very High flexibility :
- TSV CoSim+ allows the user to enter any TSV process flow
- The manufacturing process flows are created dynamically in a friendly
hierarchical view (treeview) where each process steps can be moved, modified
or deleted.
- The user can save an unlimited number of process flow, equipment and
materials
- A project manager offer the possibility to save all the user hypotheses
(Wafer Fabunit, process flow, yields...) and to reuse them later.
- Integrated Equipment, Wafer & Materials databases
- Two calculation modes: dedicated and non-dedicated fab
- Up to five scenarios simulation allowing the user to compare yields
improvement, manufacturing location impact on cost...
- TSV CoSim+ is using ExcelTM interface in order to be widely exploitable
and upgraded. This tool will enable you to evaluate what is the cost per wafer
level for manufacturing TSV using your own inputs or using pre-defined
parameters.
The use of TSV CoSim+ :
- Understanding of the cost structure
- Competitive analysis
- Cost evaluation for different technological options
- Identification of the cost pain points in your process
- Definition of a business model (fables, fablight, manufacturing...)
“TSV CoSim+, TSV Manufacturing Cost Simulation Tool” is not a
report but an Excel datasheet with various folders.
This CoO tool aims at evaluating the cost of ownership for your TSV scenario.
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