Abstract
MARKET TRENDS
The continuation of Moore' s law by conventional CMOS scaling is becoming more
and more challenging, requiring huge capital investments. 3D Packaging with 3D
TSV interconnects provides another path towards the "More than Moore", with
relatively smaller capital investments. Despite the impact of the economic
downturn, 3D integration investments are strategic innovations and have
continued. We have identified as of today more than 15 different 300mm 3-D IC
pilot lines running or currently being installed world-wide (within R&D
centers, at packaging houses, CMOS foundries or within IDM fabs). This year,
several initiatives of key industry leaders happened such as STMicro for 3D
integration in MEMS and CMOS image sensors, Elpida for stacked DRAM memories
and Sony with the introduction of Backside illuminated (BSI) technology into
its camera sensor products portfolio.
Strong dynamics in MEMS, CMOS image sensors, memory, analog and logic
industries continue and will drive adoption of 3D TSVs to high volumes within
the next decade. Additionally, new applications such as HB-LED silicon
modules, Solar and Power components are also on the point to catch the 3D TSV
trend and to benefit from this disruptive interconnect technology!
BUT CHALLENGES ARE STILL AHEAD
3D infrastructure & supply chain is the biggest immediate issue we have
identified for the broad adoption of 3D ICs. As many scenarios are possible
for the implementation of 3D TSV interconnects (via first / via middle / via
last / via After bording), a big question at the moment is WHO will take the
risk to invest and will have the ownership of the realization of the different
3D TSV process steps (to be implemented in front-end, mid-end, back-end...)?
As a result, we have decided to release this year one new report called "3D
TSV Technologies & Scenarios: Via First or Via Last?". The analysis is
focusing on the deeper understanding of the rationale behind these strategic
technology choices to be made. It puts into perspective who is doing what at
the moment, what alliances are forming at the horizon, which technology
choices have already been made and for which applications?
I/O standardization between interfaces such as memory to digital layers is
also a serious issue that needs to be fixed rapidly. Indeed, 3D integration of
memory + logic ICs together is perceived as the next big wave for volume
adoption of 3D TSV in the near future. Multiple applications are targeted,
including CPU, GPU, DSP, FPGA, ASICS and Basebands ICs that will be used in
future cell phones, super-computers, network / storage systems, notebooks,
automotive and medical processing units among others. Thermal management and
reliability could also reduce 3D ICs application space in the longer run.
However, different solutions are currently underway in response to this
possible challenge.
MORE SILICON VALUE IS MOVING TO THE PACKAGE
A recent trend more and more these days are 3D interposers. Based on silicon
or glass, 3D interposers are next generation substrate technology which aims
at replacing traditional PCB laminate or ceramic technologies for the sake of
extreme miniaturization and performance. This type of "intermediate 3D" is
perceived as a "bridge" platform between today' s 2D and future genuine 3D that
will start beyond 2012-2013. Specific features like the integration of mature
logic and analog functions such as IPD (integrated passive devices) will be
key components in the effective commercialization of 3D interposers in the
short term.
3D integration opens up a possible supply chain value change to all players as
more and more value is now moving to the package in general. IDMs, Fab-less
players, wafer foundries, packaging houses, MEMS players, substrate and PCB
suppliers are all poised to take on more value in this new era if they all
prepare for the investments it requires.
It is also astonishing to notice the rapid evolution of 3D thinking within the
IC community: two years ago, the big unceasing question was "Why 3D?". Today,
moving forward with the concrete implementation of the technology, questions
are now "When 3D?" and "How 3D?". It is terrific to realize that in less than
one decade from now, looking back at what has happened, we will be wondering
"Why 2D?"
KEY FEATURES OF THE REPORTS
- Revamped market forecasts & technology roadmaps for 3D IC components:
- Impact of the economic downturn on the 3D TSV market
- Market forecast update for MEMS, CMOS image sensors, logic, analog and
memory applications
- New application areas covered: HB-LED modules, power and solar components
- Business case for 3D interposers: applications, market and players
- 3D IC players 2008 market shares & revenues breakdown in $M (as packaging
services or estimated in relative packaging value)
- Supply chain perspectives, key players and emerging infrastructure for 3D
Packaging
- Strategic technology choices for 3D integration scenarios:
- Analysis of the different possibility for the implementation of TSVs and
the rationale behind (via first / via middle / via last / via after bonding)
- Analysis of the cost structure for different implementation cases (vias
in front-end, vias at packaging assembly house, C2W versus W2W, ...)
WHO SHOULD BUY THIS REPORTS?
- Integrated semiconductor Device Manufacturers and fabless semiconductor
companies
- Benchmark the status of 3D integration within the industry
- Identify possible partnership for your forthcoming developments and find
second source packaging subcontractors for your 3D TSV components
- Assembly and Test Service companies
- Get the list of the main 3D IC players and users
- Screen possible new 3D integration applications to support
diversification strategy
- Equipment and Material suppliers
- Understand the differentiated value of your products and technologies in
this market
- Identify new business opportunities and prospects
- Electronic module makers and Original Equipment Manufacturers
- Evaluate the availability and benefits of using 3D components in your
end system
- Monitor different 3D component suppliers to adjust your sourcing strategy
- PCB / IC substrate manufacturers
- Monitor the evolution of IC Packaging & Assembly, especially linked to
the emerging
- 3D TSV interposers, IPD and chip embedding PCB-based technologies
- IC and MEMS Foundries
- Spot new opportunities & define diversification strategies by reusing
your infrastructure
- and expertise within the 3D Packaging market
Table of Contents
3D IC & TSV INTERCONNECTS:
Business update - 2009 report
- Scope of the report & definitions
- Executive Summary
- Revamped market analysis
- By application (MEMS, CMOS image sensors, logic, analog and memory)
- 2008-2015 forecast in Unit and in Wafer size equivalent
- Technology roadmaps
- Overall roadmap and by application (MEMS, CMOS image sensors, logic,
analog and memory)
- Case for 3D interposers and IPD (glass or silicon interposers)
- Challenges for 3D integration
- Supply chain
- I/O interface standardization
- Thermal management
- Supply chain & worldwide 3D integration activity
- Players & geographic locations
- 3D IC players 2008 market revenues, market shares and projections
- Conclusion
3D TSV TECHNOLOGIES & SCENARIOS:
Via first or Via last? - 2009 report
- Scope of the report & definitions
- Executive Summary
- 3D integration possible scenarios.
- Via first scenarios - C2W versus W2W
- Via middle scenarios - Case for Silicon interposer
- Via last scenarios
- Via after bonding scenarios
- Supply chain & Player investments identified
- Geographic overview
- Who is doing what?
- Identified alliances & partnerships
- Cost analysis for different scenarios
- Vias in the front-end environment
- Vias at the packaging & assembly house
- What is the best strategy?
- In terms of application
- In terms of players / supply chain
- In terms of cost
- In terms of process flow / technical developpement
- Conclusion
COMPANIES CITED INTHE REPORT:
3D-Plus, 3M, Ablestik, Accretech, All-via, Altera, Ajisso, Alchimer, AMD, Alps
Electric, Amkor, Anteryon, Applied Materials, ASML, ASE, Aviza, ASET, ASM
International, Atotech, Avago technologies, Ayumi Industries, AZ Electronics,
Beamind, Brewer Science, Chartered Semiconductor, Dalsa Semiconductor,
Datacon, Disco, Dongbu Hitek, Dow Corning, DuPont Electronics, Dynatex, E2V,
Ebara, Elpida memories, EM Microelectronics, Enthone, ETRI, EVGroup,
Fraunhofer IZM, Fraunhofer ISIT, Komatsu, Freescale, Fujikura, Fujitsu,
Fujimi, Gemalto, Heptagon, Hua Hong NEC, Hitachi, Hymite, Hynix Semiconductor,
Ibiden, IBM, IMEC, IMT, Infineon, Intel, ITRI, JCAP, LAM Research, Leti,
Lintec, Matsushita Electric Works, MagnaChip, Micron, MicroResist, MicroChem,
Mitsui, Nanya, NEC Electronics, NEC Schott JV, Nemotek, Nexx, Nextreme, Nitto
Denko, Nokia, Numonyx, NXP, Oki Electric, OMG Ultra Pure Chemicals, Panasonic,
Philips Applied Technologies, Plan Optik, Process Partner International,
Promerus, PVA Tepla, Qualcomm, Qimonda, R3Logic, Renesas, Rensselaer
Polytechnic Institute, Samsung, Sanyo, Sanyu-REC, Schott, Semitool, SensoNor,
Sharp, Silex Microsystems, Sekisui, Sematech, Shinko Electric, Sony, SPIL,
StatsChipPac, ST-Ericsson, STMicroelectronics, STS, SMIC, Shin-Etsu, Skyworks,
Solvision, SUSS MicroTec, Synova, Tegal, Tessera, Texas Instruments, TSMC,
Tezzaron, Toshiba, Tokyo Electron, Tohoku University, TOK, TSMC, UMC, UTAC,
VTI Technologies, VTT Technology, Vertical Circuits, Xintec, Xsil, Xilinx,
Ziptronix, ZyCube and more...
