Abstract
OBJECTIVES OF THE REPORT
The market is a high-growth field in the semiconductor industry. The supply
chain is filled with various players from LED die manufacturers (Epistar,
Forepi,...), to LED assembly suppliers (Harvatek, Citizen, Liteon,
Samsung,....) to fully integrated players (Lumileds, Osram, Toyoda Gosei...)
In the wide range of LED packaging solutions, this report describes the
existing packaging process flow, materials and equipment and the main
evolution in the coming years.
LED devices have been split in 2 categories:
Regular LED High Brightness, Ultra High Brightness LED
The main processes are presented for both groups:
- Dicing
- Die bonding
- Electrical interconnect
- Thermal management
- Encapsulation
The report highlights the main technical challenges, current solutions and
future trends.
This report also includes market analysis on equipment, materials and services.
MAIN CHALLENGES
For the 2 types of LED, assembly approach is not the same.
- Regular LED packaging process flow is based on standard IC process and
almost the same standard material. The main reason is cost because regular LED
are low cost products (< $0.10)
- As a future lighting source, HB/UHB LED packaging should have good optical
properties, high thermal dissipation and high reliability. The better product
is a right combination between optical, thermal and reliability.
It is possible today to make that perfect product, but the cost would be so
high that it will not be successful. A choice has to be made for each
application: for example, optical efficiency for LCD backlighting and thermal
management for automotive lighting.
Today LED packaging has a law:
ONE PROCESS, ONE PRODUCT, ONE APPLICATION
Unlike regular LED, no standards currently exist for packaging of HB-LED. Each
LED vendor has their own proprietary design for most aspects of the assembly
process flow.
Cost is the primary driver and cheaper solutions with the best optical or
thermal properties are under investigation. Main goals are the reduction of
the number parts, use of less expensive material,..... A major issue today is
that the LED manufacturing process is made on 2 or 3 inches wafers that create
handling issues on equipment. We believe that the move to 4 then 6 or 8 inch
wafers will allow more standardized solutions using regular processes and
equipment.
In particular there is a big trend for Wafer Level Packaging of silicon LED
modules which aims at pushing LED to the general lighting market.
KEY FEATURES OF THE REPORT
- Detailed process flow of LED packaging (dicing step, electrical
interconnect, substrates,....)
- Market trends and figures for linked material and equipment (in million $,
in number of units, ASP,.....)
- Key drivers for each technology & material in use
- Supply chain analysis: who is doing what?
COMPANY INDEX
3M, ACC silicones, Accretech, ADT, AiT, Allvia, ALSI, ALSI, Applied NanoWorks,
ASMPT, Asymtek, Avago, Bergquist, Bosch, CeramTec, ChipMOS, C-Mac, CMD, Cofan,
PCB, Cookson, CREE, CTS, Daltec, Datacon, Disco, Doosan, Dow Corning, Dupont,
Dynatex, Electrovac curamik, Epcos, Epoxy Technology, EVG, Evident
Technologies, Friatec, GE, Hamamatsu, Heatron, Heraeus, Hesse & Knipps,
Hymite, Hysol, Indium Corp., Intematix, ipdia, Jenoptik, JPSA, KNS, Kulicke &
Soffa, Kyocera, LG Innotek, Lintec, Lord, Lumi Tech, Lumileds, Master Bond,
Micron, Murata, Natel, New Wave Research, Nitto-Denko, NTK, Nusil, Oerlikon,
Optek, Osram, Oxford lasers, Palomar Technology, Panasonic, PhosphorTech,
Rexpan, Semitool, Shin Etsu, Shinko, SMM, Spectrum Plastics, STM, SUSS
MicroTec, Synova, TDK, TEL, Thermagon, Ticona, TMT, Tong Hsing, Toshiba,
Toyoda Gosei, Tridonic, Trumpf, TSMC, Veeco, VisEra, Xsil, Zevac.
Table of Contents
Content
Introduction
Executive summary
Acronyms & definitions
LED market status
- Market segmentation
- Market Volume
- Market Revenue
- General Lighting
- GaN-based White LEDs
- Wafer Needs for General Lighting
LED Performance
- Lumens. Depending on Applications
- Internal Quantum Efficiency
- Evolution Under High Current
- Output Heat
- Overall Performances
- Expected Performances for White LED
LED Packaging Status
- Introduction
- Package families
- Assembly Process Flow
- Definitions
- Description
- System Integration
- Challenges
- Value Chain
- Evolution
- Trends
- Technology Roadmap
Packaging of Regular LED
- Flow Chart for Regular LED
- Main steps and materials
- Standard Assembly Flow
- Through Hole Devices
- Surface Mount Devices
- Market Metrics - Packaged LED Market Volume
- DICING
- Location of Dicing Process
- Saw Dicing
- Laser Dicing
- Saw VS Laser
- Supply Chain
- Market Volume for Sapphire Wafers
- Market Revenue for Dicing Services
- Market of equipments in number of units
- Market in $M
- DIE BONDING
- Location of the process
- The Basics
- Dispensing equipment from Asymtek
- Material for LED
- Main players
- Market Volume for Die Attach Material
- Market Revenue for Die Attach Material
- Market of equipments in number of units
- Market of equipments in $M
- INTERCONNECT
- Location of the process
- Overview of wire bonding
- Electrical connection : the basics
- Wire Bonding Processes
- Ball bonding VS Wedge bonding
- Ribbon bond VS wire bond
- Main players
- Market revenue - Assumptions
- Market revenue for gold wire bonding
- ENCAPSULATION, LENS & PHOSPHOR
- Location of the process
- Encapsulation method for LED lamp
- Casting process for encapsulation
- Encapsulation for SMD
- Compression molding process
- Materials for encapsulation
- Market estimation of molding compound
- How does LED generate white light?
- Phosphor chemistry
- Phosphor placement in white LED
- Main phosphor technologies in use
- Main phosphor suppliers
- Optics
- Main players
- Market revenue for phosphor material
- CONCLUSIONS
PACKAGING OF HB/UBH LED
- Introduction
- What package for what LED?
- Package type
- Evolution of the packaging
- Impact of the heat
- HB/UHB LED packaging function
- Different levels of packaging
- Considerations of HB LED design
- Materials challenges and solutions
- Market Metrics - Packaged LED Market Volume
- SCRIBING AND DICING
- Location of the process
- Scribing & Dicing: Definition
- Techniques, Throughputs and Costs
- Number of dice / wafer
- Laser Scribing & Dicing
- Diamond Scribing & Dicing
- Example of JPSA Scribing & Dicing tool
- Example of NWR Scribing & Dicing tool
- Laser Microjet Technology from Synova
- Example of Synova Scribing & Dicing tool
- Example of Oxford Lasers Scribing & Dicing tool
- Example of ALSI Lasers Dicing tool
- Stealth Dicing Technology
- Stealth Dicing Roadmap
- Example of Stealth Laser Dicing tool
- Example of Jenoptik-Votan dicing tool
- Market Data - Assumptions
- Laser vs saw
- Market Revenue for HB/UHB LEDs
- Market of equipment in number of units
- Market revenue of equipments in $M
- DIE BONDING
- Location of the process
- Choosing die attach material
- New material for HB/UHB LED - AuSn
- AuSn - Strength and weakness of deposition methods
- Summary
- Market Volume for Die Attach Material
- Market Revenue for Die Attach Material
- Market in number of die bonding equipment
- Die bonding equipment - market in $M
- INTERCONNECT
- Location of the process
- What' s new?
- Evolution in wirebonding
- Matrix LED - features
- Flip Chip Technology
- Wirebond VS Flip Chip
- Flip-chip coupled with back-face contact reflector
- Stud Bumping
- Example of Lumileds Luxeon K2
- Laser Lift-Off (LLO) & Flip-Chip
- Laser Lift Off Technique: definition
- Laser Lift Off Technique: OSRAM
- LLO equipment
- LLO technique & Flip-chip mounting
- TEMPORARY BONDING
- introduction
- Thin-wafer handling: different solutions
- principle
- Main methods: a comparison
- wax
- adhesive tapes
- EVG temporary bonding tools
- THERMAL MANAGEMENT
- Location of the process
- Thermal Solutions
- Thermal solutions - Managing the LED Thermal System Configuration
- Substrates
- Substrates - SMD organic
- Substrates - Metal Core Printed Circuit Board
- Substrates - FR4 Board & Flexible Substrate
- Substrates - Ceramic Substrates
- Substrates - Direct Bonded Copper
- Substrates - Trends for DBC
- Substrates - Summary
- Substrates - Trends : Chip On Board
- Substrates - Main Players
- Substrates - Market Data
- Substrates - Market Volumes
- Substrates - Market Revenue
- HB LED submount - Market Breakdown
- HB LED submount - Supply Chain
- Thermal Interface Material
- Thermal Interface Material - Main Players
- Heatsink
- Heatsink - Main Players
- Summary - LED Package with optimized heat transfer
- ENCAPSULATION, LENS & PHOSPHOR
- Location of the process
- Optical extraction techniques
- Remote phosphor
- Silicon Product - Shin Etsu
- WAFER LEVEL PACKAGING
- Main challenges for Power LED WLSP
- Market drivers - Power LED Packaging
- Power LED Packaging Manufacturer Motivations & Segmentation
- 3D-TSV developments for Power LEDs
- Overview of power LED packaging types
- Drivers for LED silicon packaging solutions
- Supply chain focus on ESD protection using Si submounts for HB LEDs
- Hymite: Silicon HB-LED packages
- Silicon interposer for MEMS / LED Applications
- 3-D interposer to combine MOSFET + ASIC LED driver
- WLP : VisEra technologies
- Estimation of 6" Silicon wafer demand for LED submount and WLP
- Conclusion & challenges
