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市場調查報告書

IoT工程師的迴響:調查資料集與分析

Voice of the IoT Engineer 2016: Survey Dataset and Analysis

出版商 VDC Research Group, Inc. 商品編碼 355891
出版日期 內容資訊 英文 27 Pages; 205 Exhibits
商品交期: 最快1-2個工作天內
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IoT工程師的迴響:調查資料集與分析 Voice of the IoT Engineer 2016: Survey Dataset and Analysis
出版日期: 2016年12月31日 內容資訊: 英文 27 Pages; 205 Exhibits
簡介

本報告以IoT、嵌入工程師,管理者,決策者的年度調查結果為基礎,提供設備的開發,技術引進趨勢,供應商的評級,對IoT的策略等,主要趨勢相關驗證之系統性資訊。

目錄

  • 調查概要
  • 摘要整理
  • 調查人口統計和概要
  • IoT引進趨勢
  • 運用系統趨勢
  • 編程語言趨勢
  • 工具趨勢
  • 全球市場的想法與考察
  • 關於VDC Research

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目錄

This report analyzes key trends that we derive from our annual survey of IoT and embedded engineers, managers, and decision-makers. We address major themes such as device development, technology adoption trends, vendor ratings, strategies for addressing the IoT, and more. The analysis provides data segmentations by all major industry and technology communities of interest, including target vertical market, geography, processor architecture, embedded operating system, and programming language. We include the full set of over 180 survey exhibits with associated segmentations.

What questions are addressed?

  • What is the current state of IoT adoption in the embedded market? What benefits are engineers realizing from integrating IoT capabilities into their organization's products?
  • How do the separate units within engineering organizations (engineers, technical managers, business managers) view the challenges and opportunities of the IoT?
  • What are the most popular types of hardware architecture, operating systems, programming languages, and tools? What are the most important criteria when adopting these technologies and selecting vendors?
  • What is the overall state of the global IoT & embedded market? What are the most important trends to look for over the next five years?

TABLE OF CONTENTS

  • Inside This Report
  • Executive Summary
  • Survey Demographics & Overview
  • IoT Adoption Trends
  • Operating System Trends
  • Programming Language Trends
  • Tooling Trends
  • Global Market Ideas & Insights
  • About VDC Research

LIST OF I2 REPORT EXHIBITS

  • Exhibit 1: Type of Organization Employing Respondent
  • Exhibit 2: Respondent's Primary Role Within Organization
  • Exhibit 3: Location of Respondent's Organization, by Geographical Region
  • Exhibit 4: Primary Processor Family/Architecture in Current Project
  • Exhibit 5: Bit-width of Architecture Used by Primary Processor in Current Project
  • Exhibit 6: Deployment of IoT Capabilities into Organization's Products/Applications
  • Exhibit 7: Deployment of IoT Capabilities into Organization's Products/Applications, by Primary Processor Architecture
  • Exhibit 8: Reason for Not Considering IoT Capabilities and Applications in Organization's Products
  • Exhibit 9: Potential Business Benefits of IoT Integration for Respondent's Organization
  • Exhibit 10: Largest Overall Challenge for Respondent's Organization in Developing IoT Solutions, by Respondent Role
  • Exhibit 11: Primary OS Used on Current Project and Expected to Be Used on a Similar Project in Three Years, by OS Source
  • Exhibit 12: Expected Source of Primary Operating System in Three Years, by Primary Processor Architecture
  • Exhibit 13: Likelihood of Using Same Operating System on Similar Project in Three Years, by OS Source
  • Exhibit 14: Most Important Characteristic When Selecting Primary Operating Systems
  • Exhibit 15: Languages Used to Develop Software in Previous, Current, and Next Projects
  • Exhibit 16: Programming Languages Used in Current Project, Segmented by Primary Processor Bit Count
  • Exhibit 17: Programming Languages Used in Current Project, Segmented by IoT-Capability
  • Exhibit 18: Types of Tools Used on Current Project, by IoT-Capability
  • Exhibit 19: Integrated Development Environment (IDE) Use on Current Project, by Vertical Market
  • Exhibit 20: Total Tool Budget on Current Project, by Safety-Critical Certification Requirements
  • Exhibit 21: Portion of Time Spent on Project Stages, by Project Schedule Adherence

LIST OF EXCEL EXHIBITS

  • Exhibit 1: Types of products currently in development or production
  • Exhibit 2: Products purchased by respondent's organization
  • Exhibit 3: Country where headquarters are located
  • Exhibit 4: Region where headquarters are located
  • Exhibit 5: Industry/Vertical market
  • Exhibit 6: Type of aerospace & defense product
  • Exhibit 7: Type of automotive In-vehicle product
  • Exhibit 8: Type of communications & networking product
  • Exhibit 9: Type of consumer electronics product
  • Exhibit 10: Type of digital security product
  • Exhibit 11: Type of digital signage product
  • Exhibit 12: Type of energy & utilities product
  • Exhibit 13: Type of gaming product
  • Exhibit 14: Type of industrial automation product
  • Exhibit 15: Type of medical product
  • Exhibit 16: Type of mobile phone product
  • Exhibit 17: Type of office/business automation product
  • Exhibit 18: Type of transportation product
  • Exhibit 19: Type of retail automation product
  • Exhibit 20: Current project a new design or revision to existing design
  • Exhibit 21: Capabilities or features included in current project
  • Exhibit 22: Capabilities or features expected for similar project in three years
  • Exhibit 23: Implementation of Software-defined networking (SDN) and/or network function virtualization (NFV) on current project
  • Exhibit 24: Expected use of Software-defined networking (SDN) and/or network function virtualization (NFV) on similar project in three years
  • Exhibit 25: Inclusion of safety-critical regulatory requirements on current project (i.e. ARINC 653, DO-178B, ISO 26262)
  • Exhibit 26: Certification or approval standards required in current project
  • Exhibit 27: Estimate of total project length in calendar months (actual time from initial specification to shipment)
  • Exhibit 28: Estimate of total years for which current product will be manufactured once initial development is complete
  • Exhibit 29: Estimate of product's average years of useful life once deployed in field by end customer
  • Exhibit 30: Adherence to schedule on current project
  • Exhibit 31: Adherence to current schedule with respect to previous project schedule
  • Exhibit 33: Engineering tasks in which the respondent is personally involved for the current project
  • Exhibit 34: Portion of time spent on engineering tasks in which the respondent is personally involved for the current project
  • Exhibit 35: Portion of time spent on project stages
  • Exhibit 36: Estimated number of full-time engineers working on current project
  • Exhibit 37: Estimated distribution of full-time engineers working on current project
  • Exhibit 38: Estimated number of full-time engineers employed by respondent's organization
  • Exhibit 39: Estimated distribution of full-time engineers employed by respondent's organization
  • Exhibit 40: Estimated total cost of development for the current project
  • Exhibit 41: Estimated bill of material (BOM) for the current project
  • Exhibit 42: Estimated per-unit sales price for the current project
  • Exhibit 43: Estimated number of units to be shipped for the current project
  • Exhibit 44: Estimated distribution of development costs on the current project
  • Exhibit 45: Estimated portion of software development costs associated with licensing commercial software on current project
  • Exhibit 46: Estimate of the fully-loaded labor cost (including salary, benefits, overhead, etc.) for a typical embedded engineer at respondent's location
  • Exhibit 47: Estimated total number of defects or software patches reported/required per year once product is deployed in field
  • Exhibit 48: Estimated combined IT and engineering time (man-hours) required for each patch or defect remediation
  • Exhibit 49: Estimated portion of devices that will become inoperable and require repair or replacement per year once product is deployed in field
  • Exhibit 50: Types of computer system components or sub-systems purchased by respondent's organization
  • Exhibit 51: Types of processors used on current project
  • Exhibit 52: Types of processors expected to be used for similar system in three years
  • Exhibit 53: Primary/application processor used on current project
  • Exhibit 54: Primary processor family/architecture
  • Exhibit 55: Processor families/architectures considered and used for similar projects
  • Exhibit 56: Bit-width of architecture used by primary processor in current project
  • Exhibit 57: Most important characteristics when selecting embedded processors
  • Exhibit 58: CPU/MPU suppliers currently used
  • Exhibit 59: MCU suppliers currently used
  • Exhibit 60: SoC suppliers currently used
  • Exhibit 61: ASSP suppliers currently used
  • Exhibit 62: FPGA suppliers currently used
  • Exhibit 63: Satisfaction with embedded processor suppliers that respondent has purchased from (1 = Exceptionally Poor; 7 = Extremely Satisfied)
  • Exhibit 64: Most important product selection criteria (excluding cost) when purchasing/specifying CPU boards, blades and/or modules
  • Exhibit 65: Architectures or form factors of boards/modules used in current project
  • Exhibit 66: Architectures or form factors of boards/modules expected to be used for a similar project in three years
  • Exhibit 67: VME architectures currently used in organization
  • Exhibit 68: VME architectures expected to be used in organization in three years
  • Exhibit 69: CompactPCI architectures currently used in organization
  • Exhibit 70: CompactPCI architectures expected to be used in organization in three years
  • Exhibit 71: Embedded board vendors currently used
  • Exhibit 72: Most important product selection criteria (excluding cost) when purchasing/specifying embedded computing and/or storage systems
  • Exhibit 73: Architectures or form factors used in embedded computing systems purchased by respondent's organization
  • Exhibit 74: Architectures or form factors in embedded computing systems expected to be purchased by respondent's organization in three years
  • Exhibit 75: VME architectures currently used in organization's embedded systems
  • Exhibit 76: VME architectures expected to be used in organization's embedded systems in three years
  • Exhibit 77: CompactPCI architectures currently used in organization's systems
  • Exhibit 78: CompactPCI architectures expected to be used in organization's systems in three years
  • Exhibit 79: Motherboard form factors currently used in organization's systems
  • Exhibit 80: Motherboard form factors expected to be used in organization's systems in three years
  • Exhibit 81: COM form factors currently used in organization's systems
  • Exhibit 82: COM form factors expected to be used in organization's systems in three years
  • Exhibit 83: Storage technologies currently used in or with organization's embedded systems
  • Exhibit 84: Storage technologies expected to be used in or with organization's embedded systems in three years
  • Exhibit 85: Embedded storage capacity currently required for use within organization's target systems
  • Exhibit 86: Embedded storage capacity expected to be required for use within organization's target systems in three years
  • Exhibit 87: Estimated portion of systems produced by respondent's organization with connectivity today
  • Exhibit 88: Estimated portion of systems produced by respondent's organization with connectivity in three years
  • Exhibit 89: Primary method for servicing deployed devices
  • Exhibit 90: Estimated portion of organization's products leveraging analytics today (on-device, in the cloud, or to any data generated by product)
  • Exhibit 91: Estimated portion of organization's products expected to leverage analytics in three years
  • Exhibit 92: Types of wired, optical, and/or wireless connections currently used in embedded systems/ services produced by organization
  • Exhibit 93: Types of wired, optical, and/or wireless connections expected to be used in embedded systems/services produced by organization in three years
  • Exhibit 94: Types of low-powered wide-area-networks (LPWAN) currently used in embedded systems/ services produced by organization
  • Exhibit 95: Types of low-powered wide-area-networks (LPWAN) expected to be used in embedded systems/services produced by organization in three years
  • Exhibit 96: Estimated amount of data generated by organization's products on average each day per device
  • Exhibit 97: Estimated amount of data generated by organization's products on average each day per device in three years
  • Exhibit 98: Estimated frequency of data transmission to external sources (enterprise services, private/ public clouds, the Internet, etc.)
  • Exhibit 99: Estimated frequency of data transmission to external sources (enterprise services, private/ public clouds, the Internet, etc.) in three years
  • Exhibit 10: IoT middleware frameworks/platforms used in current project
  • Exhibit 101: IoT protocols used in current project
  • Exhibit 102: IoT cloud platforms used on current project
  • Exhibit 103: IoT cloud platforms expected to be used in three years
  • Exhibit 104: IoT application development & deployment platform used on current project
  • Exhibit 105: IoT application development & deployment platform expected to be used in three years
  • Exhibit 106: Advanced performance analytics used in current project
  • Exhibit 107: IoT platform cloud services used on current project
  • Exhibit 108: IoT platform cloud services expected to be used in three years
  • Exhibit 109: Source of primary operating system used on previous project
  • Exhibit 110: Source of primary operating system used on current project
  • Exhibit 111: Expected source of primary operating system in three years
  • Exhibit 112: Commercially obtained, NON open source OS used on current project
  • Exhibit 113: Commercially or consortia obtained, open source OS used on current project
  • Exhibit 114: Freely and/or publicly available, open source OS used on current project
  • Exhibit 115: Chip/board vendor-supplied OS used on current project
  • Exhibit 116: Most important characteristics when selecting primary operating system
  • Exhibit 117: Likelihood of using same operating system on similar project in three years
  • Exhibit 118: Use of secondary/additional operating systems on current project
  • Exhibit 119: Software stack components required on current project (aside from operating system)
  • Exhibit 120: Importance of security on current project
  • Exhibit 121: Reason security is not important for current project
  • Exhibit 122: Have any security vulnerabilities or failures within organization's products been exposed or Identified
  • Exhibit 123: Were any vulnerabilities disclosed to customers
  • Exhibit 124: Results of security vulnerabilities
  • Exhibit 125: Could a sofware patch fix identified issues
  • Exhibit 126: Implications of security vulnerabilities
  • Exhibit 127: Commercial security vendors used on current project
  • Exhibit 128: Embedded security software used on current project
  • Exhibit 129: Embedded security hardware used on current project
  • Exhibit 130: Primary host development environment used on current project
  • Exhibit 131: Primary host development environment expected to be used on similar project in three years
  • Exhibit 132: Types of tools used on current project
  • Exhibit 133: Use of integrated development environment (IDE) on current project
  • Exhibit 134: Most important characteristics when selecting IDE used on current project
  • Exhibit 135: Most important characteristics when selecting compiler used on current project
  • Exhibit 136: Most important characteristics when selecting supplier of compiler used on current project
  • Exhibit 137: Most common issues when using compilers
  • Exhibit 138: Biggest Issues when Adopting New Compiler
  • Exhibit 139: Types of compiler purchased by respondent's organization
  • Exhibit 140: Compilation tools currently used
  • Exhibit 141: Satisfaction with compilation tool suppliers respondent has purchased from (1 = Exceptionally Poor; 7 = Extremely Satisfied)
  • Exhibit 142: Approximate cost of all compilation tools used on current project
  • Exhibit 143: Source of prototyping board used on current project
  • Exhibit 144: ASIC gate count of current prototype
  • Exhibit 145: Number of FPGAs used on current prototype
  • Exhibit 146: FPGA vendors used for prototype hardware on current project
  • Exhibit 147: Challenges of FPGA-based prototyping (1 = Not Challenging At All; 7 = Extremely Challenging)
  • Exhibit 148: Type of prototyping solution used on current project
  • Exhibit 149: FPGA-based/pysical prototyping vendors used on current project
  • Exhibit 150: Tasks for which respondent uses virtual prototyping
  • Exhibit 151: Virtual prototyping vendors used on current project
  • Exhibit 152: Most important factors when selecting current virtual prototyping platfom
  • Exhibit 153: Team responsible for virtual prototype creation within organization
  • Exhibit 154: Approximate budget for all tools used on current project
  • Exhibit 155: Languages used on previous project
  • Exhibit 156: Languages used on current project
  • Exhibit 157: Languages expected to be used on similar project in three years
  • Exhibit 158: Estimated total source lines of code (SLOC) on current project
  • Exhibit 159: Expected change in source lines of code (SLOC) on next project
  • Exhibit 160: Code reuse in current project
  • Exhibit 161: Deployment of IoT capabilities and/or applications into organization's products
  • Exhibit 162: Primary factor driving respondent's organization to utilitize/deploy IoT capabilities
  • Exhibit 163: Opinions on the implications of IoT technology and applications
  • Exhibit 164: IoT will allow respondent's organization to..
  • Exhibit 165: Largest overall challenge for respondent's organization in developing IoT solutions
  • Exhibit 166: Most important factors when selecting suppliers of IoT components and solutions
  • Exhibit 167: Reason for not considering IoT capabilities and applications
  • Exhibit 168: Use/enablement/deployment of embedded cloud services in organization's products
  • Exhibit 169: Most common type of cloud service using/planned to use to support customers
  • Exhibit 170: Most challenging aspects of introducing embedded cloud services
  • Exhibit 171: Main reason for not developing embedded cloud services
  • Exhibit 172: Purchase/use and creation/integration of IoT gateways
  • Exhibit 173: Future plans to purchase/integrate IoT gateways: In-house
  • Exhibit 174: Future plans to purchase/integrate IoT gateways: In and/or with products
  • Exhibit 175: Are escalating data requirements driving respondent's organization towards turnkey IoT gateway solutions
  • Exhibit 176: Expected number of endpoints/devices that will be supported by the IoT gateways purchased/used/integrated by respondent's company
  • Exhibit 177: Most important requirements when selecting embedded connectivity products for IoT gateways purchased/used/integrated by respondent's company
  • Exhibit 178: Most attractive application services deployed through IoT gateways
  • Exhibit 179: Expected source of IoT gateways for internal use and/or integration
  • Exhibit 180: Respondent's primary role within organization
  • Exhibit 181: Organization's primary function
  • Exhibit 182: Influence by source of information on embedded management/strategy decisions
  • Exhibit 183: Importance of type of information when making embedded management/strategy decisions
  • Exhibit 184: Approximate number of organization's employees across all offices, sites, and locations
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