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市場調查報告書

嵌入式主機板、集積化系統,及系統整合服務的全球市場

The Global Markets for Embedded Boards, Integrated Systems and Systems Integration Services: Growing Opportunities (and Competition) Among Embedded Technology Providers and Form Factors

出版商 VDC Research Group, Inc. 商品編碼 348319
出版日期 內容資訊 英文 29 Pages/21 Exhibits with study + 112 Exhibits with End-User Survey
商品交期: 最快1-2個工作天內
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嵌入式主機板、集積化系統,及系統整合服務的全球市場 The Global Markets for Embedded Boards, Integrated Systems and Systems Integration Services: Growing Opportunities (and Competition) Among Embedded Technology Providers and Form Factors
出版日期: 2015年06月02日 內容資訊: 英文 29 Pages/21 Exhibits with study + 112 Exhibits with End-User Survey
簡介

更高性能的運算資源,柔軟的連接性,低耗電量,以及小型化相關的新要求,促進各種嵌入式硬體設備產品市場整體的擴大。以及開發期間的縮短和對成本壓力的專門性的支援服務的需求劇增。

本報告提供供應商品化的嵌入式電腦主機板、嵌入式集積化電腦系統 (EICS) ,還有EICS供應商提供的IoT和嵌入式系統引進的系統整合服務、其世界市場趨勢與市場競爭情形詳細驗證。

第1章 摘要整理

  • 重要的調查結果

第2章 全球市場概要

  • 嵌入式主機板、集積化系統,及系統整合服務全球市場的出貨收益
  • 最近的市場發展
    • 參考文件主機板和許多廠商製麵板激增
    • 最近的企業收購重視軟體,連接性,及企業的整合
  • 市場競爭情形

第3章 市場競爭情形

  • 各主要供應商分類的桌上型等級的主機板全球出貨收益比例
  • 各主要供應商分類的各種ITX級的主機板全球出貨收益比例
  • 各主要供應商分類的嵌入級的主機板全球出貨收益比例
  • 各主要供應商分類的插槽單板電腦及CPU葉片全球出貨收益比例
  • 市場競爭情形概要
    • 各主要供應商分類的COM模組及商用COM電信業者全球出貨收益比例
    • 各主要供應商分類的嵌入式集積化電腦系統全球出貨收益比例
    • 各主要供應商分類的嵌入式系統整合服務全球出貨收益比例
    • 各主要供應商分類的COM模組及商用COM電信業者全球出貨收益比例
  • 供應商預測

第4章 終端用戶預測

  • 作為主機板選擇標準有重要意義的軟體開發的支援
    • 進行CPU主機板和葉片,以及模組等購買/規格決策時,成本之外最重要的選擇標準
    • 現行計劃的開發成本分佈預算
  • 隨著IT/雲端達成演進的嵌入式系統的儲存架構
    • 一般認為3年後使用嵌入式系統的儲存技術
  • 使用於許多目的的IoT/M2M資料
    • IoT/M2M帶給經營模式的最大影響
  • IoT/M2M解決方案開發的困難搖動各個垂直產業
    • 開發IoT/M2M解決方案時的最大課題
  • 隨著交換和其他要求事項變化的系統尺寸規格的選擇
    • 嵌入式計算系統的現在及3年後的計劃上使用的各種架構/尺寸規格

第5章 附錄:市場定義

第6章 關於VDC Research

目錄

Inside This Report

Emerging requirements for greater computing resources, flexible connectivity, lower power consumption, and smaller footprints is driving the collective markets for various embedded hardware products. Further, time-to-market and cost pressures are boosting demand for supporting professional services. This report examines market trends and the competitive landscapes for commercially available embedded computer boards, embedded integrated computer systems (EICS), and systems integration services as sold by EICS vendors for IoT and embedded deployments.

What questions are addressed?

  • How are vendors of embedded boards and integrated systems aligning their product roadmaps and offerings to take advantage of increasing product requirements resulting from the IoT?
  • Which embedded board form factors are expected to see the most market growth and/or competition over the next five years?
  • Who is leading the markets for embedded boards, integrated systems, and systems integration services?
  • How is the growth in use of open source “maker” board hardware impacting commercial market opportunities?
  • What are the most important product selection criteria when purchasing/specifying CPU boards, blades and/or modules?

Who should read this report?

This research program is written for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is intended for senior decision-makers who are developing embedded technology, including those in the following roles:

  • CEOs or other C-level executives
  • Corporate development and M&A teams
  • Marketing executives
  • Business development and sales leaders
  • Product development and product strategy leaders
  • Channel management and channel strategy leaders

Vendors Listed in this Report

  • AAEON Technology
  • ADLINK Technology
  • Advantech
  • Curtiss-Wright Controls
  • Dell
  • DFI
  • Diamond Systems
  • EMC Corporation
  • Eurotech
  • EVOC Group
  • Flex
  • Artesyn Embedded Technologies
  • Avalue Technology
  • Avnet
  • Fujitsu
  • GE Intelligent Platforms
  • General Dynamics C4 Systems
  • Hewlett Packard Enterprise
  • IBASE Technology
  • IBM
  • Axiomtek
  • BAE Systems
  • Cisco
  • Commell
  • IEI Technology
  • Kontron
  • MSC Vertreibs
  • National Instruments
  • Northrop Grumman
  • Oracle
  • Radisys
  • SECO
  • CompuLab
  • Congatec
  • Corvalent
  • Shenzen NORCO Intelligent Technology
  • Super Micro Computer
  • Tyan Computer
  • VersaLogic
  • VIA Technologies

Executive Summary

The competitive landscape for embedded boards, integrated systems, and systems integration services often spans and overlaps several computing form factors, regions, and industries between vendors. Embedded hardware suppliers are under constant time-to-market pressures to regularly launch new products featuring more integrated or supported features and the latest processor technologies. Doing so has led a number of embedded board and systems suppliers to adopt or transition to new and/or emerging form factors such as MicroATX, VPX, and xITX. As a result, the markets for different board form factors and integrated system architectures will see varying growth and strength of competition through the next five years and beyond. The global market for systems integration services will continue to see moderate growth aided by the growing percentage of services attributed to facilitating the development of connected IoT solutions.

Recent acquisitions and collaborations among embedded hardware leaders have focused on software development, industry application support, and broader connectivity. The potential acquisition of EMC by Dell could produce a new market share leader in the EICS space with a software portfolio to rival HP. HP, itself, has made some dramatic acquisitions in 2015 to augment its LAN offerings and accelerate end users' transition to hybrid cloud environments. Embedded hardware suppliers are being forced to adapt to facilitating development for more of the system/solution stack to remain competitive with new and traditional market players.

dKey Findings

  • The global market for embedded boards including motherboards and PC/104 family modules, SBCs and blades, COMs and carriers, and mezzanine cards and non-intelligent carriers totaled more than $XX in 2013 and is expected to grow to more than $XX in 2016.
  • Led by the communications and networking vertical, the global market for embedded integrated computer systems is expected to grow to more than $XX in 2016.
  • Consulting and integration services were the largest embedded systems integration service types in 2013 and together accounted for more than half of total market revenues.
  • The embedded processor landscape for boards and integrated system products will see more competition between architectures.
  • IoT-focused middleware/software and services are new offerings coming to market from traditional boards and systems suppliers seeking additional revenues and solution support.
  • Quality and reliability, board support package/drivers, and application software frameworks and libraries are the most important product selection criteria other than cost for embedded boards, blades, and/or modules.

X Commercial in Confidence.

About the Authors

Daniel Mandell supports a variety of syndicated market research programs and custom engagements in the IoT and Embedded Technology practices. He leads the research services for IoT gateways, embedded processors, and other computing hardware in addition to supporting programs such as embedded/real-time operating systems. Daniel also develops, programs, and manages end-user surveys to embedded engineers and uncovers useful and interesting insights regarding buyer behaviors, technology adoption, and device/application requirements. His working relationship with VDC dates back to 2005 and includes stints with Business Development as well as the AutoID practice. Daniel holds a B.S. in Information Systems Management from Bridgewater State University.

Chris Rommel is responsible for syndicated research and consulting engagements focused on development and deployment solutions for intelligent systems. He has helped a wide variety of clients respond to and capitalize on the leading trends impacting next-generation device markets, such as security, the Internet of Things, and M2M connectivity, as well as the growing need for system-level lifecycle management solutions. Chris has also led a range of proprietary consulting projects, including competitive analyses, strategic marketing initiative support, ecosystem development strategies, and vertical market opportunity assessments. Chris holds a B.A. in Business Economics and a B.A. in Public and Private Sector Organization from Brown University.

Table of Contents

Inside This Report

  • What questions are addressed?
  • Who should read this report?
  • Vendors Listed in this Report

Table of Contents

Executive Summary

  • Key Findings

Global Market Overview

  • Exhibit 1: Global Shipments of Embedded Boards, Integrated Systems, and Integration Services (Millions of Dollars)
  • Recent Developments
    • Reference and Maker Boards are Proliferating from Many Sources
    • Recent Acquisitions are Focused on Software, Connectivity, and Consolidation
  • Competitive Landscape

Competitive Landscape

  • Exhibit 2: Global Shipments of Desktop Class Motherboards, Segmented by Leading Vendor (Percentage of Revenue)
  • Exhibit 3: Global Shipments of xITX Class Motherboards, Segmented by Leading Vendor (Percentage of Revenue)
  • Exhibit 4: Global Shipments of Embedded Class Motherboards, Segmented by Leading Vendor (Percentage of Revenue)
  • Exhibit 5: Global Shipments of Slot Single Board Computers and CPU Blades (Segmented by Leading Vendor (Percentage of Revenue)
  • Competitive Landscape Overview
    • Exhibit 6: Global Shipments of COM Modules and Merchant COM Carriers, Segmented by Leading Vendor (Percentage of Revenue)
    • Exhibit 7: Global Shipments of Embedded Integrated Computer Systems, Segmented by Leading Vendor (Percentage of Revenue)
    • Exhibit 8: Global Shipments of Embedded Systems Integration Services, Segmented by Leading Vendor (Percentage of Revenue)
  • Vendor Insights

End User Insights

  • Supporting Software Development Critical to Board Selection Criteria
    • Exhibit 9: Most important product selection criteria other than cost when purchasing/specifying CPU boards, blades and/or modules (Percent of Respondents)
    • Exhibit 10: Estimated distribution of development costs on current project (Percent of Respondents)
  • Embedded Systems Storage Architectures Evolving with IT/Cloud
    • Exhibit 11: Storage technologies expected to be used in embedded systems three years from now (Percent of Respondents)
  • IoT/M2M Data Used for Many Purposes
    • Exhibit 12: Biggest impact of IoT/M2M on business models (Percent of Respondents)
  • Difficulties of Developing IoT/M2M Solutions Fluctuate by Vertical
    • Exhibit 13: Biggest overall challenge in developing IoT/M2M solutions (Percent of Respondents)
  • System Form Factor Use Changing with SWAP+Other Requirements
    • Exhibit 14: Architectures or form factors used in embedded computing systems in current project and expected to use three years from now (Percent of Respondents)

Appendix: Market Definitions

VDC Research

  • About the Authors
  • About VDC Research
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