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市場調查報告書

全球3DIC市場(微機電(MEMS)·感測器,RF SiP,光電·成像,記憶體,Logic,HB LED)-產業分析·市場規模·市場佔有率·成長與趨勢與預測

3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019

出版商 Transparency Market Research 商品編碼 294669
出版日期 內容資訊 英文 83 Pages
商品交期: 最快1-2個工作天內
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全球3DIC市場(微機電(MEMS)·感測器,RF SiP,光電·成像,記憶體,Logic,HB LED)-產業分析·市場規模·市場佔有率·成長與趨勢與預測 3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019
出版日期: 2014年01月15日 內容資訊: 英文 83 Pages
簡介

全球3D IC市場曾經因技術複雜加上知名度低而有段時期一直有此特徵。與該市場相關的產業,必需在技術進步與擴大生產量之間,取得效果性支出平衡。3D IC市場仍未受到世人充分的認識。普及到多元性最終用戶領域的進展主要仰賴於研究開發政策。在各個領域根據其使用的技術及選擇的用途,其成長模式也各不相同。

本報告提供全球3D IC市場現況與展望調查分析,市場估計實際成果及預測,市場推動與阻礙成長要素分析,最終用途各產業·各類型基板·不同製造流程·各產品·各地區的市場分析,再加上主要企業簡介等彙整資料,為您概述為以下內容。

第1章 序

  • 調查的說明
    • 市場區隔
  • 調查手法

第2章 摘要整理

第3章 3DIC市場概要

  • 簡介
  • 市場動態
  • 推動市場成長要素
    • 有效率解決方案的需求擴大
    • 可攜式設備數的增加
  • 阻礙市場成長要素
    • 高成本,熱及檢驗的問題
  • 市場機會
    • Big Data(巨量資料)與預測性分析
  • 趨勢與未來展望
    • 多晶片構裝
    • IntSim
  • 價值鏈分析
    • 購買物流
    • 營運
    • 出貨物流
    • 行銷,銷售及服務
  • 波特的五力分析
  • 技術概要
    • 從2.5DIC技術轉變到3DIC
    • 3DIC製造流程
    • 3DIC生產各階段的標準化問題
    • 專利申請
  • 市場魅力分析
  • 競爭分析
    • 主要企業的市場佔有率(%)

第4章 全球3DIC市場,最終用途各產業

  • 全球3DIC市場概要,最終用途各產業(%)
  • 家電產品用3DIC市場(100萬美元)
  • 資訊通訊技術用3DIC市場(100萬美元)
  • 運輸(汽車·航太)用3DIC市場(100萬美元)
  • 軍用3DIC市場(100萬美元)
  • 其他(生物醫學應用·研究開發)用3DIC市場(100萬美元)

第5章 全球3DIC市場,各類型基板

  • 全球3DIC市場概要,各類型基板(%)
  • 矽晶絕緣體(SOI)3DIC市場(100萬美元)
  • 散裝矽3DIC市場(100萬美元)

第6章 全球3DIC市場,不同製造流程

  • 全球3DIC市場概要,不同製造流程(%)
  • 電子束再結晶3DIC市場(100萬美元)
  • 晶圓鍵合技術(連接)3DIC市場(100萬美元)
  • 矽磊成長3DIC市場(100萬美元)
  • 固相結晶3DIC市場(100萬美元)

第7章 全球3DIC市場,各產品

  • 全球3DIC市場概要,各產品(%)
  • 微機電(MEMS)·感測器3DIC市場(100萬美元)
  • RF SiP 3DIC市場(100萬美元)
  • 光電·成像3DIC市場(100萬美元)
  • 記憶體(3D堆疊)3DIC市場(100萬美元)
  • Logic3DIC市場(100萬美元)
  • HB LED 3DIC市場(100萬美元)

第8章 全球3DIC市場,各地區

  • 全球3DIC市場概要,各地區(%)
  • 北美的3DIC市場(100萬美元)
  • 歐洲的3DIC市場(100萬美元)
  • 亞太地區的3DIC市場(100萬美元)
  • 其他地區的3DIC市場(100萬美元)

第9章 企業簡介(企業概要,業績概要,產業策略,最近的趨勢)

  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • XILINX, Inc.
  • The 3M Company
  • STATS ChipPAC Ltd.
  • Tezzaron Semiconductor Corporation
  • United Microelectronics Corporation
  • Ziptronix, Inc.
  • Elpida Memory(Micron Technology, Inc.)
  • MonolithIC 3D Inc.

圖表

目錄

This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.

The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments.

Apart from the detailed sub-segment analysis as mentioned below, this report also provides company profiles of key market players. The competitive profiling of these players includes company and financial overview, business strategies adopted by them, and their recent developments which can help in assessing competition in the market. Major companies included in this report are Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc., 3M Company, Micron Technology Inc., (Elpida Memory Inc.), Ziptronix, Inc., Tezzaron Semiconductor Corporation, MonolithIC 3D Inc., STATS ChipPAC Ltd. and United Microelectronics Corporation (UMC).

This report analyzes the global 3D ICs market in terms of revenue (USD million). The market has been segmented as follows:

3D ICs Market, By End-Use Sectors:

  • Consumer electronics
  • Information and communication technology
  • Transport (automotive and aerospace)
  • Military
  • Others(Biomedical applications and R&D)

3D ICs Market, By Substrate Type:

  • Silicon on insulator(SOI)
  • Bulk Silicon

3D ICs Market, By Fabrication Process:

  • Beam re-crystallization
  • Wafer bonding
  • Silicon epitaxial growth
  • Solid phase crystallization

3D ICs Market, By Product:

  • MEMS and Sensor
  • RF SiP
  • Optoelectronics and imaging
  • Memories (3D Stacks)
  • Logic (3D Sip/Soc)
  • HB LED

3D ICs Market, By Geography:

  • North America
  • Europe
  • Asia Pacific
  • Rest of World (RoW)

Table of Contents

Chapter 1 - Preface

  • 1.1. Report description and scope
    • 1.1.1. Market segmentation
  • 1.2. Research methodology

Chapter 2 - Executive Summary

  • 2.1. Global 3D ICs market snapshot, 2012 & 2019
  • 2.2. Global 3D ICs market, 2011 - 2019 (USD million)

Chapter 3 - 3D ICs Market Overview

  • 3.1. Introduction
  • 3.2. Market dynamics
    • 3.2.1. Drivers
      • 3.2.1.1. Growing demand for efficient solutions
      • 3.2.1.2. Rise in number of portable devices
    • 3.2.2. Restraints
      • 3.2.2.1. High cost, thermal and testing issues
    • 3.2.3. Opportunities
      • 3.2.3.1. Big Data and predictive analytics
  • 3.3. Trends and future outlook
    • 3.3.1. Multi-chip packaging
    • 3.3.2. IntSim
  • 3.4. Value chain analysis
    • 3.4.1. Inbound logistics
    • 3.4.2. Operations
    • 3.4.3. Out-bound logistics
    • 3.4.4. Marketing, sales and services
  • 3.5. Porter's five forces analysis
    • 3.5.1. Bargaining power of suppliers
    • 3.5.2. Bargaining power of buyers
    • 3.5.3. Threat of substitutes
    • 3.5.4. Threat of new entrants
    • 3.5.5. Degree of competition
  • 3.6. Technology overview
    • 3.6.1. Shift to 3D IC from 2.5D IC technology
    • 3.6.2. 3D IC fabrication processes
    • 3.6.3. Standards issues at different levels of 3D IC production
    • 3.6.4. Patent filings
  • 3.7. Market attractiveness analysis
  • 3.8. Competitive analysis
    • 3.8.1. Market share of key players, 2012 (%)

Chapter 4 - Global 3D ICs Market, by End-Use Industry

  • 4.1. Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
  • 4.2. Consumer electronics 3D ICs market, 2011 - 2019 (USD million)
  • 4.3. Information and communication technology 3D ICs market, 2011 - 2019 (USD million)
  • 4.4. Transport (automotive and aerospace) 3D ICs market, 2011 - 2019 (USD million)
  • 4.5. Military 3D ICs market, 2011 - 2019 (USD million)
  • 4.6. Others (Biomedical applications and R&D) 3D ICs market, 2011 - 2019 (USD million)

Chapter 5 - Global 3D ICs Market, by Substrate Type

  • 5.1. Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
  • 5.2. Silicon on insulator (SOI) 3D ICs market, 2011 - 2019 (USD million)
  • 5.3. Bulk silicon 3D ICs market, 2011 - 2019 (USD million)

Chapter 6 - Global 3D ICs Market, by Fabrication Process

  • 6.1. Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
  • 6.2. Beam re-crystallization 3D ICs market, 2011 - 2019 (USD million)
  • 6.3. Wafer bonding 3D ICs market, 2011 - 2019 (USD million)
  • 6.4. Silicon epitaxial growth 3D ICs market, 2011 - 2019 (USD million)
  • 6.5. Solid phase crystallization 3D ICs market, 2011 - 2019 (USD million)

Chapter 7 - Global 3D ICs Market, by Product

  • 7.1. Global 3D ICs market overview, by product, 2012 & 2019 (%)
  • 7.2. MEMS and sensors 3D ICs market, 2011 - 2019 (USD million)
  • 7.3. RF SiP 3D ICs market, 2011 - 2019 (USD million)
  • 7.4. Optoelectronics and imaging 3D ICs market, 2011 - 2019 (USD million)
  • 7.5. Memories (3D Stacks) 3D ICs market, 2011 - 2019 (USD million)
  • 7.6. Logic 3D SiP/SoC 3D ICs market, 2011 - 2019 (USD million)
  • 7.7. HB LED 3D ICs market, 2011 - 2019 (USD million)

Chapter 8 - Global 3D ICs Market, by Geography

  • 8.1. Global 3D ICs market overview, by geography, 2012 & 2019 (%)
  • 8.2. North America 3D ICs market, 2011 - 2019 (USD million)
  • 8.3. Europe 3D ICs market, 2011 - 2019 (USD million)
  • 8.4. Asia Pacific 3D ICs market, 2011 - 2019 (USD million)
  • 8.5. RoW 3D ICs market, 2011 - 2019 (USD million)

Chapter 9 - Company Profiles

  • 9.1. Taiwan Semiconductor Manufacturing Company, Ltd.
    • 9.1.1. Company overview
    • 9.1.2. Financial overview
    • 9.1.3. Business strategies
    • 9.1.4. Recent developments
  • 9.2. XILINX, Inc.
    • 9.2.1. Company overview
    • 9.2.2. Financial overview
    • 9.2.3. Business strategies
    • 9.2.4. Recent developments
  • 9.3. The 3M Company
    • 9.3.1. Company overview
    • 9.3.2. Financial overview
    • 9.3.3. Business strategies
    • 9.3.4. Recent developments
  • 9.4. STATS ChipPAC Ltd.
    • 9.4.1. Company overview
    • 9.4.2. Financial overview
    • 9.4.3. Business strategies
    • 9.4.4. Recent developments
  • 9.5. Tezzaron Semiconductor Corporation
    • 9.5.1. Company overview
    • 9.5.2. Financial overview
    • 9.5.3. Business strategies
    • 9.5.4. Recent developments
  • 9.6. United Microelectronics Corporation
    • 9.6.1. Company overview
    • 9.6.2. Financial overview
    • 9.6.3. Business strategies
    • 9.6.4. Recent developments
  • 9.7. Ziptronix, Inc.
    • 9.7.1. Company overview
    • 9.7.2. Financial overview
    • 9.7.3. Business strategies
    • 9.7.4. Recent developments
  • 9.8. Elpida Memory, Inc. (Micron Technology, Inc.)
    • 9.8.1. Company overview
    • 9.8.2. Financial overview
    • 9.8.3. Business strategies
    • 9.8.4. Recent developments
  • 9.9. MonolithIC 3D Inc.
    • 9.9.1. Company overview
    • 9.9.2. Financial overview
    • 9.9.3. Business strategies
    • 9.9.4. Recent developments

List of Figures

  • FIG. 1: Global 3D ICs market, 2011 - 2019 (USD million) and Y-o-Y growth (%)
  • FIG. 2: Global smartphone and tablet shipment forecast, 2010 - 2015 (million units)
  • FIG. 3: Value chain analysis
  • FIG. 4: Porter's five forces analysis
  • FIG. 5: Market attractiveness analysis, by end-use sectors, 2012
  • FIG. 6: Market share of key players, 2012 (%)
  • FIG. 7: Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
  • FIG. 8: Consumer electronics 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 9: Information and communication technology 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 10: Transport (automotive and aerospace) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 11: Military 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 12: Others (Biomedical applications and R&D) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 13: Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
  • FIG. 14: Silicon on insulator (SOI) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 15: Bulk silicon 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 16: Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
  • FIG. 17: Beam re-crystallization 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 18: Wafer bonding 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 19: Silicon epitaxial growth 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 20: Solid phase crystallization 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 21: Global 3D ICs market overview, by product, 2012 & 2019 (%)
  • FIG. 22: MEMS and sensors 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 23: RF SiP 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 24: Optoelectronics and imaging 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 25: Memories (3D Stacks) 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 26: Logic 3D SiP/SoC 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 27: HB LED 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 28: Global 3D ICs market overview, by geography, 2012 & 2019 (%)
  • FIG. 29: North America 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 30: Europe 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 31: Asia Pacific 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 32: RoW 3D ICs market, 2011 - 2019 (USD million)
  • FIG. 33: Taiwan Semiconductor Manufacturing Company, Ltd. annual revenues, 2010 - 2012 (USD billion)
  • FIG. 34: Xilinx, Inc., annual revenues, 2010 - 2012 (USD billion)
  • FIG. 35: 3M Company annual revenues, 2010 - 2012 (USD billion)
  • FIG. 36: STATS ChipPAC Ltd., annual revenues, 2010 - 2012 (USD million)
  • FIG. 37: United Microelectronics Corporation annual revenues, 2010 - 2012 (USD billion)
  • FIG. 38: Micron Technology, Inc., annual revenues, 2010 - 2011 (USD billion)

List of Tables

  • TABLE 1: 3D ICs market segmentation
  • TABLE 2: Global 3D ICs market snapshot, 2012 & 2019
  • TABLE 3: Impact analysis of drivers
  • TABLE 4: Comparison for 2D and 3D designs for low density parity check (LDPC) code decoder
  • TABLE 5: Impact analysis of restraint
  • TABLE 6: Overview of different 3D IC fabrication processes
  • TABLE 7: Issues at different levels of 3D IC
  • TABLE 8: Patents by companies
  • TABLE 9: Geographical distribution of patents
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