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市場調查報告書
無線晶片組的評價
Assessment of Wireless Chipsets
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無線晶片組的評價 是由出版商Technical Insights, Inc.在2007年12月所出版的。
這份英文市場調查報告書價格從美金6000起跳。
此報告書記載了關於被使用在Mobile WiMAX、HSPA、UMB、802.11n等所謂次世代無線技術上的各式各樣晶片組的概要，同時也提供了企業與開發業者直接面臨的課題、主要應用以及潛在的區塊等內容。報告書之內容摘要如下所示。
第1章 摘要
第2章 晶片組的概要與無線技術的概略
第3章 產業環境分析
第4章 無線晶片組•區段的主要開發：主要專利、主要企業的聯絡處
- 創新的可編程序之單一處理程序、薄膜、行動電話晶片組、功率放大技術
- HiveFlex SCP2000：Silicon Hive BV
- 高性能合成器與薄膜：Kaben Wireless Silicon
- 矽鍺功率放大器：SiGe Semiconductors
- 捷頻無線晶片：Terocelo Inc.
- 應用於M2M、汽車的可重組式無線微處理器：Wavecom
- 次世代無線通訊解決方案：Qualcomm
- WiMAX SoC：OFDMA改革者；Runcom
- 針對家庭用網路，以802.11n為基礎的晶片組：Metalink Ltd
- 對應Wave 2的WiMAX晶片組：Beceem Comunications
- 對應Wave 2的WiMAX SoC：ApaceWave Technologies
- 行動TV晶片組
- 單晶片RF調整器與解調器：Newport Media
- 多模態行動TV SoC：MediaPhy
第5章 決策用資料庫
Abstract
This Frost & Sullivan research service titled Assessment of Wireless Chipsets
provides an in-depth analysis of the problems and technical developments
surrounding wireless chipsets as well as the factors effecting its adoption.
This research service looks at the impact of new wireless technologies in
industrial/commercial and residential sectors through key drivers, influencing
market factors and challenges, backed by stakeholder and patent analysis to
identify the complex role of wireless chipsets and its future trends.
Classified under wireless communication requirements, the study focuses on
wireless protocols that encompass wireless technologies such as WiMAX,
802.11n, Mobile TV and 3G standards. The study also profiles new developments
in RF chipsets such as, programmable wireless enabled microprocessors and
innovative filters.
Table of Contents
1. EXECUTIVE SUMMARY
Research Overview
- Snapshot of Wireless Chipsets
- Research Findings
Scope and Methodology
- Research Scope
- Methodology
2. CHIPSET PRIMER AND WIRELESS TECHNOLOGIES PROFILED
Chipset Primer
- Overview
- Wireless Communications and Chipsets
Profiled Technologies
- Voice-Centric Wireless Technologies
- Data-Centric Wireless Technologies
3. ANALYSIS OF THE INDUSTRY ENVIRONMENT
Industry Trends and Challenges
- Trends and Drivers
- Technology Challenges
Application Analysis and Insights
- Application and Opportunity Analysis
- Analyst Insights and Recommendations
4. KEY DEVELOPMENTS IN THE WIRELESS CHIPSETS SECTOR; KEY PATENTS ; KEY CONTACTS
Innovative Programmable Signal Processors;Filters;Cellular Chipsets and Power Amplifier Technologies
- HiveFlex CSP2000 from Silicon Hive BV
- High Performance Synthesizers and Filters from Kaben Wireless Silicon
- Silicon Germanium Power Amplifiers from SiGe Semiconductors
- Frequency Agile Radio Integrated Chip from Terocelo Inc.
- Reconfigurable Wireless Microprocessor for M2M and Automotive Applications
from Wavecom
- Next Generation Wireless Communications Solutions from Qualcomm
802.11n and WiMAX Chipsets
- WiMAX SoC from OFDMA Innovator; Runcom
- 802.11n-Based Chipset for Home Networking from Metalink Ltd
- Wave 2-Compliant WiMAX Chipset from Beceem Communications
- Wave 2-Compliant WiMAX SoC from ApaceWave Technologies
Mobile TV Chipsets
- Single Chip RF Tuner and Demodulator from Newport Media
- Multimode Mobile TV SoC from MediaPhy
5. DECISION SUPPORT DATABASE
Decision Support Tables
Key Contacts
- Internet Penetration--World (2002 to 2012)
- Cellular and RF Component Chipset Vendors
- PDA Sales--World (2002 to 2012)
- WiMAX; 802.11n and Mobile TV Chipset Vendors
- Portable PC Installed Base--World (2002 to 2012)
- Semiconductor Equipment--World (2002 to 2012)
- Internet Subscribers--World (2002 to 2012)
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