全球電子／晶片封裝最新動向

全球電子／晶片封裝最新動向 是由出版商Technical Insights, Inc.在2007年12月所出版的。 這份英文市場調查報告書價格從美金6000起跳。

簡介

目錄

Abstract

The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.

Table of Contents

1 EXECUTIVE SUMMARY

• Scope and Methodology
  • Scope
  • Methodology
• Research Overview and Key Findings
  • Research Overview
  • Key Findings

2 CHIP PACKAGING--TECHNOLOGY OUTLOOK

• Technology Evolution in the Silicon IC Industry
  • Introduction to Chip Packaging Technologies
  • Growth Patterns in the Silicon IC Industry
• Advanced Chip Packaging -- Technology Primer
  • System in Package (SiP)
  • System on Chip (SoC)
  • Stacked Die Packages
  • Stacked Packages
  • Multi-Chip Module (MCM)
  • SoC versus SiP
• Adoption Factors for the Chip Packaging Industry
  • Industry Challenges
  • Technology Drivers and Restraints

3 TECHNOLOGY ENABLERS FOR CHIP PACKAGING

• Wafer and Surface Mount Technologies
  • Trends in the Wafer Industry--Evolution of SOI
  • Advances in Surface Mount Devices Placement Technology
• Interconnect Technologies and Signal Integrity
  • Interconnects--Technologies and Processes
  • Signal Integrity and Modeling--Issues and Challenges

4 TECHNOLOGY DEVELOPMENT AND ADOPTION POSTURES IN CHIP PACKAGING INDUSTRY

• Technology Trends
  • 3D Integration--Winning Edges and Technology Gaps
  • Evaluation of the Technology Development Chain
  • 3D Integration--Adoption Factors
• 3D Integration Industry Trends; Analyst Insights
  • Industry Outlook on 3D Integration
  • Analyst Insights

5 NOTEWORTHY DEVELOPMENT INITIATIVES IN THE CHIP PACKAGING INDUSTRY

• Innovative Chip and Board Packaging Technologies--World
  • Innovative Interconnect Technologies for IC Packaging--USA
  • Innovative SiP-Based Multiradio Solution--USA
  • Integrated Modular Board Technology-Finland
• Signal Integrity and IP Developments--World
  • Advanced High-Speed Metallic Interconnects--USA
  • Flexible Modeling Solutions for High-Speed Interconnects--Germany
  • High-Speed Field Solutions for Next Generation IC Packages-- USA
  • Electromagnetic Band-Gap Technology for Noise Suppression in Packages--USA
  • High-Speed Design Tools for Signal Integrity--USA

6 KEY PATENTS AND CONTACTS IN THE CHIP PACKAGING INDUSTRY

• Key Patents Related to this Sector
  • Patents I
  • Patents II
• Key Contacts
  • Corporate Contacts
  • Universities and Research Labs

7 DECISION SUPPORT DATABASE

• Decision Support Database Tables
  • Electronic Components Contribution to Electronics Industry--World (2002 to 2012)
  • Semiconductor and Semiconductor Equipment Market--World (2002 to 2012)
  • Manufacturing Enterprises--World (2002 to 2012)
  • Contribution of Manufacturing Industry to GDP--World (2002 to 2012)
  • Number of Service Enterprises--World (2002 to 2012)
  • PCB Sales--World (2002 to 2012)
  • Consumer Electronics Contribution to the Electronics Industry (Percentage)--World (2002 to 2012)

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