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市場調查報告書

熱電介面材料最新動向

Advances in Thermal Interface Materials

出版商 Technical Insights, Inc.
出版日期 2007年12月 商品編碼 58621
內容資訊 英文  
價格
US $ 6000 Web Access (Regional License)
US $ 6500 Hard Copy & Web Access (Regional License)


熱電介面材料最新動向 是由出版商Technical Insights, Inc.在2007年12月所出版的。 這份英文市場調查報告書價格從美金6000起跳。

簡介

本報告書內容包括:熱電介面材料領域在北美、歐洲及日本的技術開發動向、應用動向等。內容綱要摘記如下:

第1章 實施概要

  • 調查範圍・調查方法
  • 概要

第2章 熱電介面材料介紹(北美及歐洲)

  • 熱電介面材料概要
    • 理想介面
    • 熱電介面材料種類
    • 溫度及電子設備的血管
    • 熱管理性能模擬
  • 熱電介面材料市場動向及刺激因素
    • Moore's law帶動的小型化發展動向
    • LED技術
    • 作為主要指標的市場刺激因素

第3章 可能的最新熱電介面材料及流程技術之採用(北美、歐洲)

  • 熱電介面材料選擇
    • 熱電介面材料種類
    • 熱電介面材料的優缺點
  • 填補間隙熱電介面材料
  • 熱傳導接着剤
  • 熱傳導潤滑油
  • 電力絕緣熱電介面材料
  • 變更介面材料
  • 高性能熱電介面材料

第4章 熱電介面材料技術及最新應用動向(北美、歐洲、亞洲)

  • 應用課題
    • 熱電介面材料適合各種用途
    • 因應新一代用途的新一代型熱電介面材料
  • 微處理器及電腦中的熱電介面材料
  • 應用於航太工業的熱電介面材料
  • LED熱電介面
  • 其他應用

第5章 熱電介面材料技術的最新動向及市場評價(北美、歐洲)

  • 熱電介面材料的最新動向
  • 新一代型熱電介面材料的開發動向
  • 熱電介面材料策略最新動向
  • 熱電介面材料應用策略的最新動向

第6章 專利及專有名詞

第7章 參考表格

目錄

Abstract

This research service talks about technology developments in the field of thermal interface materials.

Table of Contents

1 EXECUTIVE SUMMARY

  • Scope and Methodology
    • Scope
    • Methodology
    • Thermal Interface Materials Webwatch Directory
  • Overview
    • Overview
    • Global Technology Highlights (North America; Europe)

2 ADVANCED THERMAL INTERFACE MATERIALS INTRODUCTION (NORTH AMERICA; EUROPE)

  • Thermal Interface Materials Overview
    • The Ideal Interface
    • Types of Thermal Interface Materials
    • Temperature and Electronic Device Failure
    • Thermal Management Performance Simulation
  • Thermal Interface Materials Market Trends and Drivers
    • Miniaturization Trends Follow Moore' s Law
    • Trendsetting LED Illumination Technology
    • Leading Indicator Market Drivers

3 ENABLING MATERIAL AND PROCESS TECHNOLOGY ADOPTION IN ADVANCED THERMAL INTERFACE MATERIALS (NORTH AMERICA; EUROPE)

  • Thermal Interface Material Options
    • Types of Thermal Interface Materials
    • TIM Advantages and Disadvantages
  • Gap Filler Thermal Interface Materials
    • Gap Fillers Defined
    • Sheet or Putty Gap Filler
    • Ultrasoft Gap Filler Materials
  • Thermally Conductive Adhesives
    • TIM Adhesives
    • Loctite Bead-on-Bead Thermally Conductive Adhesive
    • High-Thermal Conductivity Adhesive
  • Thermally Conductive Grease
    • Thermal Grease Performance
    • Dow Corning' s New Thermally Conductive Grease
  • Electrically Insulative TIM
    • Electrical Properties of TIM
    • Electrically Nonconductive Thermal Pastes
    • Laird Technologies Thermally Conductive Insulating Material
  • Phase Change Materials
    • Phase Change Thermal Interface Materials
    • Screen Printable Phase Change Material
  • High-Performance Thermal Interface Materials
    • Carbon and Graphite Advances TIM Development
    • Carbon Nanotube Array Thermal Interface

4 ADVANCES IN THERMAL INTERFACE MATERIAL TECHNOLOGY AND APPLICATIONS (NORTH AMERICA; EUROPE; AND ASIA)

  • Application Challenges
    • Thermal Interface Materials Meet a Range of Application Challenges
    • Next Generation TIMs to Meet the Challenges of Next Generation Applications
  • TIM in Microprocessor and Computer Related Applications
    • Intel' s Santa Rosa Platform; Merom CPU uses PSH-TIM
    • Desktop and Server Processor Thermal Solutions
  • Thermal Interface Applications in Aerospace
    • Novel PC-TIM on Hubble Repair Mission
    • NASA' s Space Shuttle Infrared Camera uses Gap Filler (TIM)
  • LED Thermal Interface Applications
    • LEDs and Heat Build-up Protection
    • LEDs for Automotive Headlights
  • Other Thermal Interface Applications
    • Metallic TIMs for Power and RF Semiconductors
    • Stock-Shaped TIM for Transistors

5 ADVANCE IN THERMAL INTERFACE MATERIAL TECHNOLOGY AND MARKET ASSESSMENT (NORTH AMERICA; EUROPE)

  • Advances in Thermal Interface Materials
    • Academic Research Advances in Thermal Interface Materials
    • Thermal Interface Materials Business Dynamics
  • Advances in Development of Next Generation Thermal Interface Materials
    • Next Generation TIM Consortium
    • CTRC Cooperative Research Center
  • Advances in Thermal Interface Material Strategies
    • Dow Corning Electronics' Move into Fabricated TIM
    • Thermal Management a Top Priority at Henkel Loctite
  • Advances in Thermal Interface Application Strategies
    • Chomerics' Cross Market TIM Application Development Focus
    • Universal Science Sees Strong Growth in LED Thermal Management

6 PATENTS AND GLOSSARY

  • Key Patents Listing
    • Advances in Thermal Interface Materials Related Patents-United States
    • Advances in Thermal Interface Materials Related Patents-European and World
  • Advances in Thermal Interface Materials Glossary and Additional Plastics Resources
    • Advances in Thermal Interface Materials Glossary
    • Additional Plastics Resources

7 CRITICAL REFERENCE TABLES

  • Database Tables
    • Global PCB Sales (2002 to 2012)
    • Electronic Components Percentage Distribution (2002 to 2012)
    • Total PC Installed Base (2002 to 2012)
    • Total Pigment Production (2002 to 2012)
    • Total Number of Households (2002 to 2012)
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