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市場調查報告書

SMD(表面貼裝設備)安裝的最新動向

Emerging Trends in SMD Placement

出版商 Technical Insights, Inc.
出版日期 2007年09月 商品編碼 56999
內容資訊 英文  
價格
US $ 6000 Web Access (Regional License)
US $ 6500 Hard Copy & Web Access (Regional License)


SMD(表面貼裝設備)安裝的最新動向 是由出版商Technical Insights, Inc.在2007年09月所出版的。 這份英文市場調查報告書價格從美金6000起跳。

目錄

Abstract

This research service focuses on the latest trends in surface mount device (SMD) placement system and its relevant technologies.

Table of Contents

1 EXECUTIVE SUMMARY

  • Scope and Methodology
    • Scope
    • Methodology
  • Research Overview and Key Findings
    • Research Overview
    • Key Findings

2 SURFACE MOUNT DEVICE ASSEMBLY

  • Technology Snapshot
    • The Emergence of SMD Assembly Process
    • Overview of the SMD Assembly Process
  • SMD Performance and Components
    • Factors that Influence SMD Assembly
    • SMD Assembly Components

3 SMD PLACEMENT SYSTEMS

  • Types of SMD Placement Designs
    • Overview
    • Turret-Style Systems
    • Pick and Place Systems
    • Multistation Systems
  • Summary and Key Companies
    • Summary
    • Key Players in this Sector

4 EMERGING TRENDS AND ISSUES IN SMD PLACEMENT

  • Placement Technology
    • Modular Design Using Parallel Placement
    • Vision Systems
    • Placement Optimization Issues
    • Placement Head Technology
  • Related Technologies and Issues
    • Standardization
    • Supporting Miniaturization (01005)
    • New Packaging and Board Technologies
    • Problems of Lead-Free Solder
    • Rework Technologies

5 KEY DEVELOPMENTS RELATED TO THE SMD SECTOR

  • Global Developments in Placement Machine Technology
    • Hybrid Pick and Place Machine--Netherlands
    • Handling Capability and Speedpack Upgrade to a Series--Netherlands
    • New MG-2 Chipshooter for M Series--Netherlands
    • Upgrades in X Series--Netherlands
    • Linear Motor Driven AdVantis XS--USA
    • Lightning Placement Technology--USA
    • Gold Dual-Lane and Black Midrange Electric Tape Feeder--USA
    • World' s First Parallel 2D/3D Inspection--Germany
    • New D-Series Placement Machines--Germany
    • Boosting the Capability of Siplace through Acquisitions--Germany
    • Linear Motors in High Speed HLX Series--Germany
  • Global Developments Affecting Placement Technology
    • StencilQuick Rework Solution--USA
    • Fully-Hermetic Plastic Packaging--USA
    • Assembléon and Yamaha Intelligent Machinery Partnership--Germany and Japan
    • New Solder Ball Feeder Equipment--UK

6 KEY CONTACTS AND SELECTED PATENTS

  • Key Contacts
    • Industry
    • Academics
  • Selected Patents
    • Patents I
    • Patents II

7 DECISION SUPPORT DATABASE

  • Decision Support Database Tables
    • World OLED Revenues (2002 to 2012)
    • Global Semiconductor and Semiconductor Equipment Market (2002-2012)
    • Percentage of Electronic Components Contribution to Electronics Industry (2002-2012)
    • Consumer Electronics Contribution to Electronics Industry--2002 to 2012
    • Global HB-LED Sales for Lighting (USD Million) 2002-2013
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