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市場調查報告書
晶片互相連接技術的進步
Advances in Chip Interconnect Technologies
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晶片互相連接技術的進步 是由出版商Technical Insights, Inc.在2011年09月所出版的。
這份英文市場調查報告書價格從美金6500起跳。
本報告提供晶片的互相連接(線路)技術的研究開發活動最新趨勢相關分析，新技術的有效利用·整合(無線光學奈米技術·3D)，及影響技術進步的評估，新技術的多方面評估(性能·趨勢·市場能力等)內容，為您概述為以下內容。
技術現況和趨勢
- 有效利用無線光學奈米技術的互相連接技術和3D技術的整合
- 技術價值鏈:各階段相關的實例和說明
影響的評估與分析
- 技術加速因素對市場的影響:新的互相連接技術主要的促進因素
- 技術變化對市場的影響:新的互相連接技術主要課題
- 加入市場的主要企業及技術創新
引進週期及需求的評估
機會的評估與路徑規劃
- 方案模擬和新興市場
- 技術·利用領域發展藍圖
- 新的互相連接技術的使用機會的評估
- 技術管理策略
主要的契約
主要的專利
附錄A:層級分析法
附錄B:共同實施
關於Frost＆Sullivan
Abstract
This research service assesses the role of new interconnect technologies for
electronics applications. On-chip interconnect technologies such as those
interconnects based on optical links, wireless communication, nanotechnology
or 3D integration, are evaluated in the research service. The emergence of
novel interconnect technologies is expected to bring significant advantages to
electronic devices allowing for increased speed, lower power consumption and
enhanced reliability. The capabilities, technology trends and market readiness
of emerging interconnect technologies have been assessed. Opportunity for
different interconnect technologies are evaluated using a multiple criteria
decision making tool called analytic hierarchy process.
Table of Contents
Technology Snapshot and Trends
- Chip Interconnect Technologies: Overview of Optical, Wireless,
Nanotechnology-based Interconnect and 3D Integration Technologies
- Technology Value Chain: Description of Each Stage of the Value Chain with
Examples
Impact Assessment and Analysis
- Market Impact of Technology Accelerators: Description of Key Drivers of
Novel Interconnect Technologies
- Market Impact of Technology Challenges: Description of Key Challenges of
the Novel Interconnect Technologies
- Key Industry Participants and Technology Innovations
Adoption Cycle and Needs Assessment
- Technology Adoption Cycle
- Demand Side Analysis
Opportunity Evaluation and Road mapping
- Scenario Modeling and Emerging Opportunities
- Technology/Application Roadmap
- Evaluation of Opportunities For New Interconnect Technologies
- Technology Management Strategies
Key Contacts
Key Patents
Appendix A - Analytical Hierarchy Process
Appendix B - Collaborative Initiatives
About Frost & Sullivan
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