Abstract
Physical Analysis of the Device
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
The market for RF MEMS in cell phone finally emerges with the first Wispry
antenna tuner in high volume production! RF MEMS switches and variable
capacitors are on the verge of being the next very big market for the MEMS
industry.
Manufactured by IBM, Wispry MEMS element is a network of 32 variable
capacitors, integrated in a plastic package (3x2x1mm) with a laminate
substrate.
This report provides complete teardown of the inertial MEMS with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. Around this main line System Plus Consulting developed a complete range of services and costing tools to provide in-depth production cost studies and estimation of the objective selling price of the product.
Table of Contents
Glossary
1. Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
2. Wispry Company Profile
- Wispry Profile
- Wispry Business Model
3. Samsung Focus Flash Teardown
4. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package X-Ray
- Device Structure
- Die Dimensions
- Die Markings
- Die Bond Pads
- Die- Fonctions
- Package Cross-Section
- ASIC Cross-Section
- ASIC Process Characteristics
- MEMS Interconnect - Cross Section
- MEMS Beam - Cross Section
- MEMS Cap - Cross Section
- MEMS Bumping
- Physical Data Summary
5. Manufacturing Process Flow
- Global Overview
- ASIC & MEMS Process Flow
- Description of the Wafer Fabrication Unit
- MEMS Sensor Process Flow
- Description of the MEMS Wafer Bumping Fabrication Unit
- MEMS Wafer Bumping Process Flow
6. Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Yields Hypotheses
- Die per wafer & Probe Test
- ASIC Front-End: Hypotheses
- ASIC Front-End Cost
- MEMS Front-End: Hypotheses
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Back-End 0: Bumping & Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End 1: Packaging Cost
- Back-End 1: Final test Cost
- Component Cost (FE + BE 0 + BE 1)
7. Estimated Price Analysis
- Definition of Prices
- Manufacturer Financial Ratios
- Estimated Manufacturer Price
- Estimated Selling Price
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