SensorDynamics的六個自由度慣性感測裝置(6 DoF IMU)「SD746」:3D加速感應器+3D陀螺儀:逆向成本分析 是由出版商System Plus Consulting在2011年09月所出版的。
這份英文市場調查報告書價格從美金3890起跳。
SensorDynamics(Maxim Integrated Products的其中一個部門)的「SD746」，是針對Kionix制3D加速感應器，組合3D陀螺儀與組合信號調節電路，製成6 x 6 x 1.2mm的QFN包裝的一體化IMU(慣性測量單位)。「SD746」IMU是產業及消費者導向應用程式用的開發產品。
本報告提供SensorDynamics的六個自由度慣性感測裝置(6 DoF IMU)「SD746」調查分析，「SD746」的卸載分析，材料分析，製造流程，縝密的經濟分析，製造成本的明細，價格估計分析等彙整資料，附上照片和圖表詳細說明，為您概述為以下內容。
第1章 概要/簡介
第2章 企業簡介
- SensorDynamics
- Kionix
- ST Microelectronics
第3章 物理的分析
- 物理分析的手法
- 包裝分析
- ASIC分析
- 陀螺儀分析
- 陀螺儀的斷面圖
- 陀螺儀流程特徵
- Kionix加速感應器分析
- 加速感應器結構
- 加速感應器的斷面圖
- 加速感應器流程特徵
第4章 製造流程
- ASIC的流程
- 陀螺儀的流程
- 加速感應器的流程
- 晶圓製造裝置的說明
第5章 成本分析
- 成本分析的組成
- 供應鏈分析
- ASIC晶圓的成本
- ASIC晶粒的成本
- 陀螺儀晶圓的成本
- 陀螺儀晶粒的成本
- 加速感應器晶圓/晶粒的成本
- SD746包裝成本
- SD746零件製造成本
第6章 製造商價格評估分析
Abstract
Physical Analysis of the Device
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling PriceDistributed
System Plus Consulting is proud to publis the reverse costing report on the
SD746 MEMS from Sensor Dynamics, a division of Maxim Integrated Products.
The SD746 combines a 3D accelerometer (manufactured by Kionix) with a 3D
gyroscope and signal conditioning circuitry in a 6x6xl.2 mm3 QFN package.
The SD746 IMU is designed for use in industrial and consumer applications.
This report provides complete teardown inertial MEMS with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. Around this main line System Plus Consulting developed a complete range of services and costing tools to provide in-depth production cost studies and estimation of the objective selling price of the product.
Table of Contents
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
2. Company Profiles
3. Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package X-Ray
- Package Composition
- Package Opening & Bonding Number
- Package Cross-Section
- ASIC Markings
- ASIC Dimensions
- ASIC Minimal Dimension and Metal Layers
- ASIC Transistor Details
- ASIC Process Characteristics
- Gyroscope Markings
- Gyroscope Dimensions
- Gyroscope Details
- Gyroscope Structure
- Gyroscope Cross-Section
- Gyroscope process characteristics
- Accelerometer Markings
- Accelerometer Dimensions
- Accelerometer Details
- Accelerometer Structure
- Accelerometer Cross-Section
- Accelerometer process characteristics
4. Manufacturing Process Flow
- Overview
- ASIC Process Flow
- Gyroscope Process Flow
- Accelerometer Process flow
- Description of the Wafer Fabrication Units
5. Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Yields Explanation
- ASIC Wafer Cost Hypothesis
- ASIC Wafer Cost
- ASIC Probe & Dicing cost
- ASIC Die Cost
- Gyroscope Wafer Cost Hypothesis
- Gyroscope Wafer Cost
- Gyroscope Wafer : Equipment Cost per Family
- Gyroscope Wafer : Material Cost per Family
- Gyroscope Probe, Dicing Cost
- Gyroscope Die cost
- Accelerometer
- SD746 Packaging Cost
- SD746 Final Test Cost
- SD746 Component Manufacturing Cost
- Yield Synthesis
- SD746 Cost Analysis Evolution
6. Estimated Manufacturer Price Analysis
- Manufacturers financialratios
- Estimated manufacturerPrice
Conclusion
Glossary
