VTI的3軸MEMS陀螺儀「CMR3000」:逆向成本分析 是由出版商System Plus Consulting在2011年07月所出版的。
這份英文市場調查報告書價格從美金3630起跳。
大小為4.1x3.1x0.83mm的CMR3000，是最小的3軸陀螺儀消費者。使用VTI的3軸MEMS技術所生產的微機電系統音叉陀螺儀，是以c-SOI晶圓（內嵌式空心SOI）來MEMS化，以進行晶圓構裝。ASIC晶片是在MEMS感應器下進行覆晶構裝（VTI的Chip-on-MEMS技術），這個構裝的封裝高度非常低。CMR3000是用於手機、遊戲機、電腦周邊機器以及遙控器，等以電池為供電來源的機器上。
本報告提供VTI Technologies的3軸MEMS陀螺儀「CMR3000」的相關調查分析，彙整「CMR3000」的拆卸分析，材料分析，製造流程，嚴密的經濟分析，製造成本的分類，價格估計分析等，再加上詳細的照片及圖表解說等，為您概述為以下內容。
詞彙
概要/簡介
VTI的企業簡介
物理的分析
- 物理分析的手法
- 構裝的特徵&標註
- 構裝的X光相片
- 構裝的斷面圖
- ASIC的各種因素
- ASIC的標註
- ASIC的主要模塊
- ASIC的斷面圖
- ASIC流程特徵
- 微機電(MEMS)的各種因素
- 微機電(MEMS)的導孔(Vias)
- 微機電(MEMS)感應器
- 微機電(MEMS)感應器(埋藏式)
- 微機電(MEMS)的蓋子
- 微機電(MEMS)的斷面圖
- 微機電(MEMS)流程特徵
- 物理資料摘要
製造流程
- 概要
- ASIC/微機電(MEMS)/包裝流程
- 晶圓製造裝置的解說
成本分析
- 成本分析的組成
- 經濟分析的主要階段
- 供應鏈分析
- 製造商的財務比率
- 產量比率解說
- 產量比率的假設
- ASIC前端成本
- ASIC後端0(探測器測試和切割)
- ASIC晶圓成本(前端+後端0)
- 微機電(MEMS)前端成本
- 流程中每個程序的微機電(MEMS)前端成本
- 微機電(MEMS)前端:以家庭為單位的設備成本
- 微機電(MEMS)前端:以家庭為單位的材料成本
- 後端0:包裝，探測器測試和切割成本
- 後端0流程中每個程序的成本
- 後端0:晶圓成本(前端+後端0)
- 後端1:最後檢驗&調整成本
- CMR3000零件成本(FE + BE 0 + BE 1)
價格估計分析
結論
Abstract
Physical Analysis of the Devices
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
System Plus Consulting is proud to publish the reverse costing report of the
new 3-axis consumer MEMS gyroscope supplied by VTI Technologies.
Featuring a 4.1x3.1x0.83mm size, the CMR3000 is the smallest 3-axis consumer
gyroscope. Manufactured with VTI 3D-MEMS technology, this tuning fork
capacitive gyroscope is bulk micromachined in a c-SOI wafer (SOI with buried
cavities) and wafer-level packaged. The ASIC chip is flip-chipped under the
MEMS sensor (VTI Chip-on-MEMS technology) allowing a very small package height.
The CMR3000 is targeted for battery operated devices like mobile phones,
gaming devices, computer peripheral and remote controllers.
This report provides complete teardown of the MEMS gyroscope with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized in the cost analysis of electronics from
semiconductor devices to electronic systems.
Around this main line System Plus Consulting developed a complete range of
services and costing tools to provide in-depth production cost studies and
estimation of the objective selling price of the product.
Table of Contents
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
VTI Company Profile
- Product Range
- Business Model
Physical analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package X-Ray
- Package Cross-Section
- ASIC Dimensions
- ASIC Markings
- ASIC Main blocks
- ASIC Cross-Section
- ASIC Process Characteristics
- MEMS Dimensions
- MEMS Vias
- MEMS Sensor
- MEMS Sensor (buried cavities)
- MEMS Cap
- MEMS Cross-Sections
- MEMS Process Characteristics
- Physical Data Summary
Manufacturing Process Flow
- Overview
- ASIC/MEMS/Packaging Process Flows
- Description of the Wafer Fabrication Units
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers financial ratios
- Yields Explanation
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 Cost (Probe Test and Dicing)
- ASIC Die Cost (Front End + Back End 0)
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- Back-End 0: Packaging, Probe Test and Dicing Cost
- Back-End 0 Cost per Process Steps
- Back-End 0: Die Cost (Front End + Back End 0)
- Back-End 1: Final Test & Calibration Cost
- CMR3000 Component Cost (FE + BE 0 + BE 1)
Estimated Price Analysis
Conclusion
