Abstract
The SEMI World Fab Forecast provides high level summaries, charts, and graphs;
in-depth analyses of capital expenditure, capacity, technology and products,
down to the detail of each fab; and forecasts for the next 18 months.
The database includes over 1,000 records of front-end fabs and foundries such
as TSMC, UMC, Chartered Semiconductor, SMIC, Samsung, Intel, AMD, Toshiba,
Micron Hynix, Powerchip, Texas Instruments, Renesas, Inotera, Elpida, STMicro,
Fujitsu, NEC Electronics, ProMOS, Nanya, Matsushita, NXP, Winbond, IBM Micro,
Sharp, Freescale, Infineon, Spansion, Magna Chip, X-Fab, and more.....
Benefits
These tools are invaluable for understanding the trends of the fabs, and
learning more about capex for construction projects, fab equipping, technology
level, and products.
With the World Fab Forecast report, you can conduct more efficient market
research, identify target customers, and analyze quarterly fab trends more
easily.
Highlights (World Fab Forecast - February 2011 edition)
- Equipment spending (new and used tools) for 2011 is expected to increase
by 28% to about $42.5B. Excluding Discrete fabs, spending will be about $39.5B.
- A glimpse into 2012 predicts equipment spending to decrease by about 4% to
$40.8B.
- Equipment spending share by segment is led by Memory with 36% share (down
from 43% in 2010) and Foundry with 33% share (up from 29% in 2010).
- In 2011, 45 facilities are expected to begin operation: 23 are for LED
fabs, seven for Foundries, three each for Memories, Logic, and Analog.
- Worldwide installed capacity (without Discretes) is expected to increase
about 9% in 2011 to 15.4M wafers per month (in 200mm equivalents) and increase
by another 7% in 2012.
- Most capacity increase in 2011 is for Foundries with 16% growth in 2011
and 11% in 2012, which builds out a worldwide Foundry capacity share from 25%
in 2010 to 29% in 2012.
- Top three companies adding the most installed capacity in 2011 are Hynix,
TSMC, and Globalfoundries. The same three lead for capacity additions in 2012
but not in the same order.
Methodology
World Fab Forecast is compiled from publicly available information, including
capital spending plans, announced fab plans and ream schedules. SEMI verifies
this information by making up to 50 inquiries a week and periodic visits to
semiconductor companies.
Table of Contents
- Summary
- Graphs and Tables
- Construction Spending by Quarter by Region (in US$ Million)
- Equipment Spending by Quarter by Region (in US$ Million)
- Capacity by Quarter by Region (in 200 mm equivalent)
- Capacity by Product Type 2 by Quarter (in 200 mm equivalent)
- Capacity by Geometry by Quarter (in 200 mm equivalent)
- Fabs with Construction Spending by Region by Quarter (count of fabs)
- Fabs with Equipment Spending by Region by Quarter (count of fabs)
- Capacity for all 200 mm Fabs by Quarter by Region (in 200 mm equivalent)
- 200 mm Volume Fabs by Region by Quarter (count of fabs)
- Capacity for All 300 mm Fabs by Quarter by Region (in 200 mm equivalent)
- 300 mm Volume Fabs by Region by Quarter (count of fabs)
- Equip Spending for all 300mm Fabs by Quarter by Region (in US$ Million)
- Company Detail
- Company Name
- Ownership (parent companies)
- Joint Venture Partners
- City
- State/Province
- Country
- Country/Region
- Region
- Origin
- Address
- Zip
- Phone
- Fax
- Website
- Fab Name
- FabType
- Probability
- Status
- Project Type
- Start Year
- Close Year
- Close Date
- Product Type
- Product Type (2)
- Products
- Technology
- Discrete Yes/No
- Current Geometry
- Current Wafer size
- Full Capacity
- Cleanroom Class
- Cleanroom Sq Ft
- Facility Size
- Begin Work
- Construction Start
- Project Stop Date
- Project Restart
- Install_Equip (date)
- First Silicon (date)
- Production (date)
- Total Cost (M$)
- Construction Cost (M$)
- Equip Cost (M$)
- Wafer Capacity (next 6 quarters and previous 6 quarters)
- Equiv 200 mm Wafer Capacity ((next 6 quarters and previous 6 quarters)
- Wafer size (next 6 quarters and previous 6 quarters)
- Geometry (next 6 quarters and previous 6 quarters)
- Geometry Group (next 6 quarters and previous 6 quarters)
- Construction Spending (next 6 quarters and previous 6 quarters)
- Equipment Spending (next 6 quarters and previous 6 quarters)
- Equipment Comment
- Fab Comment
- Change Made
- New Record
- Change Comment
- Fab History
- Spending by Region
- Spending by Company
- Cap by Country/Region
- Cap SICAS Alignment
- Capacity by Company
- Cap by Foundries
- Cap by Wafer size in 2008, 2007, 2006
- Cap by Product Type 2008, 2007, 2006
- Cap by Geometry 2008, 2007, 2006
- Definitions, Other Reports
Note: denotes new fields added starting with the May 2008 edition.
