The SEMI® WWSEMS report provides monthly data from 1991 to 2010 of the global
equipment bookings for 22 categories in North America, Japan, Europe, Korea,
Taiwan, China and Rest of World. Japanese headquartered companies provide
inputs through SEMI' s partner, the Semiconductor Equipment Association of
Japan (SEAJ).
Table of Contents
The data includes the following equipment categories:
Total Equipment
Mask/Reticle Equipment
Wafer Manufacturing Equipment
Wafer Processing Equipment
Expose & Write Equipment
Resist Processing Equipment
Etch Equipment
Surface Conditioning/Clean & Dry Equipment
Thermal Processing Equipment
Ion Implant Equipment
CVD Equipment
Sputter Equipment
Other Deposition Equipment
Inspection & Measurement Equipment
CMP Equipment
Other Wafer Processing Equipment
Assembly & Packaging Equipment
Fab Facilities Equipment
Total Test Equipment
SOC & Logic Test Equipment
Memory Test Equipment
Handlers*
Test Related
*Note: The “Handlers” category was added in 2007.
Tabs of spreadsheet
2007 Bookings
2007 Billings
2006 Bookings
2006 Billings
1996 Shipments
1993 Shipments
1992 Shipments
1991 Shipments
Note: Shipment data are only included for the period of 1991 - 1996.
