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市場調查報告書
全球半導體晶圓生產設備資料庫：FabFutures
FabFutures - Details of Frontend Semiconductor Fabs that are Planning to Spend for Construction and Equipping.
| 出版商 |
SEMI |
| 出版日期 |
2011年11月 |
商品編碼 |
52253 |
| 內容資訊 |
英文 |
| 價格 |
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全球半導體晶圓生產設備資料庫：FabFutures 是由出版商SEMI在2011年11月所出版的。
這份英文市場調查報告書價格從美金2000起跳。
身為半導體、FPD、MEMS、奈米科技相關生產設備・材料產業的國際工會，也從事該領域市場調査及統計活動的SEMI（總公司：California State），出版了與全球半導體晶圓生產設備相關資料的資料庫 "FabFutures" 。
本資料庫針對全球200家以上的工廠進行調查分析，內容包括各工廠製造產品的類別・工廠類型・計畫類型・製造晶圓尺寸・製 造幾何變數、過去2季及未來6季的工廠建設成本及設備成本變化及預測、設備建置・第一道矽晶製造・量產化後的製造規模實況及預測等。以Excel形式展現的內容綱要摘記如下：
調查對象企業
- Intel
- AMD
- Chartered Semiconductor
- Crolles 2
- Flash Alliance
- Hynix
- IM Flash
- HHNEC
- MagnaChip
- Powerchip
- ProMOS
- Qimonda
- Renesas
- Samsung
- SemIndia
- SMIC
- Texas Instrument
- 東芝
- TSMC
- UMC
- X-Fab
資料庫内容
- 企業
- 所有權
- 市/省/州/國家/地區
- 收益性
- 狀態
- 工廠類型
- 計畫類型
- 產品類型
- 類比
- 數位
- 離散元件
- 晶圓
- Logic
- 記憶體
- MEMS
- MPU
- 其他
- 技術
- 晶圓尺寸
- 12" (300 mm)
- 8" (200 mm)
- 6" (150 mm)
- 4" (100 mm)
- 2" (50 mm)
- 幾何變數
- 製造容量
- 工廠建設成本
- 設備成本
- 設備安裝日
- 第一道矽晶開始日
- 製造開始日
- 每季的工廠建設成本
- 工廠建設相關建議
- 每季的設備投資
- 設備相關建議
- 每季的晶圓容量
- 每季的幾何變數
Abstract
Fab details by quarter, 2 years of data, including the next 6 quarters, for
over 200 fabs with major capital expenditures
The full version of FabFutures contains over 200 records and features details
by company in over 34 categories covering two years of data - past two
quarters and projecting the next six quarters. This Excel-formatted database
is conveniently delivered electronically.
Benefits:
With FabFutures, you can conduct more efficient market research, identify
target customers, analyze construction and capacity, and ramp trends more
easily.
- Details and summary of cost for construction and equipment spending by fab
- Graphical interface gives a strategic view and timeline of spending with
key project milestone dates.
- Dynamic range of information and quick-and-easy access to valuable data
that empowers your market research
Features the following detailed worksheets:
- Summary
- Fab Timeline
- Fabs in Construction
- Fabs Equipping
- First Silicon
- Fabs that will begin volume production
- Company Detail
- Summary Graphical Analysis
- Fab by Region
- 300mm Fabs
- Fabs by Geometry
- Fabs by Product
- New Construction Summary
- Equipment Spending Summary
- Definition page
Methodology:
FabFutures is compiled from publicly available information, including capital
spending plans, announced fab plans and ream schedules. SEMI verifies this
information by making up to 50 inquiries a week and periodic visits to
semiconductor companies.
Table of Contents
- Company: The database includes listing of global semiconductor
wafer fabs including the following fabs: Intel, AMD, Chartered
Semiconductor, Crolles 2, Flash Alliance, Hynix, IM Flash, HHNEC, MagnaChip,
Powerchip, ProMOS, Qimonda, Renesas, Samsung, SemIndia, SMIC, Texas
Instrument, Toshiba, TSMC, UMC,X-Fab
- Ownership- Short Name
- City/State/Province/Country/Region
- Probability
- Status
- Fab Type
- Project Type
- Product Type: Analog, Discrete, Foundry, Logic, Memory, MEMS, MPU,
others
- Technology
- Wafer Size: 12" (300 mm), 8" (200 mm), 6" (150 mm), 4" (100 mm),
2" (50 mm)....
- Geometry: (45nm, 65nm, 90nm,.......)
- Full Capacity
- Construction Cost
- Equipment Cost
- Start Date of Equipment
- Start Date 1st Silicon
- Start Date of Production
- Construction Costs by Quarter
- Construction Comments
- Equipment Spending by Quarter.
- Equipment Comments
- Wafer Capacity by Quarter
- Geometry by Quarter
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