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市場調查報告書

FabFutures:半導體前端晶圓廠的設備投資資料庫

FabFutures - Details of Frontend Semiconductor Fabs that are Planning to Spend for Construction and Equipping

出版商 SEMI 商品編碼 52253
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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FabFutures:半導體前端晶圓廠的設備投資資料庫 FabFutures - Details of Frontend Semiconductor Fabs that are Planning to Spend for Construction and Equipping
出版日期: 2017年05月31日 內容資訊: 英文
簡介

本資料庫,提供半導體前端晶圓廠的工廠建設、設備投資狀況及計劃的相關調查,製造產品類型、晶圓廠類型、計劃類型、製造晶圓尺寸、製造幾何學等的各種資料,晶圓廠建設成本及設備投資額的變化與預測,最初矽製造、量產開始等的計劃彙整。

調查對象企業範例

  • TSMC
  • UMC
  • GLOBALFOUNDRIES
  • SMIC
  • Samsung
  • Intel
  • 東芝
  • Micron
  • SK Hynix
  • Powerchip
  • Texas Instruments
  • Renesas
  • STMicro
  • 富士通
  • Nanya
  • Panasonic
  • NXP
  • Winbond
  • Sharp Corp
  • NXP
  • Infineon
  • Magna Chip
  • X-Fab Silicon Foundries

資料庫內容

  • 摘要
  • 晶圓廠時間軸
  • 建設中的晶圓廠
  • 晶圓廠設備
  • 最初矽
  • 量產化開始預定的晶圓廠
  • 企業詳細內容
  • 地區分析:摘要
  • 晶圓廠:各地區
  • 300mm晶圓廠
  • 晶圓廠:幾何學
  • 晶圓廠:各產品
  • 新建設:摘要
  • 設備投資:摘要等

企業資料

  • 企業
  • 所有權
  • 所在地
  • 盈利
  • 現狀
  • 晶圓廠類型
  • 計劃類型
  • 產品類型
  • 技術
  • 晶圓尺寸
  • 幾何學
  • 製造容量
  • 建設成本
  • 設備成本
  • 設備運作日
  • 最初矽開始日
  • 製造開始日
  • 晶圓廠建設成本:各季
  • 晶圓廠建設相關評論
  • 設備投資成本:各季
  • 設備相關評論
  • 晶圓生產能力:各季
  • 幾何學:各季

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: 278

The SEMI FabFutures contains over 200 records and features company-specific details for over 34 categories, covering two years of data projecting up to 22 months. This database focuses on future fabs that have committed to capital expenditure. Similar to the World Fab Watch, the report includes interactive pivot charts and tables enabling you to customize your own view and reports. report provides high level summaries, charts, and graphs; in-depth analyses of capital expenditure, capacity, technology and products, down to the detail of each fab; and forecast over six quarters. The report includes over 1,000 records of front-end semiconductor fabs and foundries such as TSMC, UMC, GLOBALFOUNDRIES, SMIC, Samsung, Intel, Toshiba, Micron, SK Hynix, Powerchip, Texas Instruments, Renesas, STMicro, Fujitsu, Nanya, Panasonic, NXP, Winbond, Sharp, NXP, Infineon, Magna Chip, X-Fab Silicon Foundries, and many more.

This report is essentially is a combination of the Fab Construction Monitor, which focuses on fabs that have construction plans and the Fab Equipment Monitor, which focuses on fabs equipping expenditures.

Methodology

FabFutures is compiled from publicly available information, including capital spending plans, announced fab plans and ream schedules. SEMI verifies this information by making up to 50 inquiries a week and periodic visits to semiconductor companies.

Benefits

With the FabFutures report you can conduct more efficient market research and easily identify target customers, analyze construction and capacity, and ramping trends.

  • Quarterly updates
  • Details and summary of cost for construction and equipment spending by fab
  • Graphical interface gives a strategic view and timeline of spending with key project milestone dates
  • Dynamic range of information and quick-and-easy access to valuable data that empowers your market research

Table of Contents

Content (tabs of spreedsheet)

  • Summary
  • Fab timeline
  • Fabs in construction
  • Fabs equipping
  • First silicon
  • Fabs that will begin volume production
  • Company detail
  • Summary graphical analysis
  • Fabs by region
  • 300mm Fabs
  • Fabs by geometry
  • Fabs by product
  • New construction summary
  • Equipment spending summary
  • Definition page

Fields in Company Detail tab:

  • Company
  • Ownership Short Name
  • City/State/Province/Country/Region
  • Probability
  • Status
  • Fab Type
  • Project Type
  • Product Type
  • Technology
  • Wafer Size
  • Geometry
  • Full Capacity
  • Construction Cost
  • Equipment Cost
  • Start Date of Equipment
  • Start Date 1st Silicon
  • Start Date of Production
  • Construction Costs by Quarter
  • Construction Comments
  • Equipment Spending by Quarter
  • Equipment Comments
  • Wafer Capacity by Quarter
  • Geometry by Quarter
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