Silicon Reclaim Wafer Characterization Summary (Report)
|出版日期||內容資訊||英文 24 Pages
|全球再生矽晶圓市場:市場趨勢·價格的預測 Silicon Reclaim Wafer Characterization Summary (Report)|
|出版日期: 2016年03月01日||內容資訊: 英文 24 Pages||
This analysis covers the 2015 silicon wafer reclaim for the semiconductor market and provides a forecast to 2017. Reclaim is defined as the removal of several microns of the silicon wafer and subsequent re-polishing of the wafer surface.
Seven regions of the world are covered in this report including North America, Japan, Europe, Korea, Taiwan, China, and Rest of World (ROW). All market size estimates reflect U.S. dollars at current exchange rates. Market estimates for reclaim wafers include semiconductor applications including equipment and IC manufacturing markets.
Two methodologies were used in the development of this information. First, major suppliers were interviewed and contacted for the purpose of this analysis. A questionnaire, which summarizes all of the desired information, was developed and sent to all of the suppliers. Of the companies contacted, 17 responded representing 94 percent of the 2015 market by revenue.