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市場調查報告書

全球印刷電路板 (PCB) 產業分析

Global PCB Industry Report, 2015-2020

出版商 ResearchInChina 商品編碼 367799
出版日期 內容資訊 英文 191 Pages
商品交期: 最快1-2個工作天內
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全球印刷電路板 (PCB) 產業分析 Global PCB Industry Report, 2015-2020
出版日期: 2016年08月26日 內容資訊: 英文 191 Pages
簡介

全球印刷電路板 (PCB) 市場,2014年達到570億美元的規模 (與前一年同期比較減少4.4%) 。市場縮小的原因,是日元、歐元、新台幣對美金貶值,及行動電話、PC市場低迷等。整體低迷情形目前預計將繼續,不過,汽車用PCB的需求擴大,及配合iPhone 7S/8開發、銷售的基板型HDI (高密度實裝線路)的開發等,今後也能看到成長趨勢。

本報告提供全球印刷電路板 (以下PCB) 產業相關分析,全球整體及主要國家的產量的變化和未來趨勢,相關市場 (下游工程:行動電話、太陽能發電面板等)的趨勢與其影響,全球整體/中國國內的大供應商的排行榜,主要供應商簡介等的調查評估。

第1章 全球PCB市場、產業

  • 全球PCB產量 (1980∼2001年)
  • 全球PCB產量、成長率 (2001∼2016年)
  • PCB產業的價值鏈
  • 全球PCB產量:各技術 (2000∼2020年)
  • 全球PCB產量:各生產地點 (過去4年份)
  • 全球PCB產量:各企業總公司所在地 (過去4年份)
  • 台灣的PCB產業的收益額、成長率 (過去5年份)
  • 台灣的PCB產業的產量:各技術 (過去5年份)
  • 日本的PCB產業的生產量、產量:各技術 (最新值)
  • 日本的PCB產業的產量:各類型

第2章 全球PCB的下游工程市場

  • 全球行動電話市場近幾年的動靜
  • 中國的行動電話市場:最新趨勢
  • 中國的行動電話市場分析
  • 手機用PCB趨勢
  • 基板型的HDI (高密度實裝線路)
  • 全球主要HDI供應商前十大企業:市場收益額
  • Apple的PCB供應商
  • Huawei的PCB供應商
  • BBK (OPPO &Vivio) 的PCB供應商
  • 全球平板電腦出貨台數 (總計7年份)
  • 全球筆記型電腦出貨台數 (總計10年份)
  • 太陽能發電面板的引進
  • 主要的太陽能發電面板企業的市場佔有率 (過去10年份)
  • 汽車用PCB的概要
  • 汽車用PCB的主要供應商前20大企業

第3章 全球PCB供應商

  • 全球主要PCB供應商 (第1∼56名)
  • 全球主要PCB供應商 (第57∼103名)
  • 全球主要PCB供應商的祖先報酬率、營業利潤率 (過去2年份)
  • 軟式電路板 (FPCB)的主要供應商前15家公司 (以金額為準,過去2年份)
  • IC電信業者的主要供應商前十大企業 (以金額為準,過去2年份)
  • 中國的PCB企業 (國內)的排行榜:前1∼25名
  • 中國的PCB企業 (國內)的排行榜:前26∼50名
  • 中國的PCB企業 (國內)的排行榜:前51∼75名
  • 中國的PCB產業的排行榜:前1∼23名
  • 中國的PCB產業的排行榜:前24∼47名
  • 中國的PCB產業的排行榜:前48∼72名
  • 中國的PCB產業的排行榜:前73∼100名

第4章 主要PCB供應商一覽

  • ZDT
  • TTM
  • Unimicron
  • COMPEQ
  • Tripod Technology
  • HannStar Board
  • Nan Ya PCB
  • Chin-Poon Industrial
  • Gold Circuit Electronics
  • Meiko
  • AT&S
  • CMK
  • IBIDEN
  • T.P.T
  • DAEDUCK
  • SIMMTECH
  • LG INNOTEK
  • SEMCO
  • Unitech
  • Dynamic
  • Ellington
  • WUS Printed Circuit
  • Shennan Circuit
  • Kinwong
  • Fastprint
  • Founder PCB
  • Wuzhu Technology
  • ISU PETASYS
  • KBC
目錄
Product Code: ZYW228

‘Global PCB Industry Report, 2015-2020’ highlights the followings:

  • 1. Global PCB Market and Status Quo of the Industry
  • 2. Global Downstream Markets of PCB
  • 3. Mobile Phone PCB Trends
  • 4. Tablet PC/Laptop Computer/Automotive PCB Trends
  • 5. Ranking of Global and Chinese PCB Vendors
  • 6. Study of Major Global and Chinese PCB Vendors

Global PCB market was valued at USD57 billion in 2015, a 4.4% decline from 2014, largely due to: 1) depreciation of Japanese yen, euro, and NTD against the dollar; 2) stagnation in saturated mobile phone market, continuous decline in PC market, and a plunge in tablet PC market. The sluggish demand from downstream markets has extended to 2016 and it is expected there will be no substitute for smartphone to drive PCB market until the year 2020. Global PCB industry is projected to keep shrinking in 2016 with a market size of USD55.3 billion (a 3.0% contraction).

Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate.

The biggest change in PCB industry in 2017 will be wider application of substrate like. According to Apple's suppliers, iPhone 7S/8 to be launched in 2017 will see some substantial upgradings in specification with substrate-like HDI replacing commonly-used HDI so as to massively import System in Package (SiP) technology with the aim of modularizing sub-system.

Compared with traditional HDI, the biggest change in the specification of substrate-like HDI is the line space/width on circuit board which moves toward fine pitch in order to work properly with SiP technology. Particularly, the line space/width must be miniaturized below 35 micrometers. In such case, traditional PCB HDI process cannot meet technical requirements on fine pitch, and large sums of money are needed to upgrade manufacturing equipment and re-explore production processes. By contrast, IC substrate vendors can easily produce such PCB, showing overwhelming superiority.

According to Apple's suppliers, for iPhone 7S/8 to be launched in 2017, the original one large traditional HDI board will be disassembled into four small substrate-like HDI boards, thus not only speeding up import of SiP technology but also freeing up more space for larger battery capacity. Apple has asked suppliers to send samples in the third quarter, attracting IC substrate vendors including Ibiden, Kinsus, and Unimicron to scramble for orders. However, it now seems that Kinsus, a key SiP board supplier for Apple, has the best chance of winning substrate-like HDI order, and ASE Group is likely to grab SiP packaging & testing order.

Global Top10 HDI Vendors in 2015 by Revenue

Source: Global PCB Industry Report, 2015-2020 by ResearchInChina.

Table of Contents

1. Global PCB Market and Industry

  • 1.1. Global PCB Output Value, 1980-2001
  • 1.2. Global PCB Output Value and Growth Rate, 2001-2016
  • 1.3. PCB Industry Chain
  • 1.4. Global PCB Output Value by Technology, 2000-2020E
  • 1.5. Global PCB Output Value by Place of Production, 2013-2016
  • 1.6. Global PCB Output Value by Corporate Headquarters, 2012-2016
  • 1.7. PCB Industry Revenue and Growth Rate in Taiwan, 2011-2016
  • 1.8. PCB Output Value in Taiwan by Technology, 2013-2016
  • 1.9. PCB Output and Output Value in Japan by Technology, 2015 & 2016
  • 1.10. PCB Output Value in Japan by Type

2. Global Downstream Markets of PCB

  • 2.1. Recent Development of Global Mobile Phone Market
  • 2.2. Chinese Mobile Phone Market, 2016Q2
  • 2.3. Chinese Mobile Phone Market Analysis
  • 2.4. Mobile Phone PCB Trends
  • 2.5. Substrate-like HDI
  • 2.6. Global Top10 HDI Vendors by Revenue, 2015
  • 2.7. PCB Suppliers for Apple, 2015 (%)
  • 2.8. PCB Suppliers for Huawei, 2015 (%)
  • 2.9. PCB Suppliers for BBK (OPPO &Vivio), 2015 (%)
  • 2.10. Global Tablet PC Shipments, 2011-2017E
  • 2.11. Global Laptop Computer Shipments, 2008-2017E
  • 2.12. Introduction to Photovoltaic Panel
  • 2.13. Market Share of Major Photovoltaic Panel Companies, 2006-2015
  • 2.14. Introduction to Automotive PCB
  • 2.15. Top20 Automotive PCB Suppliers, 2013-2015

3. Global PCB Vendors

  • 3.1. Global Top100 PCB Vendors (1-56)
  • 3.2. Global Top100 PCB Vendors (57-103)
  • 3.3. Gross Margin and Operating Margin of Major Global PCB Vendors, 2014-2016
  • 3.4. Top15 FPCB Vendors by Revenue, 2014-2015
  • 3.5. Top10 IC Carrier Vendors by Revenue, 2014-2015
  • 3.6. Ranking in China's PCB Industry (Domestic-funded) (1-25), 2015
  • 3.7. Ranking in China's PCB Industry (Domestic-funded) (26-50), 2015
  • 3.8. Ranking in China's PCB Industry (Domestic-funded) (51-75), 2015
  • 3.9. Ranking in China's PCB Industry (1-23), 2015
  • 3.10. Ranking in China's PCB Industry (24-47), 2015
  • 3.11. Ranking in China's PCB Industry (48-72), 2015
  • 3.12. Ranking in China's PCB Industry (73-100), 2015

4. PCB Vendors

  • 4.1. ZDT
  • 4.2. TTM
  • 4.3. Unimicron
  • 4.4. COMPEQ
  • 4.5. Tripod Technology
  • 4.6. HannStar Board
  • 4.7. Nan Ya PCB
  • 4.8. Chin-Poon Industrial
  • 4.9. Gold Circuit Electronics
  • 4.10. MEIKO
  • 4.11. AT&S
  • 4.12. CMK
  • 4.13. IBIDEN
  • 4.14. T.P.T
  • 4.15. DAEDUCK
  • 4.16. SIMMTECH
  • 4.17. LG INNOTEK
  • 4.18. SEMCO
  • 4.19. Unitech
  • 4.20. Dynamic
  • 4.21. Ellington
  • 4.22. WUS Printed Circuit
  • 4.23. Shennan Circuit
  • 4.24. Kinwong
  • 4.25. Fastprint
  • 4.26. Founder PCB
  • 4.27. Wuzhu Technology
  • 4.28. ISU PETASYS
  • 4.29. KBC
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